US5700981A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated electronic component and method for encapsulating an electronic component
Assignee: Round Rock Research LLC
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Filing: 1996-02-08
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Granted: 1997-12-23
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Expires: 2016-02-08
Abstract
Abstract A method for encapsulating an electronic component includes providing a substrate; providing an enclosure dam around at least a portion of electronic component placed relative to the substrate; providing a first substantially uncured flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component. An encapsulated body having the above attributes is also disclosed.
Inventors
- 👤 Mark E. Tuttle
- 👤 Joseph P. Mousseau
- 👤 Clay L. Cirino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 08:59
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 40
Claim 1
Independent Claim
145 words
A method for encapsulating an electronic component comprising: providing a substrate; providing an enclosure dam around at least a portion of an electronic component placed on the substrate; providing a first substantially uncured, flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and, within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component; wherein the first encapsulation material has a first curing rate, and the second encapsulation material has a second curing rate, the second curing rate being faster than the first curing rate.
Claim 2
Independent Claim
145 words
A method for encapsulating an electronic component comprising: providing a substrate; providing an enclosure dam around at least a portion of an electronic component placed on the substrate; providing a first substantially uncured, flowable encapsulation material outwardly of the electronic component and within the enclosure dam; providing a second encapsulation material atop the first encapsulation material and, within the enclosure dam; and curing the first encapsulation material into a substantially non-flowable state, the second encapsulation material and the enclosure dam retaining the first flowable encapsulation material relative to the electronic component and substrate during the curing, the cured first material and the second material collectively forming a resultant encapsulation body on the electronic component; wherein the first encapsulation material has a first curing rate, and the second encapsulation material has a second curing rate, the second curing rate being faster than the first curing rate.
Claim 3
Dependent Claim
28 words
A method as claimed in claim 1, wherein a plurality of electronic components are placed on the substrate, and the enclosure dam encircles all of the electronic components.
Claim 4
Dependent Claim
33 words
A method as claimed in claim 1, wherein the electronic component has a given height dimension, and the enclosure dam has a height dimension greater than the height dimension of the electronic component.
Claim 5
Dependent Claim
18 words
A method as claimed in claim 1, wherein the enclosure dam is made integral with the encapsulation body.
Claim 6
Dependent Claim
21 words
A method as claimed in claim 1, wherein after the step of curing the first encapsulation material, removing the enclosure dam.
Claim 7
Dependent Claim
17 words
A method as claimed in claim 1, wherein the first encapsulation material is a two part epoxy.
Claim 8
Dependent Claim
17 words
A method as claimed in claim 1, wherein the second encapsulation material is a fast curing epoxy.
Claim 9
Dependent Claim
18 words
A method as claimed in claim 1, wherein the second material is a fast curing two part epoxy.
Claim 10
Dependent Claim
45 words
A method as claimed in claim 1, wherein the first encapsulation material has said first curing rate, and the second encapsulation material is a two part epoxy which has said second curing rate which is faster than the curing rate of the first encapsulation material.
Claim 11
Dependent Claim
35 words
A method as claimed in claim 1, wherein the first encapsulating material has an exterior facing surface, and the second encapsulation material accelerates the hardening of the exterior facing surface of the first encapsulation material.
Claim 12
Dependent Claim
49 words
A method as claimed in claim 1, wherein the first encapsulation material has an exterior facing surface, and wherein the method further comprises applying a catalyst to the exterior facing surface, the catalyst being effective to cause hardening of the exterior facing surface to provide the second encapsulation material.
Claim 13
Dependent Claim
34 words
A method as claimed in claim 1, wherein the second encapsulation material is a light curable coating, and the method further comprising providing light of a given wavelength to cure the light curable coating.
Claim 14
Dependent Claim
33 words
A method as claimed in claim 12, wherein the light curable coating cures when exposed to ultraviolet light, and the step of providing light comprises exposing the second encapsulation material to ultraviolet radiation.
Claim 15
Dependent Claim
10 words
An encapsulated electronic component manufactured in accordance with claim 1.
