US5761043A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Daughter card assembly
Assignee: Morgan Stanley and Co LLC
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Filing: 1996-02-22
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Granted: 1998-06-02
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Expires: 2016-02-22
Abstract
Abstract A daughter card assembly which provides relatively high conductive heat transfer from the electronic components on the daughter board to either an air or liquid cooled cold plate of a computer circuit module. The daughter card assembly has a daughter board with a plurality of electronic elements carried on an element side of the board. The opposite side of the board is a cooling side. The daughter board has one or more sockets which are electrically connected to the electronic elements on the board. The socket is adapted to plug into a connector carried on a mother board of a circuit module. A thermally conductive plate is disposed adjacent to and in thermal conductive contact with the cooling side of the daughter board. The conductive plate has an inner side facing the circuit module and an outer side on the opposite side. The plate is adapted to be in thermal conductive contact with the module cold plate to dissipate heat generated by the memory elements. Preferably, the conductive plate is sandwiched between the cooling sides of a pair of daughter boards with one board abutting against the inner side and the other board abutting against the outer side of the plate.
Inventors
- 👤 Richard B. Salmonson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 13:06
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/20536; H05K7/20627; H05K7/20636; H05K7/20709; H05K7/20763; H05K7/20772
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
136 words
A daughter card assembly for connection to a computer circuit module having a printed circuit mother board mounted adjacent a module cold plate, said daughter card assembly comprising: a first daughter board having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, a thermally conductive plate having an inner side for facing said mother board and an outer side generally parallel to and opposite said inner side, wherein said cooling side of said daughter board is mounted essentially parallel to and in thermal communication with said conductive plate, said conductive plate being adapted to conductively transfer heat away from said daughter card assembly; and a thermal conductive shim sandwiched between said cooling side of said first daughter board and said conductive plate.
Claim 2
Dependent Claim
136 words
A daughter card assembly for connection to a computer circuit module having a printed circuit mother board mounted adjacent a module cold plate, said daughter card assembly comprising: a first daughter board having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, a thermally conductive plate having an inner side for facing said mother board and an outer side generally parallel to and opposite said inner side, wherein said cooling side of said daughter board is mounted essentially parallel to and in thermal communication with said conductive plate, said conductive plate being adapted to conductively transfer heat away from said daughter card assembly; and a thermal conductive shim sandwiched between said cooling side of said first daughter board and said conductive plate.
Claim 3
Dependent Claim
86 words
The daughter card assembly of claim 1 further including a second daughter board mounted to said conductive plate and having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, wherein said cooling side of said first daughter board is in thermal communication with said inner side of said conductive plate and said cooling side of said second daughter board is in thermal conductive contact with said outer side of said conductive plate.
Claim 4
Dependent Claim
54 words
The daughter card assembly of claim 2 further including a thermal conductive shim sandwiched between said inner side of said conductive plate and said cooling side of said first daughter board and a thermal conductive shim sandwiched between said outer side of said conductive plate and said cooling side of said second daughter board.
Claim 5
Dependent Claim
36 words
The daughter card assembly of claim 1 further including a socket electrically connected to said electronic elements on said daughter board, said socket being adapted for electrically connecting said daughter card assembly to said mother board.
Claim 6
Dependent Claim
23 words
The daughter card assembly of claim 4 further including a pair of said sockets disposed at opposite ends of said daughter card assembly.
Claim 7
Dependent Claim
185 words
A daughter card assembly for connection to a computer circuit module having a printed circuit mother board mounted adjacent a module cold plate, said daughter card assembly comprising: first and second daughter boards each having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, a thermally conductive plate having an inner side for facing said mother board and an outer side generally parallel to and opposite said inner side, wherein said cooling side of said first daughter board is in thermal communication with said inner side of said conductive plate and said cooling side of said second daughter board is in thermal communication with said outer side of said conductive plate, said conductive plate being adapted to conductively transfer heat away from said daughter card assembly; a thermal conductive shim sandwiched between said cooling side of said first daughter board and said inner side of said conductive plate: and a thermal conductive shim sandwiched between said cooling side of said second daughter board and said outer side of said conductive plate.
