US5629560A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package
Assignee: Fujitsu Ltd
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Filing: 1995-06-06
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Granted: 1997-05-13
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Expires: 2015-06-06
Abstract
Abstract The integrated circuit package includes a package body, an integrated circuit chip enclosed airtight in the package body, a lead provided at a lower portion of the package body for connecting the integrated circuit chip to an external circuit, and air blasting means for cooling the package body by forced air cooling. The package body has, at an upper portion thereof, a heat radiation region formed from a fin and an air blasting region in which the air blasting means is disposed. A ventilation flue is formed between the heat radiation region and the air blasting region. This package is particularly superior in its heat radiation properties.
Inventors
- 👤 Tadashi Katsui
- 👤 Katsuhiko Nakata
- 👤 Takashi Kitahara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:27
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/40; H10W40/43; H10W40/70; H10W40/73; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
140 words
An integrated circuit package comprising: a package body having a cover secured to it so as to close up the upper portion of said package body; an integrated circuit chip enclosed airtight in said package body; air blasting means for cooling said package body by forced air cooling, said air blasting means comprising a fan assembly secured to said cover of said package body; said package body further having, at an upper portion thereof, a heat radiation region provided with a plurality of fins projecting from an upper surface of said package body, and an air blasting region in which said air blasting means is disposed, said upper surface being divided by said heat radiation region and said air blasting region; and a ventilation flue formed between said heat radiation region and said air blasting region of said package body.
Claim 2
Dependent Claim
140 words
An integrated circuit package comprising: a package body having a cover secured to it so as to close up the upper portion of said package body; an integrated circuit chip enclosed airtight in said package body; air blasting means for cooling said package body by forced air cooling, said air blasting means comprising a fan assembly secured to said cover of said package body; said package body further having, at an upper portion thereof, a heat radiation region provided with a plurality of fins projecting from an upper surface of said package body, and an air blasting region in which said air blasting means is disposed, said upper surface being divided by said heat radiation region and said air blasting region; and a ventilation flue formed between said heat radiation region and said air blasting region of said package body.
Claim 3
Dependent Claim
128 words
An integrated circuit package comprising: a package body; an integrated circuit chip enclosed airtight in said package body; air blasting means comprising a fan assembly for cooling said package body by forced air cooling; said package body having, at an upper portion thereof, a heat radiation region provided with a plurality of fins projecting from an upper surface of said package body, and an air blasting region in which said air blasting means is disposed, said upper surface being divided by said heat radiation region and said air blasting region; and a ventilation flue formed between said heat radiation region and said air blasting region of said package body; wherein the center of said fan assembly is offset from the center of heat generation of said package body.
Claim 4
Dependent Claim
128 words
An integrated circuit package comprising: a package body; an integrated circuit chip enclosed airtight in said package body; air blasting means comprising a fan assembly for cooling said package body by forced air cooling; said package body having, at an upper portion thereof, a heat radiation region provided with a plurality of fins projecting from an upper surface of said package body, and an air blasting region in which said air blasting means is disposed, said upper surface being divided by said heat radiation region and said air blasting region; and a ventilation flue formed between said heat radiation region and said air blasting region of said package body; wherein the center of said fan assembly is offset from the center of heat generation of said package body.
Claim 5
Dependent Claim
48 words
The integrated circuit package according to claims 1 or 2, wherein said fan assembly includes a motor having a rotary shaft in a thicknesswise direction of said package body, a propeller connected to said rotary shaft of said motor, and a driver circuit section for driving said motor.
Claim 6
Dependent Claim
37 words
The integrated circuit package according to claims 1 or 2, wherein a hollow portion is provided between the upper portion of said package body and said integrated circuit chip; and wherein a liquid fills said hollow portion.
Claim 7
Dependent Claim
29 words
The integrated circuit package according to claims 1 or 2, wherein said package body is formed from a ceramic body, and said fin is integral with said ceramic body.
Claim 8
Dependent Claim
47 words
An integrated circuit package according to claims 1 or 2, wherein said package body has a two-layer structure of a ceramic body and a metal body, and said fin is integral with said metal body while said integrated circuit chip is securely mounted on said metal body.
Claim 9
Dependent Claim
40 words
The integral circuit package according to claims 1 or 2, wherein a hollow portion is provided between the upper portion of said package body and said integrated circuit chip; and wherein a heat pipe is embedded in said hollow portion.
Claim 10
Dependent Claim
25 words
The integrated circuit package according to claim 3, wherein said cover has an opening which communicates with said ventilation flue by way of said propeller.
Claim 11
Dependent Claim
52 words
The integrated circuit package according to claim 8, wherein said cover has an annular projection position on a little outer side of a locus of rotation of said propeller; and wherein the difference in static pressure between said opening of said cover and said ventilation flue is increased by said annular projection.
Claim 12
Dependent Claim
37 words
The integrated circuit package according to claim 9, wherein said propeller is rotated so that air may flow from said opening of said cover to the heat radiation portion of said package body through said ventilation flue.
Claim 13
Dependent Claim
37 words
The integrated circuit package according to claim 9, wherein said propeller is rotated so that air may flow from the heat radiated portion of said package body to said opening of said cover through said ventilation flue.
Claim 14
Dependent Claim
18 words
The integrated circuit package according to claim 2, wherein said fan assembly is secured to said package body.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-05-12 | 2000-11-11 | 2001-05-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-05-12 | 2004-11-11 | 2005-05-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-05-12 | 2008-11-11 | 2009-05-13 | $7700.00 | Window Closed / Lapsed |