Optical semiconductor module and method for manufacturing the same

Claim 1

An optical semiconductor module adapted to a plurality of optical transmission and reception channels, comprising: a monocrystalline substrate having first and second surfaces; an optical semiconductor array formed on the first surface of the monocrystalline substrate, having a plurality of optical axes, for performing light emitting and receiving functions; an optical fiber array formed on the first surface of the monocrystalline substrate, having a plurality of optical axes, for transmitting light received and emitted by the optical semiconductor array; an optical axis aligning mechanism, formed on the first surface of the monocrystalline substrate, for aligning the optical axes of the optical semiconductor array with the optical axes of the optical fiber array; an airtight sealing member formed on the first surface of the monocrystalline substrate for forming an airtight seal around the optical semiconductor array and a portion of the optical fiber array; and a reinforcing body formed on the second surface of the monocrystalline substrate and thermally connected to a part of the airtight sealing member, and having a thermal expansion characteristic substantially equal to that of the airtight sealing member.

Claim 16

A method for producing an optical semiconductor module, wherein a composite pattern of a combination of grooves having different widths is formed on a plane of an Si substrate by anisotropic etching in which etching is substantially stopped at the plane, and thereafter an optical fiber is fixed to the composite pattern, the method comprising the steps of: forming a wider groove by etching on the Si substrate, using a first rectangular window mask; and forming a narrower groove by etching on the Si substrate, using a synthetic mask comprising a second rectangular window, a predetermined distance apart from the wider groove, and a band-shaped window which is narrower than the second rectangular window and extending from a slant face on a contact portion of the wider groove to the second rectangular window.

Claim 17

A method for producing an optical semiconductor module, wherein a composite pattern of a combination of grooves having different widths is formed on a plane of an Si substrate by anisotropic etching in which etching is substantially stopped at the plane, and thereafter an optical fiber is fixed to the composite pattern, the method comprising the steps of: forming a wider groove by etching on the Si substrate, using a first rectangular window mask; and forming a narrower groove by etching on the Si substrate, using a synthetic mask comprising a second rectangular window, a predetermined distance apart from the wider groove, and a band-shaped window which is narrower than the second rectangular window and extending from a slant face on a contact portion of the wider groove to the second rectangular window.