Claim 8
Dependent Claim
185 words
A daughter card assembly for connection to a computer circuit module having a printed circuit mother board mounted adjacent a module cold plate, said daughter card assembly comprising: first and second daughter boards each having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, a thermally conductive plate having an inner side for facing said mother board and an outer side generally parallel to and opposite said inner side, wherein said cooling side of said first daughter board is in thermal communication with said inner side of said conductive plate and said cooling side of said second daughter board is in thermal communication with said outer side of said conductive plate, said conductive plate being adapted to conductively transfer heat away from said daughter card assembly; a thermal conductive shim sandwiched between said cooling side of said first daughter board and said inner side of said conductive plate: and a thermal conductive shim sandwiched between said cooling side of said second daughter board and said outer side of said conductive plate.
Claim 9
Dependent Claim
41 words
The daughter card assembly of claim 6 further including a socket electrically connected to said electronic elements on both of said first and second daughter boards, said socket being adapted for electrically connecting said daughter card assembly to said mother board.
Claim 10
Dependent Claim
35 words
The daughter card assembly of claim 6 wherein said conductive plate is adapted to contact said cold plate in a thermally conductive manner for transferring heat from said daughter card assembly to said cold plate.
Claim 11
Dependent Claim
198 words
A computer circuit module comprising: a mother board having a first surface, a plurality of electronic elements carried on said first surface, a second surface generally parallel to and disposed opposite said first surface, and a connector which projects from said second surface and is electrically connected to said electronic elements, a cold plate mounted adjacent and essentially parallel with said first surface, a daughter card assembly mounted adjacent and generally parallel with said second surface of said mother board, said daughter card assembly comprising: a first daughter board having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, a socket electrically connected to said electronic elements on said daughter board and coupled to said connector to electrically connect said daughter card assembly to said mother board, and a thermally conductive plate having an inner side and an outer side generally parallel to and disposed opposite said inner side, wherein said cooling side of said daughter board is mounted essentially parallel to and in thermal communication with said conductive plate, said conductive plate being adapted to carry away heat from said daughter card assembly.
Claim 12
Dependent Claim
198 words
A computer circuit module comprising: a mother board having a first surface, a plurality of electronic elements carried on said first surface, a second surface generally parallel to and disposed opposite said first surface, and a connector which projects from said second surface and is electrically connected to said electronic elements, a cold plate mounted adjacent and essentially parallel with said first surface, a daughter card assembly mounted adjacent and generally parallel with said second surface of said mother board, said daughter card assembly comprising: a first daughter board having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, a socket electrically connected to said electronic elements on said daughter board and coupled to said connector to electrically connect said daughter card assembly to said mother board, and a thermally conductive plate having an inner side and an outer side generally parallel to and disposed opposite said inner side, wherein said cooling side of said daughter board is mounted essentially parallel to and in thermal communication with said conductive plate, said conductive plate being adapted to carry away heat from said daughter card assembly.
Claim 13
Dependent Claim
86 words
The circuit module of claim 9 wherein said daughter card assembly further includes a second daughter board mounted to said conductive plate having an element side carrying thereon a plurality of electronic elements and a cooling side essentially parallel to and disposed opposite said element side, wherein said cooling side of said first daughter board is in thermal communication with said inner side of said plate and said cooling side of said second daughter board is in thermal communication with said outer side of said plate.
Claim 14
Dependent Claim
33 words
The circuit module of claim 10 further including a second daughter card assembly mounted adjacent said mother board and being coupled to a second connector on said second surface of said mother board.
Claim 15
Dependent Claim
31 words
The circuit module of claim 9 wherein said conductive plate contacts said cold plate in a thermally conductive manner for transferring heat from said daughter card assembly to said cold plate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-01 | 2001-12-01 | 2002-06-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-01 | 2005-12-01 | 2006-06-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-01 | 2009-12-01 | 2010-06-02 | $7700.00 | Window Closed / Lapsed |