US5708300A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device having contoured package body profile
Assignee: Motorola Solutions Inc
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Filing: 1995-09-05
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Granted: 1998-01-13
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Expires: 2015-09-05
Abstract
Abstract An overmolded semiconductor device (30, 50) has a contoured package body profile instead of a conventional flat package body surface for uniform filling during the molding process. A cross-section of the semiconductor device reveals a substantially uniform thickness of plastic (36 and 38) covering the carrier substrate (14) and overmolding the semiconductor die (12). Alternatively, a thicker layer of plastic (58) overmolds the semiconductor die (12') than the layer of plastic (56) covering the carrier substrate (14'). The contoured package body profile is designed to allow a uniform flow front progression of molding compound during the molding process to eliminate voids in the package body by providing the same resistive pressure to the molding compound flow front during filling.
Inventors
- 👤 Alan H. Woosley
- 👤 Everitt W. Mace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:21
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W70/00; H10W70/60; H10W76/17; H10W76/18; H10W72/00; H10W72/071; H10W72/075; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
117 words
A semiconductor device comprising: a semiconductor die mounted upon a surface of a carrier substrate and electrically connected thereto; and a plastic package body formed over the Surface of the carrier substrate and over the semiconductor die, the plastic package body being contoured such that the plastic package body has a first major surface overlying a portion of the carrier substrate on a first plane and a second major surface overlying the semiconductor die on a second plane, and such that in a cross-section of the semiconductor device, a thickness of the plastic package body above the surface of the carrier substrate is substantially equal to a thickness of the plastic package body above the semiconductor die.
Claim 2
Dependent Claim
117 words
A semiconductor device comprising: a semiconductor die mounted upon a surface of a carrier substrate and electrically connected thereto; and a plastic package body formed over the Surface of the carrier substrate and over the semiconductor die, the plastic package body being contoured such that the plastic package body has a first major surface overlying a portion of the carrier substrate on a first plane and a second major surface overlying the semiconductor die on a second plane, and such that in a cross-section of the semiconductor device, a thickness of the plastic package body above the surface of the carrier substrate is substantially equal to a thickness of the plastic package body above the semiconductor die.
Claim 3
Dependent Claim
16 words
The device of claim 1, wherein the semiconductor die is wire bonded to the carrier substrate.
Claim 4
Dependent Claim
19 words
The device of claim 1, wherein the plastic package body is composed of a polymeric epoxy-resin based molding compound.
Claim 5
Dependent Claim
31 words
The device of claim 1, wherein the plastic package body is further characterized as having a non-orthogonal portion of the plastic package body which connects said first and second major surfaces.
Claim 6
Dependent Claim
16 words
The device of claim 1, wherein the semiconductor die is flip-chip bonded to the carrier substrate.
Claim 7
Dependent Claim
46 words
The device of claim 1, wherein the semiconductor die is characterized as one selected from a group consisting of: a microcontroller unit (MCU), a microprocessor (MPU), a memory, a digital signal processor (DSP), a reduced instruction set chip (RISC), and an application specific integrated circuit (ASIC).
Claim 8
Dependent Claim
18 words
The device of claim 1 wherein said first and second major surfaces are substantially parallel to one another.
Claim 9
Dependent Claim
118 words
A semiconductor device comprising: a semiconductor die mounted upon a surface of a carrier substrate and electrically connected thereto; and a plastic package body formed over the surface of the carrier substrate and over the semiconductor die, the plastic package body being contoured such that the plastic package body has a first major surface overlying a portion of the carrier substrate on a first plane and a second major surface overlying the semiconductor die on a second plane, and such that in a cross-section of the semiconductor device, a first thickness of the plastic package body above the surface of the carrier substrate is less than a second thickness of the plastic package body above the semiconductor die.
Claim 10
Dependent Claim
118 words
A semiconductor device comprising: a semiconductor die mounted upon a surface of a carrier substrate and electrically connected thereto; and a plastic package body formed over the surface of the carrier substrate and over the semiconductor die, the plastic package body being contoured such that the plastic package body has a first major surface overlying a portion of the carrier substrate on a first plane and a second major surface overlying the semiconductor die on a second plane, and such that in a cross-section of the semiconductor device, a first thickness of the plastic package body above the surface of the carrier substrate is less than a second thickness of the plastic package body above the semiconductor die.
Claim 11
Dependent Claim
16 words
The device of claim 8, wherein the semiconductor die is wire bonded to the carrier substrate.
Claim 12
Dependent Claim
19 words
The device of claim 8, wherein the plastic package body is composed of a polymeric epoxy-resin based molding compound.
Claim 13
Dependent Claim
28 words
The device of claim 8, wherein the first thickness of the plastic package body is approximately 0.3 to 0.8 of the second thickness of the plastic package body.
Claim 14
Dependent Claim
16 words
The device of claim 8, wherein the semiconductor die is flip-chip bonded to the carrier substrate.
Claim 15
Dependent Claim
46 words
The device of claim 8, wherein the semiconductor die is characterized as one selected from a group consisting of: a microcontroller unit (MCU), a microprocessor (MPU), a memory, a digital signal processor (DSP), a reduced instruction set chip (RISC), and an application specific integrated circuit (ASIC).
Claim 16
Dependent Claim
18 words
The device of claim 8 wherein said first and second major surfaces are substantially parallel to one another.
Claim 17
Dependent Claim
26 words
The device of claim 8 wherein the plastic package body is further characterized as having a non-orthogonal portion which connects said first and second major surfaces.
Claim 18
Dependent Claim
62 words
A semiconductor device comprising: a semiconductor die mounted upon a surface of a carrier substrate and electrically coupled thereto; and a molded plastic package body overlying the surface of the carrier substrate and the semiconductor die, the plastic package body being contoured so as to have a substantially uniform thickness over the surface of the carrier substrate and over the semiconductor die.
Claim 19
Dependent Claim
62 words
A semiconductor device comprising: a semiconductor die mounted upon a surface of a carrier substrate and electrically coupled thereto; and a molded plastic package body overlying the surface of the carrier substrate and the semiconductor die, the plastic package body being contoured so as to have a substantially uniform thickness over the surface of the carrier substrate and over the semiconductor die.
Claim 20
Dependent Claim
25 words
The device of claim 16 wherein the plastic package body further has a stepped portion corresponding in location to an edge of the semiconductor die.
Claim 21
Dependent Claim
17 words
The device of claim 17 wherein the stepped portion of plastic package body has a non-orthogonal surface.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-12 | 2001-07-14 | 2002-01-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-12 | 2005-07-14 | 2006-01-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-12 | 2009-07-14 | 2010-01-13 | $7700.00 | Window Closed / Lapsed |