Claim 16
Independent Claim
126 words
A method for encapsulating an electronic component, comprising: providing an enclosure dam around at least a portion of the electronic component, the electronic component supported on a substrate; providing a first, flowable two part epoxy atop the electronic component and within the enclosure dam, the first flowable two part epoxy being curable to a non-flowable state; and providing a second two part epoxy atop the first two part epoxy and within the enclosure dam, the second epoxy and the enclosure dam retaining the first flowable two part epoxy relative to the electronic component and substrate during the curing of the first two part epoxy, the cured first two part epoxy and the second two part epoxy collectively forming a resulting encapsulation body on the electronic component.
Claim 17
Independent Claim
126 words
A method for encapsulating an electronic component, comprising: providing an enclosure dam around at least a portion of the electronic component, the electronic component supported on a substrate; providing a first, flowable two part epoxy atop the electronic component and within the enclosure dam, the first flowable two part epoxy being curable to a non-flowable state; and providing a second two part epoxy atop the first two part epoxy and within the enclosure dam, the second epoxy and the enclosure dam retaining the first flowable two part epoxy relative to the electronic component and substrate during the curing of the first two part epoxy, the cured first two part epoxy and the second two part epoxy collectively forming a resulting encapsulation body on the electronic component.
Claim 18
Dependent Claim
38 words
A method as claimed in claim 15, wherein the first two part epoxy has a first curing rate, and the second curing has a second curing rate, the second curing rate being faster than the first curing rate.
Claim 19
Dependent Claim
52 words
A method as claimed in claim 15, wherein the first two part epoxy has an exterior facing surface, and wherein the method further comprises applying the second two part epoxy on the exterior facing surface, the second two part epoxy hardening over the exterior facing surface of the first two part epoxy.
Claim 20
Dependent Claim
45 words
A method as claimed in claim 15, wherein the first two part epoxy has an exterior facing surface, and wherein the method further comprises applying a catalyst to the exterior facing surface, the catalyst effective to accelerate the hardening of the exterior facing surface thereof.
Claim 21
Dependent Claim
18 words
A method as claimed in claim 15, wherein the enclosure dam is made integral with the encapsulation body.
Claim 22
Dependent Claim
15 words
A method as claimed in claim 15, wherein after curing, the enclosure dam is removed.
Claim 23
Dependent Claim
10 words
An encapsulated electronic component manufactured in accordance with claim 15.
Claim 24
Dependent Claim
101 words
A composite encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic element; the first layer having an uncured, flowable state, and a cured, non-flowable state; and second layer of material positioned in covering relation relative to the first layer, the second layer facilitating retention of the first layer on the electronic element while the first layer is in the uncured, flowable state; wherein the first layer comprises a slow curing two part epoxy and the second layer is a fast curing two part epoxy.
Claim 25
Dependent Claim
101 words
A composite encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic element; the first layer having an uncured, flowable state, and a cured, non-flowable state; and second layer of material positioned in covering relation relative to the first layer, the second layer facilitating retention of the first layer on the electronic element while the first layer is in the uncured, flowable state; wherein the first layer comprises a slow curing two part epoxy and the second layer is a fast curing two part epoxy.
Claim 26
Dependent Claim
29 words
A composite encapsulation body as claimed in claim 22, wherein the first layer comprises said slow curing two part epoxy, and the second layer is a light curable coating.
Claim 27
Dependent Claim
124 words
A composite encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic element; the first layer having an uncured, flowable state, and a cured, non-flowable state; and second layer of material positioned in covering relation relative to the first layer, the second layer facilitating retention of the first layer on the electronic element while the first layer is in the uncured, flowable state; wherein the first layer comprises a slow curing two part epoxy which has an exterior facing surface, and the second layer comprises a material which accelerates the hardening of the exterior facing surface of the first layer two part epoxy to form the second layer.
Claim 28
Dependent Claim
124 words
A composite encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic element; the first layer having an uncured, flowable state, and a cured, non-flowable state; and second layer of material positioned in covering relation relative to the first layer, the second layer facilitating retention of the first layer on the electronic element while the first layer is in the uncured, flowable state; wherein the first layer comprises a slow curing two part epoxy which has an exterior facing surface, and the second layer comprises a material which accelerates the hardening of the exterior facing surface of the first layer two part epoxy to form the second layer.
