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US5726069A Expired / Lapsed US ⏱️ 0.0 years remaining

Use of oblique implantation in forming emitter of bipolar transistor

Assignee: National Semiconductor Corp
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Filing: 1994-12-02
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Granted: 1998-03-10
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Expires: 2014-12-02
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Abstract

Abstract A bipolar transistor is fabricated by a process in which first and second dopants of the same conductivity type are introduced into a semiconductor body through at least partially overlapping sections, preferably the same section, of the body's upper surface to form an emitter. The first dopant is introduced at a greater dosage than the second dopant such that the emitter consists at least of a main emitter region constituted primarily with the first dopant. The introduction of the second dopant into the body entails ion implanting the second dopant at a tilt angle of at least 15° relative to a direction generally perpendicular to the body's upper surface. Part of the second dopant is so implanted into an extension zone that extends laterally beyond the main emitter region. The extension zone may be of the same conductivity type as, or of opposite conductivity type to, the main emitter region. In either case, the extension zone is lightly doped and reduces transistor performance degradation by reducing the electric field along the emitter-base junction, especially along the upper semiconductor surface.

Inventors

  • 👤 Hung-Sheng Chen
  • 👤 Chih Sieh Teng

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 01:43
CPC Classifications
H; H10; H10D; H10D10/00; H10D10/01; H10D10/051; H10D62/00; H10D62/10; H10D62/13; H10D62/133; H10P; H10P30/00; H10P30/20; H10P30/222

