US5703406A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Interconnection structure for attaching a semiconductor device to a substrate
Assignee: Mosaid Technologies Inc
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Filing: 1996-01-19
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Granted: 1997-12-30
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Expires: 2016-01-19
Abstract
Abstract An interconnection structure for bonding a semiconductor device on a substrate includes a semiconductor chip having a plurality of solder balls attached thereto; and an under-fill substance layer being adjacently bonded to the semiconductor chip and having a plurality of holes therein. By employing the structure, when the semiconductor chip and the substrate are electrically bonded, a previously provided under fill substance layer is used without any additional under filling step, so that the entire process can be simplified and its reliability can be improved.
Inventors
- 👤 Dae Soon Kang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/20; H10W72/241; H10W72/331; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
76 words
A module for mounting a semiconductor device on a substrate, the semiconductor device having a plurality of conductive media for conductive connection to the substrate, comprising: an interconnection structure having a plurality of holes for receiving said plurality of conductive media to allow a conductive connection between the semiconductor device and the substrate, wherein said interconnection structure is in contact with said semiconductor device and the substrate to adhesively bond the semiconductor device to the substrate.
Claim 2
Dependent Claim
76 words
A module for mounting a semiconductor device on a substrate, the semiconductor device having a plurality of conductive media for conductive connection to the substrate, comprising: an interconnection structure having a plurality of holes for receiving said plurality of conductive media to allow a conductive connection between the semiconductor device and the substrate, wherein said interconnection structure is in contact with said semiconductor device and the substrate to adhesively bond the semiconductor device to the substrate.
Claim 3
Dependent Claim
23 words
The module of claim 1, wherein said plurality of conductive media is at least one of a plurality of solder balls and bumps.
Claim 4
Dependent Claim
14 words
The module of claim 1, wherein said interconnection structure is an under-fill substance layer.
Claim 5
Dependent Claim
13 words
The module of claim 1, wherein the substrate is a printed circuit board.
Claim 6
Dependent Claim
33 words
The module of claim 1, wherein said interconnection structure has a width which is larger than that of the semiconductor device after the interconnection structure adhesively bonds the semiconductor device to the substrate.
Claim 7
Dependent Claim
42 words
The module of claim 1, wherein a diameter of each of said plurality of holes is substantially the same as corresponding one of said plurality of conductive media such that said plurality of conductive media fits snugly into said plurality of holes.
Claim 8
Dependent Claim
82 words
The module of claim 1, wherein each of said plurality of conductive media has first and second ends and said interconnection structure has first and second surfaces and said plurality of holes extend from said first surface to said second surface, and said plurality of conductive media is inserted through said plurality of holes from said first surface to said second surface such that said second ends of said plurality of conductive media extend beyond said second surface of the interconnection structure.
Claim 9
Dependent Claim
17 words
The module of claim 7, wherein said first surface of said interconnection structure contacts the semiconductor device.
Claim 10
Dependent Claim
14 words
The module of claim 1, wherein said plurality of holes have a round shape.
References Cited (Backward Citations)
JPH04273464A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-29 | 2001-06-30 | 2001-12-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-29 | 2005-06-30 | 2005-12-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-29 | 2009-06-30 | 2009-12-30 | $7700.00 | Window Closed / Lapsed |