US5626906A
Expired / Lapsed
US
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Electrodes comprising conductive perovskite-seed layers for perovskite dielectrics
Assignee: Texas Instruments Inc
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Filing: 1996-02-21
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Granted: 1997-05-06
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Expires: 2016-02-21
Abstract
Abstract A preferred embodiment of this invention comprises a perovskite-seed layer (e.g. calcium ruthenate 40) between a conductive oxide layer (e.g. ruthenium oxide 36) and a perovskite dielectric material (e.g. barium strontium titanate 42), wherein the perovskite-seed layer and the conductive oxide layer each comprise the same metal. The metal should be conductive in its metallic state and should remain conductive when partially or fully oxidized. Generally, the perovskite-seed layer has a perovskite or perovskite-like crystal structure and lattice parameters which are similar to the perovskite dielectric layer formed thereon. At a given deposition temperature, the crystal quality and other properties of the perovskite dielectric will generally be enhanced by depositing it on a surface having a similar crystal structure. Undesirable crystal structure formation will generally be minimized and lower processing temperatures may be used to deposit the perovskite dielectric layer. Another benefit of this electrode system is that the perovskite-seed layer should do little or no reduction of the perovskite dielectric layer.
Inventors
- 👤 Scott R. Summerfelt
- 👤 Howard R. Beratan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 03:35
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/01; C04B35/50
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
72 words
A method of forming a microelectronic structure, said method comprising: (a) forming a conductive oxide layer comprising a first metal; (b) forming a conductive perovskite-seed layer comprising said first metal on said conductive oxide layer; and (c) forming a perovskite dielectric layer on said perovskite-seed layer, whereby the similar crystal structure of the perovskite-seed layer improves the crystal quality of the perovskite dielectric layer and minimizes the formation of non-perovskite crystal structures.
Claim 2
Independent Claim
72 words
A method of forming a microelectronic structure, said method comprising: (a) forming a conductive oxide layer comprising a first metal; (b) forming a conductive perovskite-seed layer comprising said first metal on said conductive oxide layer; and (c) forming a perovskite dielectric layer on said perovskite-seed layer, whereby the similar crystal structure of the perovskite-seed layer improves the crystal quality of the perovskite dielectric layer and minimizes the formation of non-perovskite crystal structures.
Claim 3
Dependent Claim
19 words
The method according to claim 1, wherein said first metal is ruthenium and said conductive oxide is ruthenium dioxide.
Claim 4
Dependent Claim
19 words
The method according to claim 1, wherein said first metal is iridium and said conductive oxide is iridium oxide.
Claim 5
Dependent Claim
13 words
The method according to claim 1, wherein said perovskite-seed layer is calcium ruthenate.
Claim 6
Dependent Claim
33 words
The method according to claim 1, wherein said perovskite-seed layer is selected from the group consisting of SrRuO 3 , BaRuO 3 , CaIrO 3 , SrIrO 3 , and BaIrO 3 .
Claim 7
Dependent Claim
19 words
The method according to claim 1, said method further comprising forming an upper electrode on said perovskite dielectric layer.
Claim 8
Dependent Claim
20 words
The method according to claim 1, said method further comprising forming said conductive oxide layer on a first metallic layer.
Claim 9
Dependent Claim
13 words
The method according to claim 7, wherein said first metallic layer comprises ruthenium.
Claim 10
Dependent Claim
22 words
The method according to claim 1, wherein said conductive oxide layer further comprises unoxidized and partially oxidized forms of said first metal.
Claim 11
Dependent Claim
30 words
The method according to claim 1, wherein said step of forming said conductive oxide comprises forming a first metallic layer and then partially or fully oxidizing said first metallic layer.
Claim 12
Dependent Claim
20 words
The method according to claim 10, wherein said conductive oxide is ruthenium dioxide and said first metallic layer is ruthenium.
Claim 13
Dependent Claim
37 words
The method according to claim 1, wherein said step of forming said perovskite-seed layer comprises forming a selectively reactive layer on said conductive oxide layer and then heating said selectively reactive layer and said conductive oxide layer.
Claim 14
Dependent Claim
33 words
The method according to claim 12, wherein said selectively reactive layer is selected from the group consisting of calcium oxide, strontium oxide, barium oxide, calcium carbonate, strontium carbonate, barium carbonate, and combinations thereof.