Claim 29
Dependent Claim
122 words
A composite encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic element; the first layer having an uncured, flowable state, and a cured, non-flowable state; and second layer of material positioned in covering relation relative to the first layer, the second layer facilitating retention of the first layer on the electronic element while the first layer is in the uncured, flowable state; wherein the first layer comprises a slow curing two part epoxy which has an exterior facing surface, and a catalyst is applied to the exterior facing surface, the catalyst effective to harden the exterior facing surface and form the second layer of material.
Claim 30
Dependent Claim
122 words
A composite encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic element; the first layer having an uncured, flowable state, and a cured, non-flowable state; and second layer of material positioned in covering relation relative to the first layer, the second layer facilitating retention of the first layer on the electronic element while the first layer is in the uncured, flowable state; wherein the first layer comprises a slow curing two part epoxy which has an exterior facing surface, and a catalyst is applied to the exterior facing surface, the catalyst effective to harden the exterior facing surface and form the second layer of material.
Claim 31
Dependent Claim
36 words
A composite encapsulation body as claimed in claim 22, wherein first layer has a given curing rate, and the second layer has a curing rate which is faster than the curing rate of the first layer.
Claim 32
Dependent Claim
20 words
A composite encapsulation body as claimed in claim 22, and further comprising an enclosure dam which surrounds the encapsulation body.
Claim 33
Dependent Claim
19 words
A composite encapsulation body as claimed in claim 22, comprising the first layer in the substantially cured, non-flowable state.
Claim 34
Dependent Claim
20 words
A composite encapsulation body as claimed in claim 22, comprising the first and second layers in a substantially solid state.
Claim 35
Dependent Claim
92 words
An encapsulation body, comprising: a substrate; an electronic element borne by the substrate; and a composite encapsulation layer enclosing the electronic element, the composite encapsulation layer having a discrete first material covering the electronic element, and which has an axially outer surface, and a second material in conformal overlying relation relative to the axially outer surface, and wherein, the first and second materials are both two part epoxies, having individually unique curing rates, and wherein the curing rate of the second material is greater than the curing rate of the first material.
Claim 36
Dependent Claim
92 words
An encapsulation body, comprising: a substrate; an electronic element borne by the substrate; and a composite encapsulation layer enclosing the electronic element, the composite encapsulation layer having a discrete first material covering the electronic element, and which has an axially outer surface, and a second material in conformal overlying relation relative to the axially outer surface, and wherein, the first and second materials are both two part epoxies, having individually unique curing rates, and wherein the curing rate of the second material is greater than the curing rate of the first material.
Claim 37
Dependent Claim
68 words
An encapsulation body, comprising: a substrate; an electronic element borne by the substrate; and a composite encapsulation layer enclosing the electronic element the composite encapsulation layer having a discrete first material covering the electronic element; and wherein the first material is a two party epoxy, and a second material in conformal overlying relation relative to the first material, and wherein the second material is a light curable coat.
Claim 38
Dependent Claim
68 words
An encapsulation body, comprising: a substrate; an electronic element borne by the substrate; and a composite encapsulation layer enclosing the electronic element the composite encapsulation layer having a discrete first material covering the electronic element; and wherein the first material is a two party epoxy, and a second material in conformal overlying relation relative to the first material, and wherein the second material is a light curable coat.
Claim 39
Dependent Claim
84 words
An encapsulation body, comprising: a substrate; an electronic element borne by the substrate; and a composite encapsulation layer enclosing the electronic element, the composite encapsulation layer having a discrete first material covering the electronic element, the first material having an axially outer surface, and wherein the first material is a two part epoxy, and a second material in conformal overlying relation relative to the first material, and wherein the second material accelerates the hardening of the axially outer surface to form the second material.
Claim 40
Dependent Claim
84 words
An encapsulation body, comprising: a substrate; an electronic element borne by the substrate; and a composite encapsulation layer enclosing the electronic element, the composite encapsulation layer having a discrete first material covering the electronic element, the first material having an axially outer surface, and wherein the first material is a two part epoxy, and a second material in conformal overlying relation relative to the first material, and wherein the second material accelerates the hardening of the axially outer surface to form the second material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-22 | 2001-06-23 | 2001-12-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-22 | 2005-06-23 | 2005-12-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-22 | 2009-06-23 | 2009-12-23 | $7700.00 | Window Closed / Lapsed |