US5675474A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Highly heat-radiating ceramic package
Assignee: Mitsubishi Materials Corp
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Filing: 1995-07-17
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Granted: 1997-10-07
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Expires: 2015-07-17
Abstract
Abstract Highly heat-radiating ceramic packages comprising a multi-layer ceramic wiring board 11 to one surface of which is bonded a heat-radiating ceramic base plate 13 with first and second aluminum plates 31 and 32 bonded to both surfaces thereof, via the first aluminum plate 31 are free from warping and cracking, and have improved heat-radiation performance and lower weight and manufacturing cost. The ceramic base plate 13 and the multi-layer ceramic wiring board 11 may be constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide. The two aluminum plates 31 and 32 are bonded to the ceramic base plate 13 with an Al-Si brazing material. Improved levels of heat radiation performance are accomplished by bonding a heat-radiating ceramic base plate with an aluminum plate bonded thereto, to a multi-layer wiring board prepared even by low-temperature sintering.
Inventors
- 👤 Toshiyuki Nagase
- 👤 Yoshio Kanda
- 👤 Yoshiro Kuromitu
- 👤 Masafumi Hatsushika
- 👤 Hirokazu Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:57
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H10W40/25; H10W40/255; H10W40/231; H10W40/235; H10W40/237; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/737; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
129 words
A highly heat-radiating ceramic package comprising: a multi-layer ceramic wiring board; a heat-radiating ceramic base plate; a first aluminum plate bonded to one surface of said heat-radiating ceramic base plate using an Al-Si brazing material; a second aluminum plate bonded to the other surface of said heat-radiating ceramic base plate using an Al-Si brazing material; wherein said multi-layer ceramic wiring board is bonded to said first aluminum plate using an Al-Si brazing material, wherein said first aluminum plate is between said multi-layer wiring board and said heat-radiating ceramic base plate; and said multi-layer ceramic wiring board and said heat-radiating ceramic base plate being constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide.
Claim 2
Dependent Claim
129 words
A highly heat-radiating ceramic package comprising: a multi-layer ceramic wiring board; a heat-radiating ceramic base plate; a first aluminum plate bonded to one surface of said heat-radiating ceramic base plate using an Al-Si brazing material; a second aluminum plate bonded to the other surface of said heat-radiating ceramic base plate using an Al-Si brazing material; wherein said multi-layer ceramic wiring board is bonded to said first aluminum plate using an Al-Si brazing material, wherein said first aluminum plate is between said multi-layer wiring board and said heat-radiating ceramic base plate; and said multi-layer ceramic wiring board and said heat-radiating ceramic base plate being constructed with the same or different types of ceramic which are selected from the group consisting of alumina, glass ceramic, aluminum nitride, mullite, and silicon carbide.
Claim 3
Dependent Claim
35 words
A highly heat-radiating ceramic package as claimed in claim 1, wherein the total thickness of said first aluminum plate and said second aluminum plate is 10-200% of the thickness of said heat-radiating ceramic base plate.
Claim 4
Dependent Claim
47 words
A highly heat-radiating ceramic package as claimed in claim 1, wherein a heat-radiating fin made of an aluminum material is bonded to said second aluminum plate with an Al-Si brazing material, wherein said second aluminum plate is between said heat-radiating fin and said heat-radiating ceramic base plate.
Claim 5
Dependent Claim
31 words
A highly heat-radiating ceramic package as claimed in claim 1, wherein a heat-conducting through-hole is bored in the heat-radiating ceramic base plate, and an aluminum material is charged in said through-hole.
Claim 6
Dependent Claim
33 words
A highly heat-radiating ceramic package as claimed in claim 1, wherein a plurality of I/O pins are bonded to the other surface of the multilayer ceramic wiring board with an Al-Si brazing material.
Claim 7
Dependent Claim
56 words
A highly heat-radiating ceramic package which comprises a multi-layer alumina wiring board bonded to an aluminum plate using an Al-Si brazing material, and said aluminum plate is bonded to a heat-radiating alumina base plate using an Al-Si brazing material, wherein said aluminum plate is between said multi-layer alumina wiring board and said heat-radiating alumina base plate.
Claim 8
Dependent Claim
56 words
A highly heat-radiating ceramic package which comprises a multi-layer alumina wiring board bonded to an aluminum plate using an Al-Si brazing material, and said aluminum plate is bonded to a heat-radiating alumina base plate using an Al-Si brazing material, wherein said aluminum plate is between said multi-layer alumina wiring board and said heat-radiating alumina base plate.
Claim 9
Dependent Claim
28 words
A highly heat-radiating ceramic package as claimed in claim 6, wherein the thickness of the aluminum plate is 10-200% of the thickness of said heat-irradiating alumina base plate.
Claim 10
Dependent Claim
36 words
A highly heat-radiating ceramic package as claimed in claim 6, wherein a heat-radiating fin made of an aluminum material is bonded to the heat-radiating surface of said heat-radiating alumina base plate with an Al-Si brazing material.
Claim 11
Dependent Claim
33 words
A highly heat-radiating ceramic package as claimed in claim 6, wherein a plurality of I/O pins are bonded to the other surface of said multi-layer alumina wiring board with an Al-Si brazing material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-06 | 2001-04-07 | 2001-10-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-06 | 2005-04-07 | 2005-10-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-06 | 2009-04-07 | 2009-10-07 | $7700.00 | Window Closed / Lapsed |