← Back to Patent Explorer
US5675298A Expired / Lapsed US ⏱️ 0.0 years remaining

Low-loss, low-inductance interconnect for microcircuits

Assignee: Sun Microsystems Inc
•
Filing: 1995-11-21
•
Granted: 1997-10-07
•
Expires: 2015-11-21
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A low-loss, low-inductance metal interconnect for an electrical signal in a microcircuit comprises a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer. The metal interconnect lines are interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in the plane. The metal interconnect lines together comprise a signal interconnect path, and the metal lines are coupled to a fixed voltage potential, such as ground.

Inventors

  • 👤 Raghunand Bhagwan
  • 👤 Alan Rogers
  • 👤 John MacDonald

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 20:08
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/495

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 88 words
A metal interconnect for an electrical signal comprising a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together, said metal interconnect lines interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in said plane, wherein ones of said metal lines are the outermost lines, said metal interconnect lines together comprising a single signal interconnect path, said metal lines comprising a low impedance signal return path coupled to a fixed voltage potential.
Claim 2
Dependent Claim 88 words
A metal interconnect for an electrical signal comprising a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together, said metal interconnect lines interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in said plane, wherein ones of said metal lines are the outermost lines, said metal interconnect lines together comprising a single signal interconnect path, said metal lines comprising a low impedance signal return path coupled to a fixed voltage potential.
Claim 3
Dependent Claim 92 words
A metal interconnect for an electrical signal comprising: a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together; a plurality of spaced-apart generally parallel metal lines disposed in said plane and interleaved with and electrically insulated from said metal interconnect lines said metal lines coupled to a fixed voltage potential, wherein ones of said metal lines are the outermost lines; wherein said metal interconnect lines together comprise a single signal interconnect path for signals having a bandwidth exceeding about 1 GHz.
Claim 4
Dependent Claim 92 words
A metal interconnect for an electrical signal comprising: a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together; a plurality of spaced-apart generally parallel metal lines disposed in said plane and interleaved with and electrically insulated from said metal interconnect lines said metal lines coupled to a fixed voltage potential, wherein ones of said metal lines are the outermost lines; wherein said metal interconnect lines together comprise a single signal interconnect path for signals having a bandwidth exceeding about 1 GHz.
Claim 5
Dependent Claim 95 words
A metal interconnect for an electrical signal comprising a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together, said metal interconnect lines interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in said plane, wherein ones of said metal lines are the outermost lines, said metal interconnect lines together comprising a single signal interconnect path and having a cumulative width w, wherein w>>δ, wherein δ is the skin depth, said metal lines coupled to a fixed voltage potential.
Claim 6
Dependent Claim 95 words
A metal interconnect for an electrical signal comprising a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer and electrically connected together, said metal interconnect lines interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in said plane, wherein ones of said metal lines are the outermost lines, said metal interconnect lines together comprising a single signal interconnect path and having a cumulative width w, wherein w>>δ, wherein δ is the skin depth, said metal lines coupled to a fixed voltage potential.
Claim 7
Independent Claim 87 words
A method for providing a metal interconnect for an electrical signal comprising the steps of: providing a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer; providing a plurality of spaced-apart generally parallel metal lines disposed in said plane interleaved with and electrically insulated from said metal interconnect lines, wherein ones of said metal lines are the outermost lines; connecting said metal interconnect lines together to a single signal source; and connecting said metal lines to a fixed voltage potential.
Claim 8
Independent Claim 87 words
A method for providing a metal interconnect for an electrical signal comprising the steps of: providing a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer; providing a plurality of spaced-apart generally parallel metal lines disposed in said plane interleaved with and electrically insulated from said metal interconnect lines, wherein ones of said metal lines are the outermost lines; connecting said metal interconnect lines together to a single signal source; and connecting said metal lines to a fixed voltage potential.

References Cited (Backward Citations)

US3179904A Cited
US3763306A Cited
US4835496A Cited
US5543751A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-10-06 2001-04-07 2001-10-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-10-06 2005-04-07 2005-10-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-10-06 2009-04-07 2009-10-07 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag