US5736790A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip, package and semiconductor device
Assignee: Toshiba Corp
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Filing: 1996-09-20
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Granted: 1998-04-07
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Expires: 2016-09-20
Abstract
Abstract Disclosed is a bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad. The bump has: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material. With another conductive bonding material provided on the other pad of a wiring substrate or a package, the ball of the bump of the semiconductor chip or the package is placed close to another pad of the wiring substrate or package. The conductive bonding material of the other pad is heated and melted to connect the ball and the other pad of the wiring substrate or package by the conductive bonding material.
Inventors
- 👤 Kiyoshi Iyogi
- 👤 Kaoru Koiwa
- 👤 Keiichi Yano
- 👤 Hironori Asai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 09:13
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0212; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09736; H05K2201/09745; H05K2201/10; H05K2201/10227; H05K2201/10234; H05K2201/10613; H05K2201/10954; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H10W72/251; H10W74/00; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
77 words
A bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad, comprising: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material.
Claim 2
Dependent Claim
77 words
A bump formed on a pad which is provided on either a semiconductor chip or a package or a wiring substrate for input or output thereof, for making electric connection on the pad, comprising: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material.
Claim 3
Dependent Claim
17 words
The bump according to claim 1, wherein the projection is formed in a cylindrical or annular shape.
Claim 4
Dependent Claim
15 words
The bump according to claim 1, wherein the projection is integrally formed with the pad.
Claim 5
Dependent Claim
17 words
The bump according to claim 1, wherein the height of the projection is at least 20 um.
Claim 6
Dependent Claim
14 words
The bump according to claim 1, wherein the conductive bonding material is a solder.
Claim 7
Dependent Claim
47 words
The bump according to claim 1, wherein the ball has an outer surface portion composed of a conductive material which is a metal or an alloy and which has a melting point being at least 60° C. higher than the melting point of the conductive bonding material.
Claim 8
Dependent Claim
22 words
The bump according to claim 1, wherein the ball has a core which is composed of a resin or an inorganic material.
Claim 9
Dependent Claim
73 words
A package having a bump which is formed on a pad for input or output of the package and used for making electric connection on the pad, the bump comprising: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material.
Claim 10
Dependent Claim
73 words
A package having a bump which is formed on a pad for input or output of the package and used for making electric connection on the pad, the bump comprising: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material.
Claim 11
Dependent Claim
15 words
The package according to claim 8, wherein a base material of the package is ceramics.
Claim 12
Dependent Claim
22 words
The package according to claim 9, wherein the ceramics is selected from the group consisting of aluminium nitride, alumina and silicon nitride.
Claim 13
Dependent Claim
75 words
A semiconductor chip having a bump which is formed on a pad for input or output of the semiconductor chip and used for making electric connection on the pad, the bump comprising: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material.
Claim 14
Dependent Claim
75 words
A semiconductor chip having a bump which is formed on a pad for input or output of the semiconductor chip and used for making electric connection on the pad, the bump comprising: a projection projecting from the pad; a ball having conductivity and located above the pad; and a conductive bonding material for bonding the pad for and the ball, wherein creep strength of the ball is larger than strength of the conductive bonding material.
Claim 15
Dependent Claim
105 words
A semiconductor device having: a package to which a semiconductor chip is mounted; a wiring substrate; at lease one pair of pads for input or output which are provided on the package and the wiring substrate, respectively; and a connecting portion for connecting said pair of pads, wherein the connecting portion comprises: a projection projecting from at least one of said pair of pads; a ball having conductivity and located between said pair of pads; and a conductive bonding material for bonding said pair of pads and the ball, in which creep strength of the ball is larger than strength of the conductive bonding material.
Claim 16
Dependent Claim
105 words
A semiconductor device having: a package to which a semiconductor chip is mounted; a wiring substrate; at lease one pair of pads for input or output which are provided on the package and the wiring substrate, respectively; and a connecting portion for connecting said pair of pads, wherein the connecting portion comprises: a projection projecting from at least one of said pair of pads; a ball having conductivity and located between said pair of pads; and a conductive bonding material for bonding said pair of pads and the ball, in which creep strength of the ball is larger than strength of the conductive bonding material.
Claim 17
Dependent Claim
19 words
The semiconductor device according to claim 12, wherein the projection is formed on the pad provided on the package.
Claim 18
Dependent Claim
98 words
A semiconductor device having: a semiconductor chip; a package; at least one pair of pads for input or output which are provided on the semiconductor chip and the package, respectively; and a connecting portion for connecting said pair of pads, wherein the connecting portion comprises: a projection projecting from at least one of said pair of pads; a ball having conductivity and located between said pair of pads; and a conductive bonding material for bonding said pair of pads and the ball, in which creep strength of the ball is larger than strength of the conductive bonding material.
