US5699027A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Surface acoustic wave devices having a guard layer
Assignee: Panasonic Holdings Corp
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Filing: 1996-03-27
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Granted: 1997-12-16
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Expires: 2016-03-27
Abstract
Abstract A surface acoustic wave device including a dielectric substrate having an input electrode and an output electrode and a grounding electrode on a first surface of the dielectric substrate, and an outer electrode on a second surface of the dielectric substrate; and a surface acoustic wave element having an electrode pad and a comb-shaped electrode disposed on a first surface of the surface acoustic wave element. The surface acoustic wave element is bonded to the dielectric substrate via a metal bump and a conductive resin formed on the electrode pad. The surface acoustic wave device further includes an insulating resin deposited on the periphery of the metal bump, and a guard layer shorter in height than the surface acoustic wave element formed adjacent the surface acoustic wave element on the first surface of the dielectric substrate.
Inventors
- 👤 Yasunobu Tsuji
- 👤 Kazuo Eda
- 👤 Yutaka Taguchi
- 👤 Katsuyuki Miyauchi
- 👤 Keiji Onishi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 14:07
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/058; H03H9/059; H03H9/0538; H03H9/0547; H03H9/10; H03H9/1064; H03H9/1071; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
142 words
A surface acoustic wave device comprising: a dielectric substrate comprising an input electrode and an output electrode and a grounding electrode on a first surface of said dielectric substrate, and an outer electrode on a second surface of said dielectric substrate, a surface acoustic wave element comprising an electrode pad and a comb-shaped electrode disposed on a first surface of said surface acoustic wave element, said surface acoustic wave element bonded to said dielectric substrate by face-down method via a metal bump and a conductive resin formed on said electrode pad, an insulating resin deposited on the periphery of said metal bump, and a guard layer longer in height than the metal bump and shorter in height than the surface acoustic wave element, said guard layer being formed adjacent the surface acoustic wave element on said first surface of said dielectric substrate.
Claim 2
Dependent Claim
142 words
A surface acoustic wave device comprising: a dielectric substrate comprising an input electrode and an output electrode and a grounding electrode on a first surface of said dielectric substrate, and an outer electrode on a second surface of said dielectric substrate, a surface acoustic wave element comprising an electrode pad and a comb-shaped electrode disposed on a first surface of said surface acoustic wave element, said surface acoustic wave element bonded to said dielectric substrate by face-down method via a metal bump and a conductive resin formed on said electrode pad, an insulating resin deposited on the periphery of said metal bump, and a guard layer longer in height than the metal bump and shorter in height than the surface acoustic wave element, said guard layer being formed adjacent the surface acoustic wave element on said first surface of said dielectric substrate.
Claim 3
Dependent Claim
33 words
A surface acoustic wave device of claim 1, wherein said surface acoustic wave element comprises a piezoelectric substrate selected from the group consisting of lithium tantalate, lithium niobate, lithium borate, and rock crystal.
Claim 4
Dependent Claim
16 words
A surface acoustic wave device of claim 1, wherein the metal bump comprises gold or aluminum.
Claim 5
Dependent Claim
21 words
A surface acoustic wave device of claim 1, wherein the guard layer comprises the same dielectric material as the dielectric substrate.
Claim 6
Dependent Claim
52 words
A surface acoustic wave device of claim 1, wherein the material of the dielectric substrate is a low temperature baking material that can be baked at 1000° C. or less, and the conductors for forming the input and output electrodes, grounding electrode, and outer electrode comprise a silver compound or copper compound.
Claim 7
Dependent Claim
37 words
A surface acoustic wave device of claim 1, wherein the guard layer comprises a metal ring, and the guard layer is electrically connected with the grounding electrode, and not electrically connected with the input and output electrodes.
Claim 8
Dependent Claim
26 words
A surface acoustic wave device of claim 1, wherein metal bumps are disposed on opposing sides of the first surface of the surface acoustic wave element.
Claim 9
Dependent Claim
39 words
A surface acoustic wave device of claim 7, wherein the metal bumps disposed on opposing sides of the first surface of the surface acoustic wave element are disposed alternately so as to form two rows on each opposing side.
Claim 10
Dependent Claim
37 words
A surface acoustic wave device of claim 1, wherein a second guard layer is formed on the first surface of the surface acoustic wave element so as to be positioned between the metal bump and comb-shaped electrode.
Claim 11
Dependent Claim
29 words
A surface acoustic wave device of claim 9, wherein the second guard layer formed on the first surface of the surface acoustic wave element comprises a sound absorbing material.
