Patent JPS6234360A successfully refreshed from Google Patents.
US5658831A
Expired / Lapsed
US
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Method of fabricating an integrated circuit package having a liquid metal-aluminum/copper joint
Assignee: Unisys Corp
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Filing: 1995-06-06
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Granted: 1997-08-19
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Expires: 2015-06-06
Abstract
Abstract An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200Å thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100° C.-300° C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.
Inventors
- 👤 Wilber Terry Layton
- 👤 Blanquita Ortega Morange
- 👤 Angela Marie Torres
- 👤 James Andrew Roecker
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 07:46
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/20; H10W40/25; H10W40/257; H10W72/00; H10W72/30; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/67; H10W70/68; H10W70/682; H10W72/351; H10W72/352; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
98 words
A method of fabricating an integrated circuit package including the steps of: providing--1) a substrate, 2) an integrated circuit chip mounted on said substrate, and 3) a heat conduction mechanism which contains a gap coupled to said chip; saturating a compliant body, having microscopic voids throughout, with a liquid metal alloy; removing a substantial portion of said alloy from said compliant body such that all remaining alloy is held in said voids by surface tension and adhesive forces; and, compressing said compliant body, with said remaining alloy, into said gap without squeezing said alloy out of said body.
Claim 2
Independent Claim
98 words
A method of fabricating an integrated circuit package including the steps of: providing--1) a substrate, 2) an integrated circuit chip mounted on said substrate, and 3) a heat conduction mechanism which contains a gap coupled to said chip; saturating a compliant body, having microscopic voids throughout, with a liquid metal alloy; removing a substantial portion of said alloy from said compliant body such that all remaining alloy is held in said voids by surface tension and adhesive forces; and, compressing said compliant body, with said remaining alloy, into said gap without squeezing said alloy out of said body.
Claim 3
Dependent Claim
21 words
A method according to claim 1 wherein said removing step includes squeezing said compliant body when said alloy is saturated therein.
Claim 4
Dependent Claim
21 words
A method according to claim 1 wherein said removing step includes centrifuging said compliant body when said alloy is saturated therein.
Claim 5
Dependent Claim
21 words
A method according to claim 1 wherein said removing step includes vacuuming said compliant body when said alloy is saturated therein.
Claim 6
Dependent Claim
21 words
A method according to claim 1 wherein said removing step includes shaking said compliant body when said alloy is saturated therein.
Claim 7
Dependent Claim
29 words
A method according to claim 1 wherein said removing step is performed such that films of said alloy remain at random locations in said body across said microscopic voids.
Claim 8
Dependent Claim
22 words
A method according to claim 6 and further including the substep of substantially shrinking said compliant body in thickness by said films.
Claim 9
Independent Claim
126 words
A method of fabricating an integrated circuit package of the type which includes an integrated circuit chip, a substrate which holds said chip, and a heat conduction mechanism coupled to said chip which provides a path for conducting heat from said chip to a fluid medium; wherein said method includes the steps of: forming a liquid coating of a polysiloxane solution on a member which is made primarily of metal selected from the group of aluminum and copper; baking said member with said liquid coating to thereby form a solid polysiloxane coat; placing said member with said solid coat in said heat conducting path; and, including a liquid metal in said heat conducting path such that said liquid metal is in contact with said solid coat.
Claim 10
Independent Claim
126 words
A method of fabricating an integrated circuit package of the type which includes an integrated circuit chip, a substrate which holds said chip, and a heat conduction mechanism coupled to said chip which provides a path for conducting heat from said chip to a fluid medium; wherein said method includes the steps of: forming a liquid coating of a polysiloxane solution on a member which is made primarily of metal selected from the group of aluminum and copper; baking said member with said liquid coating to thereby form a solid polysiloxane coat; placing said member with said solid coat in said heat conducting path; and, including a liquid metal in said heat conducting path such that said liquid metal is in contact with said solid coat.
Claim 11
Dependent Claim
21 words
A method according to claim 8 wherein said forming step includes the substep of dipping said member into said siloxane solution.
Claim 12
Dependent Claim
21 words
A method according to claim 8 wherein said forming step includes the substep of spraying said member with said polysiloxane solution.
Claim 13
Dependent Claim
21 words
A method according to claim 8 wherein said forming step includes the substep of painting said member with said polysiloxane solution.
Claim 14
Dependent Claim
21 words
A method according to claim 8 wherein said forming step includes the substep of spinning said member with said polysiloxane solution.
Claim 15
Dependent Claim
22 words
A method according to claim 8 wherein said baking step heats said aluminum member to temperatures of 100° C. to 300° C.
Claim 16
Dependent Claim
15 words
A method according to claim 8 wherein said polysiloxane solution, by volume, is 50%-100% polydimethylsiloxane.
Claim 17
Dependent Claim
15 words
A method according to claim 8 wherein said polysiloxane solution by volume, is 50%-100% polydimethyldiphynelsiloxane.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-18 | 2001-02-17 | 2001-08-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-18 | 2005-02-17 | 2005-08-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-18 | 2009-02-17 | 2009-08-19 | $7700.00 | Window Closed / Lapsed |