Wafer polishing method and wafer polishing apparatus

Abstract

Abstract In a polishing method of polishing a surface of a wafer by pressing the wafer, which is rotating in the same direction as a rotating table, against the polishing table while continuously flowing a polishing agent onto the polishing table, run-off of the polishing agent is suppressed by continuously blowing air from the outside of the polishing table toward the polishing table. A wafer polishing apparatus for practicing the above method includes a polishing table having rotating means, polishing agent supplying means for supplying a polishing agent onto the polishing table, wafer holding means, having rotating means and vertical drive mechanism, for holding a wafer to oppose the polishing table, and air blowing means for blowing air from the outside of the table polishing toward the polishing table. According to this method and apparatus, run-off of the polishing agent is suppressed appropriately, so that run-off of the polishing agent is decreased when compared to a conventional case without causing degradation of the polishing agent due to retention of the polishing agent, thereby decreasing the running cost of CMP.

Inventors

• 👤 Akira Isobe

Bibliographic Details