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US5709593A Expired / Lapsed US ⏱️ 0.0 years remaining

Apparatus and method for distribution of slurry in a chemical mechanical polishing system

Assignee: Applied Materials Inc
•
Filing: 1995-10-27
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Granted: 1998-01-20
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Expires: 2015-10-27
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Abstract

Abstract Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

Inventors

  • 👤 William L. Guthrie
  • 👤 Semyon Spektor
  • 👤 Ivan A. Ocanada
  • 👤 Norm Shendon

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 14:14
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/04; B24B1/00; B24B1/04; B24B57/00; B24B57/02

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 72 words
A chemical mechanical polishing apparatus, comprising: a rotating polishing pad; a dispenser for providing a slurry to a surface of said polishing pad; and a flexible member disposed above said surface of said polishing pad and positioned so that, as said slurry passes beneath said flexible member, a bottom edge of said flexible member contacts said slurry and distributes it as a substantially uniform film across said surface of said polishing pad.
Claim 2
Dependent Claim 72 words
A chemical mechanical polishing apparatus, comprising: a rotating polishing pad; a dispenser for providing a slurry to a surface of said polishing pad; and a flexible member disposed above said surface of said polishing pad and positioned so that, as said slurry passes beneath said flexible member, a bottom edge of said flexible member contacts said slurry and distributes it as a substantially uniform film across said surface of said polishing pad.
Claim 3
Dependent Claim 25 words
The apparatus of claim 1 wherein said flexible member extends from an edge of said polishing pad substantially to a center of said polishing pad.
Claim 4
Dependent Claim 12 words
The apparatus of claim 2 wherein said flexible member is substantially linear.
Claim 5
Dependent Claim 18 words
The apparatus of claim 1 wherein there is a gap separating said flexible member from said polishing pad.
Claim 6
Dependent Claim 16 words
The apparatus of claim 1 wherein said flexible member contacts said surface of said polishing pad.
Claim 7
Dependent Claim 19 words
The apparatus of claim 1 further comprising a second flexible member disposed above said surface of said polishing pad.
Claim 8
Dependent Claim 13 words
The apparatus of claim 1 wherein said flexible member includes an angled edge.
Claim 9
Dependent Claim 37 words
The apparatus of claim 1 further comprising a rigid arm which extends from an edge of said polishing pad substantially to a center of said polishing pad, and wherein said flexible member is connected to said arm.
Claim 10
Dependent Claim 25 words
The apparatus of claim 8 further comprising a rotary motor connected to said arm to move said arm over said surface of said polishing pad.
Claim 11
Dependent Claim 109 words
A chemical mechanical polishing apparatus, comprising: a rotating polishing pad; a dispenser for providing a slurry to a surface of said polishing pad; an arm which extends from an edge of said polishing pad substantially to a center of said polishing pad; a motor connected to said arm to move said arm over said polishing pad surface; a flexible member connected to said arm and disposed above said polishing pad surface to sweep slurry across said polishing pad; a carrier head to press a substrate against said polishing pad; and a control system to control the motion of said carrier head and said arm to prevent a collision therebetween.
Claim 12
Dependent Claim 109 words
A chemical mechanical polishing apparatus, comprising: a rotating polishing pad; a dispenser for providing a slurry to a surface of said polishing pad; an arm which extends from an edge of said polishing pad substantially to a center of said polishing pad; a motor connected to said arm to move said arm over said polishing pad surface; a flexible member connected to said arm and disposed above said polishing pad surface to sweep slurry across said polishing pad; a carrier head to press a substrate against said polishing pad; and a control system to control the motion of said carrier head and said arm to prevent a collision therebetween.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-01-19 2001-07-21 2002-01-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-01-19 2005-07-21 2006-01-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-01-19 2009-07-21 2010-01-20 $7700.00 Window Closed / Lapsed

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