US5633480A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed wiring board having a cover lay laminated on a polyimide resin base film containing conductive circuits
Assignee: CMK Corp
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Filing: 1995-10-04
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Granted: 1997-05-27
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Expires: 2015-10-04
Abstract
Abstract Conductive circuits (copper foil) are provided on both surfaces of a basefilm. A first prepreg is laminated onto both surfaces of the basefilm. A cover lay is provided at an opening portion of the basefilm. The cover lay may extend to a through-hole. The semirigid cover lay, made from polyimide-containing resin material, is placed to cover the opening portion, thermocompressed, and bonded to be laminated onto the surface of the basefilm. A second prepreg having an opening portion whose shape is substantially similar to the opening portion of the first prepreg, is laminated on the first prepreg.
Inventors
- 👤 Hiromoto Sato
- 👤 Junzaburo Shirai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 16:38
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4688; H05K3/4691; H05K3/22; H05K3/28; H05K3/281; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
55 words
A printed wiring board comprising: a basefilm having at least one conductive circuit formed thereon; a cover lay laminated onto said basefilm in such a way that a single layer sheet of semirigid polyimide-containing resin material is placed on a surface of said basefilm, where said conductive circuit is provided, and is thermocompressed bonded thereto.
Claim 2
Dependent Claim
55 words
A printed wiring board comprising: a basefilm having at least one conductive circuit formed thereon; a cover lay laminated onto said basefilm in such a way that a single layer sheet of semirigid polyimide-containing resin material is placed on a surface of said basefilm, where said conductive circuit is provided, and is thermocompressed bonded thereto.
Claim 3
Dependent Claim
112 words
A printed wiring board comprising: a basefilm having at least one conductive circuit; a first prepreg having an opening portion laminated onto said basefilm; a cover lay laminated onto said basefilm in such a way that a single layer sheet of semirigid polyimide-containing resin material is placed on said first prepreg in a manner in which said opening portion is overlapped, and thermocompressed to be bonded; a second prepreg having an opening portion whose shape is substantially similar to said opening portion of said first prepreg, which is laminated onto said first prepreg in a manner in which said opening portion of said first prepreg and said second prepreg overlap each other.
Claim 4
Dependent Claim
112 words
A printed wiring board comprising: a basefilm having at least one conductive circuit; a first prepreg having an opening portion laminated onto said basefilm; a cover lay laminated onto said basefilm in such a way that a single layer sheet of semirigid polyimide-containing resin material is placed on said first prepreg in a manner in which said opening portion is overlapped, and thermocompressed to be bonded; a second prepreg having an opening portion whose shape is substantially similar to said opening portion of said first prepreg, which is laminated onto said first prepreg in a manner in which said opening portion of said first prepreg and said second prepreg overlap each other.
Claim 5
Dependent Claim
23 words
A printed wiring board according to claim 2, wherein a surface of said second prepreg is provided with a plurality of conductive circuits.
Claim 6
Dependent Claim
34 words
A printed wiring board according to claim 2, wherein a surface of said second prepreg is provided with a rigid board which has a plurality of conductive layers on which conductive circuits are formed.
Claim 7
Dependent Claim
83 words
A printed wiring board comprising: a basefilm having at least one conductive circuit; a cover lay laminated on said basefilm in such a way that a single layer sheet of semirigid polyimide-containing resin material is placed onto a surface of said basefilm, where said conductive circuit is provided, and is thermocompressed to be bonded; and, a first prepreg having an opening portion smaller than said cover lay, which is laminated onto said basefilm whereby said opening portion is overlapped by said cover lay.
Claim 8
Dependent Claim
83 words
A printed wiring board comprising: a basefilm having at least one conductive circuit; a cover lay laminated on said basefilm in such a way that a single layer sheet of semirigid polyimide-containing resin material is placed onto a surface of said basefilm, where said conductive circuit is provided, and is thermocompressed to be bonded; and, a first prepreg having an opening portion smaller than said cover lay, which is laminated onto said basefilm whereby said opening portion is overlapped by said cover lay.
Claim 9
Dependent Claim
21 words
A printed wiring board according to claim 5, wherein a conductive circuit is provided on a surface of said first prepreg.
Claim 10
Dependent Claim
34 words
A printed wiring board according to claim 5, wherein a rigid board having a plurality of conductive layers on which conductive circuits are formed, which is laminated onto a surface of said first prepreg.
Claim 11
Dependent Claim
23 words
A printed wiring board according to claim 2 or claim 5, wherein said single layer sheet is made from semirigid polyimide-containing resin material.
Claim 12
Dependent Claim
23 words
A printed wiring board according to claim 2 or claim 5, wherein said first prepreg is laminated on both sides of said basefilm.
Claim 13
Dependent Claim
23 words
A printed wiring board according to claim 2 or claim 5, wherein said cover lay is laminated on both sides of said basefilm.
Claim 14
Dependent Claim
27 words
A printed wiring board according to claim 2, wherein said second prepreg is laminated onto said first prepreg which is laminated onto both sides of said basefilm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-26 | 2000-11-25 | 2001-05-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-26 | 2004-11-25 | 2005-05-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-26 | 2008-11-25 | 2009-05-27 | $7700.00 | Window Closed / Lapsed |