US5674343A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing a semiconductor
Assignee: Nitto Denko Corp
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Filing: 1995-04-13
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Granted: 1997-10-07
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Expires: 2015-04-13
Abstract
Abstract A method of manufacturing a semiconductor and a lamination therefor, in which fixing materials are temporarily fixed to the molding faces of a mold through release films. The semiconductor element is then placed in the mold and molding resin is injected into the mold. The resin is heated to produce the semiconductor device. During this process, the fixing materials become embedded in each of the opposite surfaces of the resin.
Inventors
- 👤 Yuuji Hotta
- 👤 Hitomi Shigyo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:31
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; B29C45/14467; H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/017; H10W76/00; H10W76/40; B29C2045/14532; Y; Y10; Y10T; Y10T428/00; Y10T428/14; Y10T428/1486; Y10T428/22; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
73 words
A method for manufacturing a semiconductor device wherein metal film is fixed on a surface of a package in which a semiconductor element is sealed with molding resin, comprising the steps of: provisionally fixing said metal film on molding faces of a package forming metal mold; placing said semiconductor element in said metal mold; injecting the molding resin into said metal mold; and heating said molding resin to thereby produce said semiconductor device.
Claim 2
Independent Claim
73 words
A method for manufacturing a semiconductor device wherein metal film is fixed on a surface of a package in which a semiconductor element is sealed with molding resin, comprising the steps of: provisionally fixing said metal film on molding faces of a package forming metal mold; placing said semiconductor element in said metal mold; injecting the molding resin into said metal mold; and heating said molding resin to thereby produce said semiconductor device.
Claim 3
Independent Claim
96 words
A method for manufacturing a semiconductor device in which metal film is fixed on a surface of a package in which a semiconductor element is sealed with molding resin, comprising the steps of: provisionally fixing said metal film on molding faces of a package forming metal mold, wherein a release film, having mold releasing property with respect to the molding resin, is disposed between said metal and said molding faces; placing said semiconductor element in said metal mold; injecting the molding resin into said metal mold; and heating said molding resin to produce said semiconductor device.
Claim 4
Independent Claim
96 words
A method for manufacturing a semiconductor device in which metal film is fixed on a surface of a package in which a semiconductor element is sealed with molding resin, comprising the steps of: provisionally fixing said metal film on molding faces of a package forming metal mold, wherein a release film, having mold releasing property with respect to the molding resin, is disposed between said metal and said molding faces; placing said semiconductor element in said metal mold; injecting the molding resin into said metal mold; and heating said molding resin to produce said semiconductor device.
Claim 5
Independent Claim
104 words
A method for manufacturing a semiconductor device in which metal film is fixed on a surface of a package in which a semiconductor element is sealed with molding resin, comprising the steps of: placing said semiconductor element in a package forming metal mold together with composite sheets, wherein each of said composite sheets includes: a release film having mold releasing property with respect to the molding resin, a layer of said metal foil affixed to said release film, and a layer of the molding resin placed over said metal film and said release film; and melting the molding resin to produce said semiconductor device.
Claim 6
Independent Claim
104 words
A method for manufacturing a semiconductor device in which metal film is fixed on a surface of a package in which a semiconductor element is sealed with molding resin, comprising the steps of: placing said semiconductor element in a package forming metal mold together with composite sheets, wherein each of said composite sheets includes: a release film having mold releasing property with respect to the molding resin, a layer of said metal foil affixed to said release film, and a layer of the molding resin placed over said metal film and said release film; and melting the molding resin to produce said semiconductor device.
Claim 7
Independent Claim
37 words
The method for manufacturing a semiconductor device according to any one of claims 1 or 2, wherein a surface of said metal foil is provisionally fixed to surface of said metal mold by an adhesive agent layer.
Claim 8
Dependent Claim
42 words
The method for manufacturing a semiconductor device according to claim 4, wherein the adhesive agent layer has a tension shearing adhesive strength with respect to a #280 polished stainless steel plate in a range of from 0.08 to 12.0 Kgf/cm 2 .
Claim 9
Independent Claim
33 words
The method for manufacturing a semiconductor device according to any one of claims 1-3 or 5, wherein said metal foil has a thickness in the range of about 5 μm to 200 μm.
Claim 10
Dependent Claim
34 words
The method for manufacturing a semiconductor device according to claim 3, further comprising the step of injecting additional molding resin at the same time as the step of melting the molding resin is performed.
Claim 11
Independent Claim
37 words
The method for manufacturing a semiconductor device according to any one of claims 3 or 7, wherein a surface of said metal foil is provisionally fixed to a surface of said release film by an adhesive layer.
Claim 12
Independent Claim
80 words
A method for manufacturing a semiconductor device wherein a moisture resisting material is embedded in opposed surfaces of a package in which a semiconductor element is sealed with molding resin, the method comprising the steps of: provisionally affixing said moisture resisting material to opposed molding faces of a package forming metal mold; placing said semiconductor element between said opposed molding faces of said metal mold; and molding the molding resin in said metal mold to thereby produce said semiconductor device.
Claim 13
Independent Claim
80 words
A method for manufacturing a semiconductor device wherein a moisture resisting material is embedded in opposed surfaces of a package in which a semiconductor element is sealed with molding resin, the method comprising the steps of: provisionally affixing said moisture resisting material to opposed molding faces of a package forming metal mold; placing said semiconductor element between said opposed molding faces of said metal mold; and molding the molding resin in said metal mold to thereby produce said semiconductor device.
Claim 14
Independent Claim
21 words
The method for manufacturing a semiconductor device according to claims 9, wherein said step of molding is performed by injection molding.
Claim 15
Independent Claim
21 words
The method for manufacturing a semiconductor device according to claims 9, wherein said step of molding is performed by transfer molding.
Claim 16
Independent Claim
26 words
The method for manufacturing a semiconductor device according to claims 9, wherein said step of molding is performed by injection molding in combination with transfer molding.
Claim 17
Independent Claim
30 words
The method for manufacturing a semiconductor device according to claims 9, wherein said moisture resisting material is affixed directly to each of said molding faces by a layer of adhesive.
Claim 18
Independent Claim
37 words
The method for manufacturing a semiconductor device according to claims 9, wherein said moisture resisting material is affixed to a release film by a layer of adhesive, and said release film is affixed to said molding face.
Claim 19
Independent Claim
28 words
The method for manufacturing a semiconductor device according to claims 14, wherein a layer of molding resin is formed over said moisture resisting material before said molding step.
Claim 20
Independent Claim
27 words
The method for manufacturing a semiconductor device according to claims 15, wherein said layer of molding resin has a thickness of about 0.1 mm to 1 mm.
Claim 21
Independent Claim
33 words
The method for manufacturing a semiconductor device according to claims 9, wherein said moisture resisting material is a sheet of material selected from the group consisting of: aluminum, stainless steel, copper, and nickel.
Claim 22
Independent Claim
25 words
The method for manufacturing a semiconductor device according to claims 9, wherein said moisture resisting material is a sheet of a low moisture absorbing resin.
Claim 23
Independent Claim
27 words
The method for manufacturing a semiconductor device according to claims 18, wherein said low moisture resisting resin is selected from the group consisting of: polycarbodiimide and polytetrafluoroethylene.
References Cited (Backward Citations)
US2765248A
Cited
US3715423A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-06 | 2001-04-07 | 2001-10-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-06 | 2005-04-07 | 2005-10-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-06 | 2009-04-07 | 2009-10-07 | $7700.00 | Window Closed / Lapsed |