US5663530A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire bond tape ball grid array package
Assignee: 3M Co
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Filing: 1995-08-01
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Granted: 1997-09-02
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Expires: 2015-08-01
Abstract
Abstract A tape ball grid array package reverses the usual attachment of flexible circuitry to a stiffener so that the circuit traces face the stiffener rather than away from the stiffener as is conventional. This construction allows the elimination of a previously necessary solder mask and so reduces the cost to produce the package.
Inventors
- 👤 Randolph D. Schueller
- 👤 Anthony R. Plepys
- 👤 Howard E. Evans
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/20; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H10W70/682; H10W70/685; H10W72/50; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W74/127; H10W90/731; H10W90/736; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
133 words
An improved package for an electronic device including a polymeric base sheet, electrically conductive traces formed on at least one side of the base sheet, a series of spaces between portions of a number of the conductive traces, at least one opening in the polymeric base sheet which exposes at least one bond pad for connection to the electronic device, a stiffener and an adhesive for bonding the base sheet to the stiffener, the improvement comprising bonding the base sheet to the stiffener with conductive traces adjacent the stiffener by means of a bonding adhesive having a sufficiently low complex viscosity at bonding temperature to substantially completely fill the spaces between the conductive traces and a sufficiently high complex viscosity at bonding temperature to prevent the adhesive from flowing over the bond pad.
Claim 2
Dependent Claim
133 words
An improved package for an electronic device including a polymeric base sheet, electrically conductive traces formed on at least one side of the base sheet, a series of spaces between portions of a number of the conductive traces, at least one opening in the polymeric base sheet which exposes at least one bond pad for connection to the electronic device, a stiffener and an adhesive for bonding the base sheet to the stiffener, the improvement comprising bonding the base sheet to the stiffener with conductive traces adjacent the stiffener by means of a bonding adhesive having a sufficiently low complex viscosity at bonding temperature to substantially completely fill the spaces between the conductive traces and a sufficiently high complex viscosity at bonding temperature to prevent the adhesive from flowing over the bond pad.
Claim 3
Dependent Claim
44 words
A package for an electronic device according to claim 1 further including a layer of cushioning adhesive between the bonding adhesive and the stiffener, the cushioning adhesive having less stiffness than the bonding adhesive at temperatures at which the electronic device is normally used.
Claim 4
Dependent Claim
30 words
A package for an electronic device according to claim 1 wherein the polymeric base further includes holes terminating at conductive traces and shaped solder objects soldered to the conductive traces.
Claim 5
Dependent Claim
17 words
A package for an electronic device according to claim 3 wherein the shaped solder objects are spherical.
Claim 6
Dependent Claim
30 words
A package for an electronic device according to claim 2 wherein the polymeric base further includes holes terminating at conductive traces and shaped solder objects soldered to the conductive traces.
Claim 7
Dependent Claim
17 words
A package for an electronic device according to claim 5 wherein the shaped solder objects are spherical.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-09-01 | 2001-03-03 | 2001-09-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-09-01 | 2005-03-03 | 2005-09-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-09-01 | 2009-03-03 | 2009-09-02 | $7700.00 | Window Closed / Lapsed |