US5621246A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate for mounting integrated circuit semiconductor chips
Assignee: Fujitsu Ltd
•
Filing: 1994-03-24
•
Granted: 1997-04-15
•
Expires: 2014-03-24
Abstract
Abstract A multichip substrate including a bonding pad, wiring layers insulated by polyimide layers and structure for protecting separation or the polyimide layers from occurring due to water oozing from the polyimide layers by: fabricating posts between the bonding pad and an inorganic insulation layer fabricated on a base substrate through the organic insulation layers by accumulating parts of the wiring layers; and providing holes for setting the water free, around the bonding pad so that the polyimide layer is exposed out of the multichip substrate; or fabricating the bonding pad directly on the inorganic insulation layer, fabricating the polyimide layers and wiring layers in terraced configuration at a periphery of the bonding pad.
Inventors
- 👤 Takushi Motoyama
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 09:55
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W70/611; H10W70/67; H10W70/68; H10W70/685; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/934; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
162 words
A multichip substrate for mounting integrated circuit semiconductor chips, said multichip substrate comprising: a base substrate a first insulation layer fabricated on said base substrate; multi-insulation layers accumulated on said first insulation layer; multi-wiring layers made of an electrically conductive substance, accumulated on said first insulation layer, interposing said multi-insulation layers into said multi-wiring layers for keeping said multi-wiring layers apart; a bonding pad for external electrical connection of multi chip substrate made of an electrically conductive substance, lying above said multi-insulation layers and said multi-wiring layers and electrically connected with said multi-wiring layers through said multi-insulation layers; and standing structures made by accumulating first substance layers so as to stand between said bonding pad and said first insulation layer in at least a bonding region of said bonding pad and under said bonding pad, passing through said multi-insulation layers, so as to stick to said first insulation layer, said bonding region being a region in which wire bonding is carried out.
Claim 2
Dependent Claim
162 words
A multichip substrate for mounting integrated circuit semiconductor chips, said multichip substrate comprising: a base substrate a first insulation layer fabricated on said base substrate; multi-insulation layers accumulated on said first insulation layer; multi-wiring layers made of an electrically conductive substance, accumulated on said first insulation layer, interposing said multi-insulation layers into said multi-wiring layers for keeping said multi-wiring layers apart; a bonding pad for external electrical connection of multi chip substrate made of an electrically conductive substance, lying above said multi-insulation layers and said multi-wiring layers and electrically connected with said multi-wiring layers through said multi-insulation layers; and standing structures made by accumulating first substance layers so as to stand between said bonding pad and said first insulation layer in at least a bonding region of said bonding pad and under said bonding pad, passing through said multi-insulation layers, so as to stick to said first insulation layer, said bonding region being a region in which wire bonding is carried out.
Claim 3
Dependent Claim
15 words
A multichip substrate according to claim 1, wherein said multi-insulation layers are made of polyimide.
Claim 4
Dependent Claim
22 words
A multichip substrate according to claim 1, wherein the first substance layers of said standing structures belong to said multi-wiring layers respectively.
Claim 5
Dependent Claim
25 words
A multichip substrate according to claim 1, wherein said standing structure has a more frictional surface compared to said multi-insulation layers surrounding said standing structure.
Claim 6
Dependent Claim
22 words
A multichip substrate according to claim 4, wherein the frictional surface of said standing structure is a surface having a stepped configuration.
Claim 7
Dependent Claim
30 words
A multichip substrate according to claim 1, wherein said bonding pad has opening holes fabricated so as to expose one of said multi-wiring layers lying beneath said the bonding pad.
Claim 8
Dependent Claim
17 words
A multichip substrate according to claim 6, wherein the opening holes are distributed beyond the bonding region.
Claim 9
Dependent Claim
18 words
A multichip substrate according to claim 6, wherein each of the opening holes is over the bonding region.
Claim 10
Dependent Claim
111 words
A multichip substrate for mounting integrated circuit semiconductor chips, said multichip substrate comprising: a base substrate a first insulation layer fabricated on said base substrate; multi-insulation layers accumulated on said first insulation layer; multi-wiring layers made of an electrically conductive substance, accumulated on said first insulation layer, interposing said multi-insulation layers into said multi-wiring layers for keeping said multi-wiring layers apart; and a bonding pad for external electrical connection of said multichip substrate made of an electrically conductive substance and lying above said multi-insulation layers and said multi-wiring layers and electrically connected with said multi-wiring layers through said multi-insulation layers, said bonding pad being fabricated directly on said first insulation layer.
Claim 11
Dependent Claim
111 words
A multichip substrate for mounting integrated circuit semiconductor chips, said multichip substrate comprising: a base substrate a first insulation layer fabricated on said base substrate; multi-insulation layers accumulated on said first insulation layer; multi-wiring layers made of an electrically conductive substance, accumulated on said first insulation layer, interposing said multi-insulation layers into said multi-wiring layers for keeping said multi-wiring layers apart; and a bonding pad for external electrical connection of said multichip substrate made of an electrically conductive substance and lying above said multi-insulation layers and said multi-wiring layers and electrically connected with said multi-wiring layers through said multi-insulation layers, said bonding pad being fabricated directly on said first insulation layer.
Claim 12
Dependent Claim
15 words
A multichip substrate according to claim 9, wherein said multi-insulation layers are made of polyimide.
Claim 13
Dependent Claim
23 words
A multichip substrate according to claim 9, wherein said multi-insulation layers are fabricated in terraced configuration at a periphery of said bonding pad.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-04-14 | 2000-10-14 | 2001-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-04-14 | 2004-10-14 | 2005-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-04-14 | 2008-10-14 | 2009-04-15 | $7700.00 | Window Closed / Lapsed |