Claim 19
Dependent Claim
98 words
A semiconductor device having: a semiconductor chip; a package; at least one pair of pads for input or output which are provided on the semiconductor chip and the package, respectively; and a connecting portion for connecting said pair of pads, wherein the connecting portion comprises: a projection projecting from at least one of said pair of pads; a ball having conductivity and located between said pair of pads; and a conductive bonding material for bonding said pair of pads and the ball, in which creep strength of the ball is larger than strength of the conductive bonding material.
Claim 20
Dependent Claim
19 words
The semiconductor device according to claim 14, wherein the projection is formed on the pad provided on the package.
Claim 21
Dependent Claim
20 words
The semiconductor device according to claim 14, wherein the projection is formed on the pad provided on the semiconductor chip.
Claim 22
Dependent Claim
99 words
A semiconductor device having: a semiconductor chip; a wiring substrate; at least one pair of pads for input or output which are provided on the semiconductor chip and the package, respectively; and a connecting portion for connecting said pair of pads, wherein the connecting portion comprises: a projection projecting from at least one of said pair of pads; a ball having conductivity and located between said pair of pads; and a conductive bonding material for bonding said pair of pads and the ball, in which creep strength of the ball is larger than strength of the conductive bonding material.
Claim 23
Dependent Claim
99 words
A semiconductor device having: a semiconductor chip; a wiring substrate; at least one pair of pads for input or output which are provided on the semiconductor chip and the package, respectively; and a connecting portion for connecting said pair of pads, wherein the connecting portion comprises: a projection projecting from at least one of said pair of pads; a ball having conductivity and located between said pair of pads; and a conductive bonding material for bonding said pair of pads and the ball, in which creep strength of the ball is larger than strength of the conductive bonding material.
Claim 24
Dependent Claim
20 words
The semiconductor device according to claim 17, wherein the projection is formed on the pad provided on the semiconductor chip.
Claim 25
Dependent Claim
154 words
A mounting method of a package, comprising: preparing a package having a bump which is formed on a first pad for input or output of the package and used for making electric connection on the first pad, the bump comprising: a projection projecting from the first pad; a ball having conductivity and located above the first pad; and a first conductive bonding material for bonding the first pad and the ball, wherein creep strength of the ball is larger than strength of the first conductive bonding material; providing a second conductive bonding material on a second pad for input or output of a wiring substrate; placing the ball of the bump of the package close to the second pad of the wiring substrate; and heating and melting the second conductive bonding material of the second pad to connect the ball and the second pad of the wiring substrate by the second conductive bonding material.
Claim 26
Dependent Claim
154 words
A mounting method of a package, comprising: preparing a package having a bump which is formed on a first pad for input or output of the package and used for making electric connection on the first pad, the bump comprising: a projection projecting from the first pad; a ball having conductivity and located above the first pad; and a first conductive bonding material for bonding the first pad and the ball, wherein creep strength of the ball is larger than strength of the first conductive bonding material; providing a second conductive bonding material on a second pad for input or output of a wiring substrate; placing the ball of the bump of the package close to the second pad of the wiring substrate; and heating and melting the second conductive bonding material of the second pad to connect the ball and the second pad of the wiring substrate by the second conductive bonding material.
Claim 27
Dependent Claim
164 words
A mounting method of a semiconductor chip, comprising: preparing a semiconductor chip having a bump which is formed on a first pad for input or output of the semiconductor chip and used for making electric connection on the first pad, the bump comprising: a projection projecting from the first pad; a ball having conductivity and located above the first pad; and a first conductive bonding material for bonding the pad and the ball, wherein creep strength of the ball is larger than strength of the first conductive bonding material; providing a second conductive bonding material on a second pad for input and output of a wiring substrate or a package; placing the ball of the bump of the semiconductor chip close to the second pad of the wiring substrate or package; and heating and melting the second conductive bonding material of the second pad to connect the ball and the second pad of the wiring substrate or package by the second conductive bonding material.
Claim 28
Dependent Claim
164 words
A mounting method of a semiconductor chip, comprising: preparing a semiconductor chip having a bump which is formed on a first pad for input or output of the semiconductor chip and used for making electric connection on the first pad, the bump comprising: a projection projecting from the first pad; a ball having conductivity and located above the first pad; and a first conductive bonding material for bonding the pad and the ball, wherein creep strength of the ball is larger than strength of the first conductive bonding material; providing a second conductive bonding material on a second pad for input and output of a wiring substrate or a package; placing the ball of the bump of the semiconductor chip close to the second pad of the wiring substrate or package; and heating and melting the second conductive bonding material of the second pad to connect the ball and the second pad of the wiring substrate or package by the second conductive bonding material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-04-06 | 2001-10-06 | 2002-04-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-04-06 | 2005-10-06 | 2006-04-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-04-06 | 2009-10-06 | 2010-04-07 | $7700.00 | Window Closed / Lapsed |