Claims Analysis

Total Claims: 43
Claim 1
Independent Claim 155 words
A method comprising the steps of introducing first and second dopants of like conductivity type into a semiconductor body having an upper surface to form a surface-adjoining emitter of a bipolar transistor, both dopants being introduced into the semiconductor body upon passing through largely the same opening in a doping shield formed on the semiconductor body's upper surface, the first dopant being so introduced at a greater dosage than the second dopant such that the emitter comprises a main emitter region constituted primarily with the first dopant, the step of introducing the second dopant entailing ion implanting the second dopant into the semiconductor body at a tilt angle of at least 15° relative to a direction generally perpendicular to the semiconductor body's upper surface, part of the second dopant being so implanted into an extension zone that extends laterally beyond the main emitter region and is of opposite conductivity type to the main emitter region.
Claim 2
Independent Claim 155 words
A method comprising the steps of introducing first and second dopants of like conductivity type into a semiconductor body having an upper surface to form a surface-adjoining emitter of a bipolar transistor, both dopants being introduced into the semiconductor body upon passing through largely the same opening in a doping shield formed on the semiconductor body's upper surface, the first dopant being so introduced at a greater dosage than the second dopant such that the emitter comprises a main emitter region constituted primarily with the first dopant, the step of introducing the second dopant entailing ion implanting the second dopant into the semiconductor body at a tilt angle of at least 15° relative to a direction generally perpendicular to the semiconductor body's upper surface, part of the second dopant being so implanted into an extension zone that extends laterally beyond the main emitter region and is of opposite conductivity type to the main emitter region.
Claim 3
Dependent Claim 71 words
A method as in claim 1 further including the step of introducing additional dopant into the semiconductor body to provide the transistor with a base that separates the emitter from material of the semiconductor body outside the base and emitter, the additional dopant being of opposite conductivity type to the first and second dopants, the base comprising a main region and a more lightly doped portion constituted with the extension zone.
Claim 4
Dependent Claim 17 words
A method as in claim 1 wherein the extension zone substantially laterally surrounds the main emitter region.
Claim 5
Dependent Claim 24 words
A method as in claim 1 wherein the step of introducing the first dopant is initiated before the step of introducing the second dopant.
Claim 6
Dependent Claim 36 words
A method as in claim 4 wherein the step of introducing the first dopant entails: ion implanting the first dopant into the semiconductor body; and subsequently annealing the semiconductor body before ion implanting the second dopant.
Claim 7
Dependent Claim 17 words
A method as in claim 5 wherein the first and second dopants respectively comprise arsenic and phosphorus.
Claim 8
Dependent Claim 27 words
A method as in claim 5 wherein the step of introducing the second dopant further entails annealing the semiconductor body subsequent to ion implanting the second dopant.
Claim 9
Dependent Claim 24 words
A method as in claim 1 wherein the step of introducing the second dopant is initiated before the step of introducing the first dopant.
Claim 10
Dependent Claim 30 words
A method as in claim 8 wherein the step of introducing the first dopant entails out-diffusing the first dopant from a doping layer provided over the semiconductor body's upper surface.
Claim 11
Dependent Claim 14 words
A method as in claim 9 wherein the doping layer comprises non-monocrystalline semiconductor material.
Claim 12
Dependent Claim 16 words
A method as in claim 10 wherein the non-monocrystalline semiconductor material comprises polysilicon or amorphous silicon.
Claim 13
Dependent Claim 16 words
A method as in claim 10 wherein the doping layer forms a contact to the emitter.
Claim 14
Dependent Claim 37 words
A method as in claim 1 wherein the ion implanting of the second dopant includes simultaneously rotating the semiconductor body relative to a source of the second dopant while maintaining the tilt angle in a specified range.
Claim 15
Dependent Claim 28 words
A method as in claim 13 wherein the tilt angle is maintained approximately constant as the semiconductor body is rotated relative to the source of the second dopant.
Claim 16
Dependent Claim 28 words
A method as in claim 1 wherein the ion implanting of the second dopant includes scanning a source of the second dopant across the semiconductor body's upper surface.
Claim 17
Dependent Claim 14 words
A method as in claim 1 wherein the tilt angle is at least 20°.
Claim 18
Dependent Claim 36 words
A method as in claim 1 wherein, during the step of introducing the second dopant, part of the second dopant is simultaneously ion implanted into a region of a field-effect transistor created from the semiconductor body.
Claim 19
Dependent Claim 33 words
A method as in claim 17 wherein the introduction of the second dopant in the region of the field-effect transistor is used in creating a lightly doped drain extension for the field-effect transistor.
Claim 20
Independent Claim 154 words
A method comprising the steps of introducing first and second dopants of like conductivity type into a semiconductor body having an upper surface to form a surface-adjoining emitter of a bipolar transistor, both dopants being introduced into the semiconductor body upon passing through largely the same opening in a doping shield formed on the semiconductor body's upper surface, the steps of introducing the first and second dopants entailing ion implanting the first and second dopants respectively at first and second tilt angles relative to a direction generally perpendicular to the semiconductor body's upper surface, the first dopant being so introduced at a greater dosage than the second dopant such that the emitter comprises a main emitter region constituted primarily with the first dopant, part of the second dopant being so introduced into an extension zone that extends laterally beyond the main emitter region and is of opposite conductivity type to the main emitter region.
Claim 21
Independent Claim 154 words