Claim 12
Dependent Claim
49 words
A surface acoustic wave device of claim 1, wherein the dielectric substrate is a multi-layer substrate having at least one grounding electrode layer interposed in the multi-layer substrate, and the grounding electrode formed on the first surface of the multi-layer substrate is electrically connected with said grounding electrode layer.
Claim 13
Dependent Claim
93 words
A surface acoustic wave device of claim 1, wherein the dielectric substrate is a multi-layer substrate comprising a laminate structure of at least four layers, grounding electrode layers are formed on a principal surface side of the second layer and fourth layer from a top layer, a matching circuit unit comprising strip lines and capacitor electrode is formed on a principal surface side of the third layer from the top layer, said matching circuit unit is electrically connected with the input and output electrodes formed on a principal surface of the first layer.
Claim 14
Dependent Claim
147 words
A surface acoustic wave device comprising: a dielectric substrate comprising an input electrode and an output electrode and a grounding electrode on a first surface of said dielectric substrate, and an outer electrode on a second surface of said dielectric substrate; a surface acoustic wave element comprising an electrode pad and a comb-shaped electrode disposed on a first surface of said surface acoustic wave element, said surface acoustic wave element bonded to said dielectric substrate by face-down method via a metal bump and a conductive resin formed on said electrode pad; an insulating resin deposited on the periphery of said metal bump; and a guard layer shorter in height than the surface acoustic wave element, said guard layer being formed adjacent the surface acoustic wave element on said first surface of said dielectric substrate, wherein the guard layer comprises the same dielectric material as the dielectric substrate.
Claim 15
Dependent Claim
147 words
A surface acoustic wave device comprising: a dielectric substrate comprising an input electrode and an output electrode and a grounding electrode on a first surface of said dielectric substrate, and an outer electrode on a second surface of said dielectric substrate; a surface acoustic wave element comprising an electrode pad and a comb-shaped electrode disposed on a first surface of said surface acoustic wave element, said surface acoustic wave element bonded to said dielectric substrate by face-down method via a metal bump and a conductive resin formed on said electrode pad; an insulating resin deposited on the periphery of said metal bump; and a guard layer shorter in height than the surface acoustic wave element, said guard layer being formed adjacent the surface acoustic wave element on said first surface of said dielectric substrate, wherein the guard layer comprises the same dielectric material as the dielectric substrate.
Claim 16
Dependent Claim
163 words
A surface acoustic wave device comprising: a dielectric substrate comprising an input electrode and an output electrode and a grounding electrode on a first surface os said dielectric substrate, and an outer electrode on a second surface of said dielectric substrate, a surface acoustic wave element comprising an electrode pad and a comb-shaped electrode disposed on a first surface of said surface acoustic wave element, said surface acoustic wave element bonded to said dielectric substrate by face-down method via a metal bump and a conductive resin formed on said electrode pad, an insulating resin deposited on the periphery of said metal bump, and a guard layer shorter in height than the surface acoustic wave element, said guard layer being formed adjacent the surface acoustic wave element on said first surface of said dielectric substrate, wherein a second guard layer is formed on the first surface of the surface acoustic wave element so as to be positioned between the metal bump and comb-shaped electrode.
Claim 17
Dependent Claim
163 words
A surface acoustic wave device comprising: a dielectric substrate comprising an input electrode and an output electrode and a grounding electrode on a first surface os said dielectric substrate, and an outer electrode on a second surface of said dielectric substrate, a surface acoustic wave element comprising an electrode pad and a comb-shaped electrode disposed on a first surface of said surface acoustic wave element, said surface acoustic wave element bonded to said dielectric substrate by face-down method via a metal bump and a conductive resin formed on said electrode pad, an insulating resin deposited on the periphery of said metal bump, and a guard layer shorter in height than the surface acoustic wave element, said guard layer being formed adjacent the surface acoustic wave element on said first surface of said dielectric substrate, wherein a second guard layer is formed on the first surface of the surface acoustic wave element so as to be positioned between the metal bump and comb-shaped electrode.
Claim 18
Dependent Claim
29 words
The surface acoustic wave device of claim 14, wherein the second guard layer formed on the first surface of the surface acoustic wave element comprises a sound absorbing material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-12-15 | 2001-06-16 | 2001-12-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-12-15 | 2005-06-16 | 2005-12-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-12-15 | 2009-06-16 | 2009-12-16 | $7700.00 | Window Closed / Lapsed |