US5689106A
Expired / Lapsed
US
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Optical device assembly having a metallic bump bonding together two planar optical components, and its preparation
Assignee: Raytheon Co
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Filing: 1994-12-22
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Granted: 1997-11-18
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Expires: 2014-12-22
Abstract
Abstract An optical device assembly includes a planar optical filter and a planar sensor having an optically active area. The optical filter and the sensor are joined together with a gap therebetween by a metallic bump extending between the optical filter and the sensor. The metallic bump, which is preferably indium, is positioned at a location outside of the optically active area of the planar sensor. The metallic bump is preferably formed by vapor depositing an indium subbump on the optical filter and another indium subbump on the planar sensor, in each case outside of their optically active areas, and thereafter pressing the two subbumps together to complete the bonding.
Inventors
- 👤 Michael J. Dahlin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 07:39
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10W; H10W90/00
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
110 words
An optical device assembly, comprising: a planar optical filter having a first face; a planar sensor having a second face and an optically active area; means for joining the optical filter to the sensor with a gap therebetween, the means for joining comprising a cold-weldable metallic bump extending between the first face of the optical filter and the second face of the sensor, a first bond between the metallic bump and the first face of the optical filter, and a second bond between the metallic bump and the second face of the sensor, the second bond being at a location outside of the optically active area of the planar sensor.
Claim 2
Dependent Claim
110 words
An optical device assembly, comprising: a planar optical filter having a first face; a planar sensor having a second face and an optically active area; means for joining the optical filter to the sensor with a gap therebetween, the means for joining comprising a cold-weldable metallic bump extending between the first face of the optical filter and the second face of the sensor, a first bond between the metallic bump and the first face of the optical filter, and a second bond between the metallic bump and the second face of the sensor, the second bond being at a location outside of the optically active area of the planar sensor.
Claim 3
Dependent Claim
13 words
The assembly of claim 1, wherein the metallic bump is made of indium.
Claim 4
Dependent Claim
18 words
The assembly of claim 1, wherein the metallic bump has a height of at least about 60 micrometers.
Claim 5
Dependent Claim
36 words
The assembly of claim 1, wherein the metallic bump comprises a first subbump on the planar optical filter, and a second subbump on the planar sensor, the first subbump being cold-weld bonded to the second subbump.
Claim 6
Dependent Claim
55 words
The assembly of claim 1, wherein the planar sensor comprises a readout layer, a detector layer, and an electrical interconnect between the readout layer and the detector layer, the second face of the sensor being on the readout layer and the gap lying between the detector layer and the first face of the optical filter.
Claim 7
Dependent Claim
54 words
The assembly of claim 1, wherein the planar sensor comprises a readout layer, a detector layer, and an electrical interconnect between the readout layer and the detector layer, and wherein the means for joining further includes a reinforcement lying adjacent to the metallic bump but not between the detector layer and the optical filter.
Claim 8
Dependent Claim
27 words
The assembly of claim 1, further including a reinforcement lying adjacent to the metallic bump, the reinforcement contacting the planar sensor outside of its optically active area.
Claim 9
Dependent Claim
15 words
The assembly of claim 7, wherein the reinforcement is a mass of a curable adhesive.
Claim 10
Dependent Claim
84 words
An optical device assembly, comprising: a planar first optical component; a planar second optical component having an optically active area, the first optical component being positioned in a facing relationship to the second optical component with a gap therebetween; and a cold-weldable metallic bump extending between the first optical component and the second optical component and bonding the first optical component and the second optical component together, the metallic bump contacting the second optical component at a location outside of its optically active area.
Claim 11
Dependent Claim
84 words
An optical device assembly, comprising: a planar first optical component; a planar second optical component having an optically active area, the first optical component being positioned in a facing relationship to the second optical component with a gap therebetween; and a cold-weldable metallic bump extending between the first optical component and the second optical component and bonding the first optical component and the second optical component together, the metallic bump contacting the second optical component at a location outside of its optically active area.
Claim 12
Dependent Claim
21 words
The assembly of claim 9, wherein the first optical component is a filter and the second optical component is a sensor.
Claim 13
Dependent Claim
13 words
The assembly of claim 9, wherein the metallic bump is made of indium.
Claim 14
Dependent Claim
18 words
The assembly of claim 9, wherein the metallic bump has a height of at least about 60 micrometers.
Claim 15
Dependent Claim
28 words
The assembly of claim 9, further including a reinforcement lying adjacent to the metallic bump, the reinforcement contacting the second optical component outside of its optically active area.
Claim 16
Dependent Claim
15 words
The assembly of claim 13, wherein the reinforcement is a mass of a curable adhesive.
Claim 17
Independent Claim
119 words
A method for preparing an optical device assembly, comprising the steps of: furnishing a planar first optical component having a first optically active area; furnishing a planar second optical component having a second optically active area; depositing a first subbump on the first optical component outside of the first optically active area; depositing a second subbump on the second optical component outside of the second optically active area; arranging the two optical components in a generally facing relationship with the first subbump and the second subbump aligned and in a facing relationship; and pressing the first optical component toward the second optical component to cause the first subbump and the second subbump to weld together, forming a bump therebetween.
Claim 18
Independent Claim
119 words
A method for preparing an optical device assembly, comprising the steps of: furnishing a planar first optical component having a first optically active area; furnishing a planar second optical component having a second optically active area; depositing a first subbump on the first optical component outside of the first optically active area; depositing a second subbump on the second optical component outside of the second optically active area; arranging the two optical components in a generally facing relationship with the first subbump and the second subbump aligned and in a facing relationship; and pressing the first optical component toward the second optical component to cause the first subbump and the second subbump to weld together, forming a bump therebetween.
Claim 19
Dependent Claim
55 words
The method of claim 15, wherein the step of arranging includes the step of positioning tooling between the first optical component and the second optical component to define a final spacing therebetween, and wherein the step of pressing includes the step of continuing the pressing until the optical components are separated by the final spacing.
Claim 20
Dependent Claim
27 words
The method of claim 15, wherein the step of depositing the first subbump includes the step of depositing indium metal as the material of the first subbump.
Claim 21
Dependent Claim
27 words
The method of claim 15, wherein the step of depositing the second subbump includes the step of depositing indium metal as the material of the second subbump.
Claim 22
Dependent Claim
11 words
An optical device assembly prepared by the method of claim 15.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-11-17 | 2001-05-19 | 2001-11-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-11-17 | 2005-05-19 | 2005-11-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-11-17 | 2009-05-19 | 2009-11-18 | $7700.00 | Window Closed / Lapsed |