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US5652474A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing cold cathodes

Assignee: BTG International Ltd
•
Filing: 1993-08-04
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Granted: 1997-07-29
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Expires: 2013-08-04
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Abstract

Abstract PCT No. PCT/GB93/01650 Sec. 371 Date Feb. 3, 1995 Sec. 102(e) Date Feb. 3, 1995 PCT Filed Aug. 4, 1993 PCT Pub. No. WO94/03916 PCT Pub. Date Feb. 17, 1994A cold cathode is formed by providing a body of semiconductor having a surface including at least one projection and subjecting the surface to anodic etching to produce thereon a porous layer.

Inventors

  • 👤 Peter Richard Wilshaw
  • 👤 Emily Boswell

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 03:00
CPC Classifications
H; H01; H01J; H01J9/00; H01J9/02; H01J9/022; H01J9/025; H01J2209/00; H01J2209/02; H01J2209/022; H01J2209/0223; H01J2209/0226

Claims Analysis

Total Claims: 17
Claim 1
Independent Claim 31 words
A method of making a cold cathode, by providing a body of a semiconductor having a surface including at least one projection, which method comprises subjecting the surface to anodic etching.
Claim 2
Independent Claim 31 words
A method of making a cold cathode, by providing a body of a semiconductor having a surface including at least one projection, which method comprises subjecting the surface to anodic etching.
Claim 3
Dependent Claim 32 words
A method as claimed in claim 1, wherein the body of semiconductor having a surface including at least one projection itself had cold cathode properties even before being subjected to anodic etching.
Claim 4
Dependent Claim 13 words
A method as claimed in claim 1, wherein the semiconductor is of silicon.
Claim 5
Dependent Claim 25 words
A method as claimed in claim 1, wherein the anodic etching is performed under conditions to form a porous surface layer on the semiconductor body.
Claim 6
Dependent Claim 26 words
A method as claimed in claim 1, wherein the anodic etching is performed by a partial electrochemical dissolution step, followed by a partial chemical dissolution step.
Claim 7
Dependent Claim 19 words
A method as claimed in claim 5 wherein both partial dissolution steps are performed in hydrofluoric acid based solutions.
Claim 8
Dependent Claim 27 words
A cold cathode comprising a body of a semiconductor having a surface including at least one projection and having a porous surface layer of semiconductor or metal.
Claim 9
Dependent Claim 27 words
A cold cathode comprising a body of a semiconductor having a surface including at least one projection and having a porous surface layer of semiconductor or metal.
Claim 10
Dependent Claim 34 words
A cold cathode as claimed in claim 7, wherein the body of semiconductor having a surface including at least one projection itself had cold cathode properties even before formation of the porous surface layer.
Claim 11
Dependent Claim 23 words
A cold cathode as claimed in claim 7, wherein the semiconductor body is of silicon and has a surface layer of porous silicon.
Claim 12
Dependent Claim 20 words
A cold cathode as claimed in claim 7, wherein the surface of the semiconductor body includes an array of projections.
Claim 13
Dependent Claim 33 words
A cold cathode comprising a body of a semiconductor having a surface including at least one projection and having a surface layer of semiconductor or metal which has been subjected to anodic etching.
Claim 14
Dependent Claim 33 words
A cold cathode comprising a body of a semiconductor having a surface including at least one projection and having a surface layer of semiconductor or metal which has been subjected to anodic etching.
Claim 15
Dependent Claim 34 words
A cold cathode as claimed in claim 11, wherein the body of semiconductor having a surface including at least one projection itself had cold cathode properties even before it was subjected to anodic etching.
Claim 16
Dependent Claim 15 words
A cold cathode as claimed in claim 11, wherein the semiconductor body is of silicon.
Claim 17
Dependent Claim 20 words
A cold cathode as claimed in claim 11, wherein the surface of the semiconductor body includes an array of projections.

References Cited (Backward Citations)

EP0351110A1 Cited
US5085746A Cited
EP0508737A1 Cited
US5525857A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-07-28 2001-01-27 2001-07-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-07-28 2005-01-27 2005-07-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-07-28 2009-01-27 2009-07-29 $7700.00 Window Closed / Lapsed

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