A method comprising the steps of introducing first and second dopants of like conductivity type into a semiconductor body having an upper surface to form a surface-adjoining emitter of a bipolar transistor, both dopants being introduced into the semiconductor body upon passing through largely the same opening in a doping shield formed on the semiconductor body's upper surface, the steps of introducing the first and second dopants entailing ion implanting the first and second dopants respectively at first and second tilt angles relative to a direction generally perpendicular to the semiconductor body's upper surface, the first dopant being so introduced at a greater dosage than the second dopant such that the emitter comprises a main emitter region constituted primarily with the first dopant, part of the second dopant being so introduced into an extension zone that extends laterally beyond the main emitter region and is of opposite conductivity type to the main emitter region.
Claim 22
Dependent Claim 30 words
A method as in claim 19 wherein the transistor is provided with a base comprising a main portion and a more lightly doped portion constituted primarily with the extension zone.
Claim 23
Dependent Claim 24 words
A method as in claim 19 wherein the step of introducing the first dopant is initiated before the step of introducing the second dopant.
Claim 24
Dependent Claim 37 words
A method as in claim 21 wherein the step of introducing the first dopant includes annealing the semiconductor body between introducing the first dopant into the semiconductor body and implanting the second dopant into the semiconductor body.
Claim 25
Dependent Claim 24 words
A method as in claim 19 wherein the step of introducing the second dopant is initiated before the step of introducing the first dopant.
Claim 26
Dependent Claim 15 words
A method as in claim 19 wherein the second tilt angle is at least 15°.
Claim 27
Dependent Claim 15 words
A method as in claim 19 wherein the second tilt angle is at least 20°.
Claim 28
Dependent Claim 18 words
A method as in claim 19 wherein the second tilt angle is greater than the first tilt angle.
Claim 29
Dependent Claim 17 words
A method as in claim 19 wherein the extension zone substantially laterally surrounds the main emitter region.
Claim 30
Independent Claim 160 words
A method comprising the steps of introducing first and second dopants of like conductivity type into a semiconductor body having an upper surface to form a surface-adjoining emitter of a bipolar transistor, the first and second dopants passing through at least partially overlapping sections of the semiconductor body's upper surface, the first dopant being so introduced at a greater dosage than the second dopant such that the emitter comprises a main emitter region constituted primarily with the first dopant, the step of introducing the second dopant (a) being initiated after the step of introducing the first dopant and (b) entailing ion implanting the second dopant into the semiconductor body at a tilt angle of at least 15° relative to a direction generally perpendicular to the semiconductor body's upper surface, part of the second dopant being so implanted into an extension zone that extends laterally beyond the main emitter region and is of opposite conductivity type to the main emitter region.
Claim 31
Independent Claim 160 words
A method comprising the steps of introducing first and second dopants of like conductivity type into a semiconductor body having an upper surface to form a surface-adjoining emitter of a bipolar transistor, the first and second dopants passing through at least partially overlapping sections of the semiconductor body's upper surface, the first dopant being so introduced at a greater dosage than the second dopant such that the emitter comprises a main emitter region constituted primarily with the first dopant, the step of introducing the second dopant (a) being initiated after the step of introducing the first dopant and (b) entailing ion implanting the second dopant into the semiconductor body at a tilt angle of at least 15° relative to a direction generally perpendicular to the semiconductor body's upper surface, part of the second dopant being so implanted into an extension zone that extends laterally beyond the main emitter region and is of opposite conductivity type to the main emitter region.
Claim 32
Dependent Claim 29 words
A method as in claim 28 wherein the transistor is provided with a base comprising a main portion and a more lightly doped portion constituted with the extension zone.
Claim 33
Dependent Claim 36 words
A method as in claim 28 wherein, during the step of introducing the second dopant, part of the second dopant is simultaneously ion implanted into a region of a field-effect transistor created from the semiconductor body.
Claim 34
Dependent Claim 33 words
A method as in claim 30 wherein the introduction of the second dopant in the region of the field-effect transistor is used in creating a lightly doped drain extension for the field-effect transistor.
Claim 35
Dependent Claim 36 words
A method as in claim 28 wherein the step of introducing the first dopant entails: ion implanting the first dopant into the semiconductor body; and subsequently annealing the semiconductor body before ion implanting the second dopant.
Claim 36
Dependent Claim 17 words
A method as in claim 32 wherein the first and second dopants respectively comprise arsenic and phosphorus.
Claim 37
Dependent Claim 27 words
A method as in claim 32 wherein the step of introducing the second dopant further entails annealing the semiconductor body subsequent to ion implanting the second dopant.
Claim 38
Dependent Claim 54 words
A method as in claim 28 further including the step of introducing additional dopant into the semiconductor body to provide the transistor with a base that separates the emitter from material of the semiconductor body outside the base and emitter, the additional dopant being of opposite conductivity type to the first and second dopants.
Claim 39
Dependent Claim 17 words
A method as in claim 28 wherein the extension zone substantially laterally surrounds the main emitter region.
Claim 40
Dependent Claim 37 words
A method as in claim 28 wherein the ion implanting of the second dopant includes simultaneously rotating the semiconductor body relative to a source of the second dopant while maintaining the tilt angle in a specified range.
Claim 41
Dependent Claim 28 words
A method as in claim 37 wherein the tilt angle is maintained approximately constant as the semiconductor body is rotated relative to the source of the second dopant.
Claim 42
Dependent Claim 28 words
A method as in claim 28 wherein the ion implanting of the second dopant includes scanning a source of the second dopant across the semiconductor body's upper surface.
Claim 43
Dependent Claim 14 words
A method as in claim 28 wherein the tilt angle is at least 20°.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-03-09 2001-09-08 2002-03-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-03-09 2005-09-08 2006-03-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-03-09 2009-09-08 2010-03-10 $7700.00 Window Closed / Lapsed

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