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US5624866A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor device provided with trench element isolation film and method for fabricating the same

Assignee: SK Hynix Inc
•
Filing: 1995-01-19
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Granted: 1997-04-29
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Expires: 2015-01-19
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Abstract

Abstract A semiconductor device with a trench element isolation structure having a trench element isolation film formed to have a small width at the boundary between an active region and a field region, thereby capable of obtaining an improved element isolation function while easily planarizing an insulating film formed in the trench. A thick oxide film is formed at the field region provided with no trench, thereby preventing formation of a parasitic capacitor between the semiconductor substrate and the gate electrode.

Inventors

  • 👤 Jae K. Kim

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 19:20
CPC Classifications
H; H10; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/014; H10W10/012; H10D; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0151; H10W10/10; H10W10/13; Y; Y10; Y10S; Y10S438/00; Y10S438/981

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 139 words
A method for fabricating a semiconductor device, comprising the steps of: forming a trench having a predetermined width and a predetermined depth in a portion of a semiconductor substrate corresponding to a boundary between a field region and an active region, and then burying an insulating film in the trench such that the insulating film has a planarized surface, thereby forming a trench element isolation film; implanting an impurity only in a portion of the semiconductor substrate corresponding to the field region, thereby forming an impurity-implanted layer; forming a gate oxide film on a portion of the semiconductor substrate corresponding to the active region and a thick oxide film on the impurity-implanted layer at the field region by use of an oxidation process; and forming a gate electrode overlapping with the gate oxide film and the thick oxide film.
Claim 2
Independent Claim 139 words
A method for fabricating a semiconductor device, comprising the steps of: forming a trench having a predetermined width and a predetermined depth in a portion of a semiconductor substrate corresponding to a boundary between a field region and an active region, and then burying an insulating film in the trench such that the insulating film has a planarized surface, thereby forming a trench element isolation film; implanting an impurity only in a portion of the semiconductor substrate corresponding to the field region, thereby forming an impurity-implanted layer; forming a gate oxide film on a portion of the semiconductor substrate corresponding to the active region and a thick oxide film on the impurity-implanted layer at the field region by use of an oxidation process; and forming a gate electrode overlapping with the gate oxide film and the thick oxide film.
Claim 3
Dependent Claim 37 words
A method in accordance with claim 1, wherein the impurity of the impurity-implanted layer comprises one selected from a group consisting of arsenic, phosphorous, argon and silicon or a mixture of two impurities selected from the group.
Claim 4
Dependent Claim 21 words
A method in accordance with claim 1, wherein the impurity of the impurity-implanted layer has a concentration of 5E14 to 5E16.
Claim 5
Dependent Claim 21 words
A method in accordance with claim 1, wherein the impurity-implanted layer is formed at the entire portions of the field region.
Claim 6
Dependent Claim 26 words
A method in accordance with claim 1, wherein the impurity-implanted layer is formed only at a portion of the field region overlapping with the gate electrode.

References Cited (Backward Citations)

US4597164A Cited
US4578128A Cited
US4912062A Cited
US5137837A Cited
US5177028A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-04-28 2000-10-28 2001-04-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-04-28 2004-10-28 2005-04-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-04-28 2008-10-28 2009-04-29 $7700.00 Window Closed / Lapsed

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