Abstract A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.
A chip to interposer aligning and clamping tool comprising: an interposer having a plurality of contacts thereon; a body fixture for holding said interposer in a fixed position; means for temporarily holding a chip having a plurality of contacts in a specified chip position on the surface of said interposer, said plurality of interposer contacts corresponding in number and position to said plurality of chip contacts; means for selectively clamping said chip on said interposer in said position with a compressive force selected from the range of between 5 and 50 grams for each contact on said chip to electrically bond each of said chip contacts to a corresponding one of said contacts on said interposer.
Claim 2
Dependent Claim
116 words
A chip to interposer aligning and clamping tool comprising: an interposer having a plurality of contacts thereon; a body fixture for holding said interposer in a fixed position; means for temporarily holding a chip having a plurality of contacts in a specified chip position on the surface of said interposer, said plurality of interposer contacts corresponding in number and position to said plurality of chip contacts; means for selectively clamping said chip on said interposer in said position with a compressive force selected from the range of between 5 and 50 grams for each contact on said chip to electrically bond each of said chip contacts to a corresponding one of said contacts on said interposer.
Claim 3
Dependent Claim
42 words
The clamping tool of claim 1 wherein said means for temporarily holding said chip on said interposer includes a hole passing through said interposer beneath said specified position, and vacuum means coupled to said hole for drawing a vacuum through said hole.