Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
106 words
A method of selectively growing a compound semiconductor which includes first and second elements, said method comprising the steps of: preparing a substrate member which has a first portion covered with a mask and a second portion uncovered with said mask; preparing a metallic gallium as said first element, together with a reactive gas which includes a compound of said second element and at least one of amines bonded to said second element; and selectively depositing said compound semiconductor only on said second portion of the substrate without deposition of said compound semiconductor on said first portion, by using said reactive gas and said metallic gallium.
Claim 2
Independent Claim
106 words
A method of selectively growing a compound semiconductor which includes first and second elements, said method comprising the steps of: preparing a substrate member which has a first portion covered with a mask and a second portion uncovered with said mask; preparing a metallic gallium as said first element, together with a reactive gas which includes a compound of said second element and at least one of amines bonded to said second element; and selectively depositing said compound semiconductor only on said second portion of the substrate without deposition of said compound semiconductor on said first portion, by using said reactive gas and said metallic gallium.
Claim 3
Dependent Claim
13 words
A method as claimed in claim 1, wherein said second element is arsenic.
Claim 4
Dependent Claim
12 words
A method as claimed in claim 2, wherein said compound is trisdimethylaminoarsine.
Claim 5
Dependent Claim
27 words
A method as claimed in claim 3, wherein said substrate member is composed of a gallium arsenide substrate which provides said second portion uncovered with said mask.
Claim 6
Dependent Claim
21 words
A method as claimed in claim 4, wherein the mask is formed by a selected one of silicon dioxide and nitride.
Claim 7
Dependent Claim
65 words
A method as claimed in claim 1, wherein the substrate member preparing step comprises the steps of: preparing a substrate having a surface; forming an insulator on said surface of the substrate; selectively etching said insulator film to locally leave the insulator film as said mask and to provide said first and said second portions on said substrate and to thereby form said substrate member.
Claim 8
Dependent Claim
16 words
A method as claimed in claim 1, wherein the insulator film is composed of silicon dioxide.
Claim 9
Dependent Claim
83 words
A method as claimed in claim 1, wherein the substrate member preparing step comprises the steps of: preparing a substrate having a surface; forming an insulator film on said surface of the substrate; selectively etching said insulator film to locally leave the insulator as said mask and to form the first portion covered with said mask and an uncovered portion with said mask; etching the uncovered portion of the substrate to form the the second portion and to thereby provide said substrate member.
Claim 10
Dependent Claim
116 words
A method as claimed in claim 1, wherein the substrate member preparing step comprises the steps of: preparing a substrate having a surface; depositing a first compound semiconductor film on said surface; depositing, on said first compound semiconductor film, a second compound semiconductor film different from said first compound semiconductor film; selectively leaving said mask on said second compound semiconductor film with an uncovered portion of the second compound semiconductor film remaining on the first compound semiconductor film; and selectively etching said uncovered portion of the second compound semiconductor film to locally expose said first compound semiconductor film to form the second portion on the first compound semiconductor film and to thereby provide said substrate member.
Claim 11
Dependent Claim
27 words
A method as claimed in claim 9, wherein the first compound semiconductor film is composed of AlGaAs while the second compound semiconductor film is composed of GaAs.
Claim 12
Dependent Claim
24 words
A method as claimed in claim 1, further comprising the step of: emitting hydrogen radicals onto said substrate member during the selectively depositing step.
Claim 13
Dependent Claim
35 words
A method as claimed in claim 11, wherein said emitting step comprises the steps of: producing hydrogen molecules; resolving said hydrogen molecules into the hydrogen radicals; and guiding the hydrogen radicals onto said substrate member.
Claim 14
Dependent Claim
20 words
A method as claimed in claim 1, wherein said compound semiconductor is selectively deposited by a molecular beam epitaxy device.
Claim 15
Dependent Claim
23 words
A method as claimed in claim 13, wherein said metallic gallium is accommodated within a Knudsen cell of said molecular beam epitaxy device.