US5757066A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Resin-molded type semiconductor device and method of manufacturing the same
Assignee: Toshiba Corp
•
Filing: 1996-03-25
•
Granted: 1998-05-26
•
Expires: 2016-03-25
Abstract
Abstract A resin sealed semiconductor device, wherein support pins uphold a pair of facing sides of the semiconductor chip. A projected portion is formed on the distal end portion of the support pin in proximate to the semiconductor chip. The projected portion is formed on both sides of the supporting members which respectively correspond to an upper side and a bottom side of the semiconductor chip in such a manner that when the projected portions are viewed from the upper side or bottom side of the semiconductor chip, they overlap with each other. All of the height of the projected portions are the same. The thickness of the resins formed on both opposite sides of the semiconductor chip is the same with each other, thus preventing the upward or downward displacement within the sealing resin of the semiconductor chip in a thin package.
Inventors
- 👤 Yumi Inoue
- 👤 Tsutomu Nakazawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:44
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W72/00; H10W72/30; H10W74/01; H10W74/016; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
105 words
A resin sealed semiconductor device comprising: a semiconductor chip; a plurality of supporting members, each having an upper surface, a lower surface and a distal end portion for supporting the semiconductor chip; an adhesive disposed between the distal end portions of said supporting members and a peripheral portion of said semiconductor chip; a plurality of leads; bonding wires for connecting the plurality of leads to electrodes of the semiconductor chip; a projected portion projecting from the upper surface and a projecting portion projecting from the lower surface of at least one of said plurality of supporting members; and a sealing resin covering said semiconductor chip.
Claim 2
Dependent Claim
105 words
A resin sealed semiconductor device comprising: a semiconductor chip; a plurality of supporting members, each having an upper surface, a lower surface and a distal end portion for supporting the semiconductor chip; an adhesive disposed between the distal end portions of said supporting members and a peripheral portion of said semiconductor chip; a plurality of leads; bonding wires for connecting the plurality of leads to electrodes of the semiconductor chip; a projected portion projecting from the upper surface and a projecting portion projecting from the lower surface of at least one of said plurality of supporting members; and a sealing resin covering said semiconductor chip.
Claim 3
Dependent Claim
25 words
The resin sealed semiconductor device according to claim 1, wherein said plurality of supporting members support a pair of opposite sides of the semiconductor chip.
Claim 4
Dependent Claim
26 words
The resin sealed semiconductor device according to claim 1, wherein said plurality of supporting members support a pair of diagonally opposed corners of the semiconductor chip.
Claim 5
Dependent Claim
24 words
The resin sealed semiconductor device according to claim 1, wherein said plurality of supporting members are formed only within an interior of the resin.
Claim 6
Dependent Claim
20 words
The resin sealed semiconductor device according to claim 1, wherein said plurality of supporting members protrude out of the resin.
Claim 7
Dependent Claim
29 words
The resin sealed semiconductor device according to claim 2, wherein said projected portions are formed on the supporting members supporting the pair of opposite sides of the semiconductor chip.
Claim 8
Dependent Claim
30 words
The resin sealed semiconductor device according to claim 3, wherein said projected portions are formed on the supporting members supporting the pair of diagonally opposed corners of the semiconductor chip.
Claim 9
Dependent Claim
23 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions are formed on each of the plurality of supporting members.
Claim 10
Dependent Claim
26 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions overlap each other when viewed from an upper side of the semiconductor chip.
Claim 11
Dependent Claim
18 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions have substantially the same height.
Claim 12
Dependent Claim
41 words
The resin sealed semiconductor device according to claim 1, wherein a thickness of the sealing resin formed on an upper side of the semiconductor chip has substantially the same thickness as the resin formed on lower side of the semiconductor chip.
Claim 13
Dependent Claim
27 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions are disposed at the distal end portion of the at least one supporting member.
Claim 14
Dependent Claim
20 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions are disposed only within the sealing resin.
Claim 15
Dependent Claim
27 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions have a height larger than a thickness of the at least one supporting member.
Claim 16
Dependent Claim
27 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions have a height smaller than a thickness of the at least one supporting member.
Claim 17
Dependent Claim
26 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions have a height smaller than a length or width of the projected portions.
Claim 18
Dependent Claim
23 words
The resin sealed semiconductor device according to claim 1, wherein said semiconductor chip has a thickness larger than a thickness of said leads.
Claim 19
Dependent Claim
26 words
The resin sealed semiconductor device according to claim 1, wherein said semiconductor chip has a thickness that is substantially equal to a thickness of said leads.
Claim 20
Dependent Claim
23 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions are integrally formed with the at least one supporting member.
Claim 21
Dependent Claim
41 words
The resin sealed semiconductor device according to claim 1, wherein said projected portion that projects from the upper surface extends upwardly and wherein said projected portion that projects from the lower surface projects downwardly from the at least one supporting member.
Claim 22
Dependent Claim
20 words
The resin sealed semiconductor device according to claim 20, wherein said adhesive and said projected portions comprise a conductive material.
Claim 23
Dependent Claim
20 words
The resin sealed semiconductor device according to claim 20, wherein said adhesive and said projected portions comprise an insulating material.
Claim 24
Dependent Claim
24 words
The resin sealed semiconductor device according to claim 20, wherein said adhesive comprises a conductive material and said projected portions comprise an insulating material.
Claim 25
Dependent Claim
24 words
The resin sealed semiconductor device according to claim 20, wherein said adhesive comprises an insulating material and said projected portions comprise a conductive material.
Claim 26
Dependent Claim
17 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions have a columnar shape.
Claim 27
Dependent Claim
17 words
The resin sealed semiconductor device according to claim 1, wherein said projected portions have a pyramidal shape.
Claim 28
Dependent Claim
31 words
The resin sealed semiconductor device according to claim 1, further comprising a bonding wire for connecting an electrode of said semiconductor chip to the distal end portion of said supporting members.
References Cited (Backward Citations)
US5635756A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-25 | 2001-11-24 | 2002-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-25 | 2005-11-24 | 2006-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-25 | 2009-11-24 | 2010-05-26 | $7700.00 | Window Closed / Lapsed |