US5761804A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic circuit and a method for fabricating the electronic circuit
Assignee: AUE Co Research Center
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Filing: 1995-10-20
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Granted: 1998-06-09
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Expires: 2015-10-20
Abstract
Abstract A method of assembling a shielded circuit of electronic components and loading them directly into a shell without arranging electronic components on a board. A hybridized electronic circuit, for example a rectifier circuit is made with a bottom shell formed from a transparent plastic, into which is loaded an electronic part. The bottom shell has a connector section as well as a slot which joins the terminals of the electronic components to a top shell also formed from the same plastic, and the various electronic components; the slots in the bottom shell is such that after the electronic component terminals are intersected they can be positioned; then after the electronic components are loaded, the top shell is placed as a cover, and the intersecting terminals as well as the electronic components are ultrasonically sealed at the same time.
Inventors
- 👤 Yoshio Adachi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 19:28
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/005; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
91 words
A method of fabricating an electronic circuit characterized by various electronic components comprising fabricating a bottom shell from an insulating plastic having slots to join connector sections and the terminals of the electronic components; setting the various electronic components on said bottom shell forming a top shell from an insulating plastic; covering the said bottom shell with said top shell; positioning intersecting terminals of the electronic components and forming the desired electronic circuit by simultaneously sealing the intersecting terminals of the various electronic components and the top and bottom shells ultrasonically.
Claim 2
Independent Claim
91 words
A method of fabricating an electronic circuit characterized by various electronic components comprising fabricating a bottom shell from an insulating plastic having slots to join connector sections and the terminals of the electronic components; setting the various electronic components on said bottom shell forming a top shell from an insulating plastic; covering the said bottom shell with said top shell; positioning intersecting terminals of the electronic components and forming the desired electronic circuit by simultaneously sealing the intersecting terminals of the various electronic components and the top and bottom shells ultrasonically.
Claim 3
Dependent Claim
32 words
The method of assembling an electronic circuit of claim 1 characterized by the fact that the above-mentioned bottom shell as well as the top shell are made from transparent or semi-transparent materials.
Claim 4
Independent Claim
92 words
The method of fabricating an electronic circuit characterized by an insulating plastic top shell as well as an electronic components loaded bottom shell having slots to join the connector sections and the terminals of the electronic components and the various electronic components loaded onto the said bottom shell or the top shell; said slots are set so that it is possible to intersect the terminals of the electronic components and after positioning the electronic components, ultrasonically joining the intersecting terminals of the various electronic components and thereby forming the desired electronic circuit.
Claim 5
Independent Claim
92 words
The method of fabricating an electronic circuit characterized by an insulating plastic top shell as well as an electronic components loaded bottom shell having slots to join the connector sections and the terminals of the electronic components and the various electronic components loaded onto the said bottom shell or the top shell; said slots are set so that it is possible to intersect the terminals of the electronic components and after positioning the electronic components, ultrasonically joining the intersecting terminals of the various electronic components and thereby forming the desired electronic circuit.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-08 | 2001-12-08 | 2002-06-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-08 | 2005-12-08 | 2006-06-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-08 | 2009-12-08 | 2010-06-09 | $7700.00 | Window Closed / Lapsed |