Claim 15
Dependent Claim
25 words
The method according to claim 12, wherein said step of forming said perovskite-seed layer further comprises removing any unreacted portions of said selectively reactive layer.
Claim 16
Dependent Claim
19 words
The method according to claim 14, wherein said unreacted portions are removed with a wet etch of deionized water.
Claim 17
Dependent Claim
39 words
The method according to claim 1, wherein said step of forming said perovskite-seed layer comprises forming a metal-deficient layer on said conductive oxide layer and then annealing said metal-deficient layer and said conductive oxide layer in an oxygen atmosphere.
Claim 18
Dependent Claim
14 words
The method according to claim 16, wherein said metal-deficient layer is ruthenium-deficient calcium ruthenate.
Claim 19
Dependent Claim
91 words
The method according to claim 1, wherein said step of forming said conductive oxide and said step of forming said perovskite-seed layer are performed in a combined step, said combined step comprising: forming a first metallic layer; forming a second metallic layer on said first metallic layer; and exposing said first and second metallic layers to oxygen, thereby converting said second metallic layer and a top portion of said first metallic layer into a perovskite-seed layer, and converting an underlying portion of said first metallic layer into a conductive oxide layer.
Claim 20
Dependent Claim
32 words
The method according to claim 18, wherein said first metallic layer is ruthenium, said second metallic layer is calcium, said conductive oxide is ruthenium dioxide, and said perovskite-seed layer is calcium ruthenate.
Claim 21
Independent Claim
106 words
A method of forming a microelectronic structure, said method comprising: (a) forming a conductive oxide layer having a top surface and side surfaces, said oxide layer comprising a first metal; (b) forming a selectively reactive layer on said conductive oxide layer; (c) heating said selectively reactive layer and said conductive oxide layer, thereby causing said selectively reactive layer and said conductive oxide layer to react and form a perovskite seed layer on said conductive oxide layer, said perovskite seed layer comprising said first metal; (d) removing any unreacted portions of said selectively reactive layer; and (e) forming a perovskite dielectric layer on said perovskite seed layer.
Claim 22
Independent Claim
106 words
A method of forming a microelectronic structure, said method comprising: (a) forming a conductive oxide layer having a top surface and side surfaces, said oxide layer comprising a first metal; (b) forming a selectively reactive layer on said conductive oxide layer; (c) heating said selectively reactive layer and said conductive oxide layer, thereby causing said selectively reactive layer and said conductive oxide layer to react and form a perovskite seed layer on said conductive oxide layer, said perovskite seed layer comprising said first metal; (d) removing any unreacted portions of said selectively reactive layer; and (e) forming a perovskite dielectric layer on said perovskite seed layer.
Claim 23
Independent Claim
108 words
A method of forming a microelectronic structure, said method comprising: (a) forming a ruthenium layer having a top surface and side surfaces; (b) oxidizing said top surface and side surfaces to form a ruthenium dioxide layer; (c) forming a calcium oxide layer on said ruthenium dioxide layer; (d) heating said calcium oxide layer and said ruthenium dioxide layer, thereby causing said calcium oxide layer and said ruthenium dioxide layer to react and form a calcium ruthenate layer on said ruthenium dioxide layer; (e) removing any unreacted portions of said calcium oxide layer with deionized water; and (c) forming a barium strontium titanate layer on said calcium ruthenate layer.
Claim 24
Independent Claim
108 words
A method of forming a microelectronic structure, said method comprising: (a) forming a ruthenium layer having a top surface and side surfaces; (b) oxidizing said top surface and side surfaces to form a ruthenium dioxide layer; (c) forming a calcium oxide layer on said ruthenium dioxide layer; (d) heating said calcium oxide layer and said ruthenium dioxide layer, thereby causing said calcium oxide layer and said ruthenium dioxide layer to react and form a calcium ruthenate layer on said ruthenium dioxide layer; (e) removing any unreacted portions of said calcium oxide layer with deionized water; and (c) forming a barium strontium titanate layer on said calcium ruthenate layer.
References Cited (Backward Citations)
US4853983A
Cited
US4918654A
Cited
US4809225A
Cited
US4910708A
Cited
US4914627A
Cited
US4873644A
Cited
US4893272A
Cited
US4888733A
Cited
US4982309A
Cited
US5053917A
Cited
US5122923A
Cited
US5079200A
Cited
EP0557937A1
Cited
US5191510A
Cited
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