US5670034A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Reciprocating anode electrolytic plating apparatus and method
Assignee: STEWART TECHNOLOGIES Inc
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Filing: 1996-06-17
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Granted: 1997-09-23
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Expires: 2016-06-17
Abstract
Abstract A plating system (10) for plating a substrate such as a semiconductor wafer (116) in an electrolytic tank (12). A fixture wheel (14) is mounted within the electrolytic tank to rotate about a first axis (140). The fixture wheel receives the semiconductor wafer and supplies electrical current to the perimeter edge of the wafer. A fixture wheel drive motor (90) drives rotation of the fixture wheel about the first axis. An anode assembly (18) is mounted in the tank spaced from and facing towards the fixture wheel and received semiconductor wafer. The anode assembly carries first and second anodes (72) which are supplied with electrical current. A second motor (142) causes reciprocation of the anode assembly transversely in front of the rotating fixture wheel for improved uniformity in plating thickness and composition.
Inventors
- 👤 Kenneth J. Lowery
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 18:40
CPC Classifications
C; C25; C25D; C25D21/00; C25D21/10; C25D17/00; C25D17/001; C25D5/00; C25D5/04; C25D7/00; C25D7/12; Y; Y10; Y10S; Y10S204/00; Y10S204/07
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
100 words
A plating system for plating a substrate in an electrolyte, comprising: a tank for containing the electrolyte; a fixture wheel, mounted in the tank to rotate about a first axis, the fixture wheel being capable of receiving the substrate and supplying electrical current to the substrate; a first motor for rotating the fixture wheel about the first axis; an anode assembly, mounted in the tank spaced from and facing the fixture wheel, capable of receiving an anode and supplying electrical current to the anode; and a second motor for reciprocating the anode assembly transversely relative to the rotating fixture wheel.
Claim 2
Dependent Claim
100 words
A plating system for plating a substrate in an electrolyte, comprising: a tank for containing the electrolyte; a fixture wheel, mounted in the tank to rotate about a first axis, the fixture wheel being capable of receiving the substrate and supplying electrical current to the substrate; a first motor for rotating the fixture wheel about the first axis; an anode assembly, mounted in the tank spaced from and facing the fixture wheel, capable of receiving an anode and supplying electrical current to the anode; and a second motor for reciprocating the anode assembly transversely relative to the rotating fixture wheel.
Claim 3
Dependent Claim
28 words
The plating system of claim 1, further comprising an annular anode shield carried on the anode assembly to focus exposure of the anode relative to the fixture wheel.
Claim 4
Dependent Claim
16 words
The plating system of claim 1, wherein the anode assembly comprising first and second spaced-apart anodes.
Claim 5
Dependent Claim
27 words
The plating system of claim 3, wherein the first and second anodes are disposed in alignment and reciprocated along a line oriented perpendicular to the first axis.
Claim 6
Dependent Claim
24 words
The plating system of claim 3, wherein the first and second anodes are arranged for mounting on the anode assembly to reciprocate in tandem.
Claim 7
Dependent Claim
23 words
The plating system of claim 1, further comprising means for reciprocate the anode assembly along a line oriented perpendicular to the first axis.
Claim 8
Dependent Claim
40 words
The plating system of claim 6, wherein the means for reciprocating the anode assembly reciprocates the anode assembly along a line oriented perpendicular to and at an elevation that is the same as an elevation defined by the first axis.
Claim 9
Dependent Claim
23 words
The plating system of claim 1, further comprising means for reciprocating the anode assembly along a line oriented perpendicular to the first axis.
Claim 10
Dependent Claim
39 words
The plating system of claim 1, wherein the means for reciprocating the anode assembly reciprocates anode assembly along a path of movement which is greater in length than the width of a substrate backing portion of the fixture wheel.
Claim 11
Dependent Claim
33 words
The plating system of claim 1, further comprising control means for controlling at least one of the speed of rotation of the fixture wheel and the speed of reciprocation of the anode assembly.
Claim 12
Dependent Claim
32 words
The plating system of claim 10, wherein the control means comprises means for controlling both the speed of rotation of the fixture wheel and the speed of reciprocation of the anode assembly.
Claim 13
Dependent Claim
37 words
The plating system of claim 1, wherein the fixture wheel has a substrate backing portion including an edge surface portion and an inner surface portion, further comprising means for supplying electrical current to the edge surface portion.
Claim 14
Dependent Claim
52 words
The plating system of claim 12, further comprising means for controlling the speed of rotation of the fixture wheel and/or the speed of reciprocation of the anode to increase exposure of the anode to the inner surface portion of the fixture wheel relative to the edge surface portion of the fixture wheel.
Claim 15
Dependent Claim
68 words
The plating system of claim 13, the fixture wheel adapted to supplies electrical current to the edge surface portion of the fixture wheel and the speed of rotation and/or speed of reciprocation of the anode assembly are controlled by the means for controlling to increase exposure of the anode to the inner surface portion of the fixture wheel relative to the edge surface portion of the fixture wheel.
Claim 16
Dependent Claim
138 words
A plating system for plating a substrate in an electrolyte, comprising: a tank; a substrate fixture suspended in the tank capable of receiving the substrate, the substrate fixture having a perimeter surface portion and an inner surface portion; an electrical contact assembly carried on the substrate fixture for supplying electrical current to the perimeter surface portion of the substrate fixture; a first motor coupled to the substrate fixture for imparting rotary or translational movement to the substrate fixture during plating; an anode suspended in the tank; and a second motor coupled to the anode for imparting rotary or translational movement to the anode during plating; wherein, the first and second motors are operable to increase exposure of the anode to the inner surface portion of the substrate fixture relative to the perimeter surface portion of the substrate fixture.
Claim 17
Dependent Claim
138 words
A plating system for plating a substrate in an electrolyte, comprising: a tank; a substrate fixture suspended in the tank capable of receiving the substrate, the substrate fixture having a perimeter surface portion and an inner surface portion; an electrical contact assembly carried on the substrate fixture for supplying electrical current to the perimeter surface portion of the substrate fixture; a first motor coupled to the substrate fixture for imparting rotary or translational movement to the substrate fixture during plating; an anode suspended in the tank; and a second motor coupled to the anode for imparting rotary or translational movement to the anode during plating; wherein, the first and second motors are operable to increase exposure of the anode to the inner surface portion of the substrate fixture relative to the perimeter surface portion of the substrate fixture.
Claim 18
Dependent Claim
94 words
A plating system for plating a substrate in an electrolytic bath, comprising: a substrate fixture for mounting and supplying electrical current to the substrate; an anode assembly for mounting and supplying electrical current to an anode; rotary means for rotating one of the substrate fixture and anode assembly about a first axis; translation means for translating the other of the substrate fixture and anode assembly transversely to the axis of rotation; and control means for controlling the speed of rotation relative to the speed of translation to increase uniformity of plating on the substrate.
Claim 19
Dependent Claim
94 words
A plating system for plating a substrate in an electrolytic bath, comprising: a substrate fixture for mounting and supplying electrical current to the substrate; an anode assembly for mounting and supplying electrical current to an anode; rotary means for rotating one of the substrate fixture and anode assembly about a first axis; translation means for translating the other of the substrate fixture and anode assembly transversely to the axis of rotation; and control means for controlling the speed of rotation relative to the speed of translation to increase uniformity of plating on the substrate.
Claim 20
Dependent Claim
90 words
A plating system for plating a substrate in an electrolytic bath, comprising: a substrate fixture for mounting and supplying electrical current to the substrate; means for rotating the substrate fixture about a first axis; an anode assembly for mounting and supplying electrical current to an anode; means for moving the anode assembly transversely relative to the rotating substrate fixture; and control means for controlling the speed of movement of the anode assembly relative to the speed of rotation of the substrate fixture to increase uniformity of plating on the substrate.
Claim 21
Dependent Claim
90 words
A plating system for plating a substrate in an electrolytic bath, comprising: a substrate fixture for mounting and supplying electrical current to the substrate; means for rotating the substrate fixture about a first axis; an anode assembly for mounting and supplying electrical current to an anode; means for moving the anode assembly transversely relative to the rotating substrate fixture; and control means for controlling the speed of movement of the anode assembly relative to the speed of rotation of the substrate fixture to increase uniformity of plating on the substrate.
Claim 22
Independent Claim
79 words
A method for electrolytic plating of a substrate in an electrolytic bath, comprising the steps of: mounting the substrate on a substrate fixture suspended within the electrolytic bath, with the substrate being oriented in spaced disposition relative to an anode also suspended within the electrolytic bath; rotating one of the substrate fixture and anode about a first axis of rotation; and translating the other of the substrate fixture and anode transversely relative to the axis of rotation during plating.
Claim 23
Independent Claim
79 words
A method for electrolytic plating of a substrate in an electrolytic bath, comprising the steps of: mounting the substrate on a substrate fixture suspended within the electrolytic bath, with the substrate being oriented in spaced disposition relative to an anode also suspended within the electrolytic bath; rotating one of the substrate fixture and anode about a first axis of rotation; and translating the other of the substrate fixture and anode transversely relative to the axis of rotation during plating.
Claim 24
Dependent Claim
20 words
The method of claim 18, further comprising shielding the anode to focus exposure of the anode on the mounted substrate.
Claim 25
Dependent Claim
28 words
The method of claim 18, further comprising controlling the speed of movement of the substrate fixture and anode to increase the uniformity of plating deposited on the substrate.
Claim 26
Dependent Claim
55 words
The method of claim 20, further comprising: supplying electrical current to an edge surface portion of a mounted substrate; and controlling movement of the anode relative to movement of the substrate fixture to increase exposure of the anode to an inner surface portion of the substrate relative to the edge surface portion of the substrate.
Claim 27
Dependent Claim
22 words
The method of claim 18, wherein the movement of the anode comprises movement of an anode assembly carrying first and second anodes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-22 | 2001-03-24 | 2001-09-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-22 | 2005-03-24 | 2005-09-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-22 | 2009-03-24 | 2009-09-23 | $7700.00 | Window Closed / Lapsed |