US5620933A
Expired / Lapsed
US
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Micromachined relay and method of forming the relay
Assignee: Brooktree Broadband Holding Inc
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Filing: 1995-05-19
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Granted: 1997-04-15
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Expires: 2015-05-19
Abstract
Abstract A bridging member extending across a cavity in a semiconductor substrate (e.g. single crystal silicon) has successive layers--a masking layer, an electrically conductive layer (e.g. polysilicon) and an insulating layer (e.g. SiO 2 ). A first electrical contact (e.g. gold coated with ruthenium) extends on the insulating layer in a direction perpendicular to the extension of the bridging member across the cavity. A pair of bumps (e.g. gold) are on the insulating layer each between the contact and one of the cavity ends. Initially the bridging member and then the contact and the bumps are formed on the substrate and then the cavity is etched in the substrate through holes in the bridging member. A pair of second electrical contacts (e.g. gold coated with ruthenium) are on the surface of an insulating substrate (e.g. pyrex glass) adjacent the semiconductor substrate. The two substrates are bonded after the contacts are cleaned. The first contact is normally separated from the second contacts because the bumps engage the insulating substrate surface. When a voltage is applied between an electrically conductive layer on the insulating substrate surface and the polysilicon layer, the bridging member is deflected so that the first contact engages the second contacts. Electrical leads extend on the surface of the insulating substrate from the second contacts to bonding pads disposed adjacent a second cavity in the semiconductor substrate. The resultant relays on a wafer may be separated by sawing the semiconductor and insulating substrates at the position of the second cavity in each relay to expose the pads for electrical connections.
Inventors
- 👤 Christopher D. James
- 👤 Henry S. Katzenstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:47
CPC Classifications
H; H01; H01H; H01H59/00; H01H59/0009; H01H1/00; H01H1/12; H01H1/14; H01H1/20; H01H1/0036; H01H2001/0084; H01H2059/0018
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
123 words
In a method of forming a micromachined relay, the steps of: providing a substrate made from semiconductor material having anisotropic properties, forming bridging means on the substrate with dielectric properties and with properties in the bridging means of withstanding an etchant material, forming at least one hole in the bridging means, applying the etchant material through the hole in the bridging means to etch a cavity in the substrate at positions below the bridging means, with dimensions dependent upon the anisotropic properties of the substrate, to separate a portion of the length of the bridging means from the substrate, and forming an electrical contact on the bridging means at an intermediate position along the separated portion of the length of the bridging means.
Claim 2
Dependent Claim
123 words
In a method of forming a micromachined relay, the steps of: providing a substrate made from semiconductor material having anisotropic properties, forming bridging means on the substrate with dielectric properties and with properties in the bridging means of withstanding an etchant material, forming at least one hole in the bridging means, applying the etchant material through the hole in the bridging means to etch a cavity in the substrate at positions below the bridging means, with dimensions dependent upon the anisotropic properties of the substrate, to separate a portion of the length of the bridging means from the substrate, and forming an electrical contact on the bridging means at an intermediate position along the separated portion of the length of the bridging means.
Claim 3
Dependent Claim
52 words
In the method as set forth in claim 1, including the additional step of: the cavity constituting a first cavity, forming a second cavity in the substrate at the same time as the formation of the first cavity in the substrate at a position displaced from the first cavity in the substrate.
Claim 4
Dependent Claim
89 words
In the method as set forth in claim 1, including the additional steps of: providing the bridging means with a layer of an electrically conductive material and then with a layer of an insulating material formed on the layer of the insulating material, providing the at least one hole in the layer of the insulating material and the layer of the electrically conductive material, and etching the cavity through the at least one hole in the layer of the insulating material and the layer of the electrically conductive material.
Claim 5
Dependent Claim
56 words
In the method as set forth in claim 3, including the additional step of: removing the layer of the insulating material from the layer of the electrically conductive material at isolated positions on the layer of the electrically conductive material to provide for a dissipation of any electrostatic charge on the layer of the insulating material.
Claim 6
Dependent Claim
67 words
In the method as set forth in claim 4, including the additional steps of: the cavity having opposite peripheries defining the boundaries of the cavity, forming bumps on the bridging means between the electrical contact and the opposite peripheries of the cavity in the substrate, the cavity constituting a first cavity, and etching a second cavity in the substrate at a position displaced from the first cavity.
Claim 7
Dependent Claim
45 words
In the method as set forth in claim 1, including the additional step of: the cavity having opposite peripheries defining the boundaries of the cavity, forming bumps on the bridging means between the electrical contact and the opposite peripheries of the cavity in the substrate.
Claim 8
Dependent Claim
38 words
In the method as set forth in claim 6, including the additional step of: the cavity in the substrate constituting a first cavity, etching a second cavity in the substrate at a position displaced from the first cavity.
Claim 9
Dependent Claim
134 words
In a method of forming a micromachined relay, the steps of: providing a substrate of an insulating material, the substrate having an edge, forming at least a first cavity in the substrate, depositing a pair of electrical contacts in the at least first cavity, providing in the substrate second cavities at positions displaced from the first cavity in the substrate, providing a plurality of electrical leads, each individual one of the plurality of electrical leads having an end and each individual one of the plurality of electrical leads extending on the substrate from the pair of the electrical contacts to the edge of the substrate in electrically insulating relationship to electrical leads other than such individual one of the plurality of electrical leads, and providing bonding pads at the ends of the electrical leads.
Claim 10
Dependent Claim
134 words
In a method of forming a micromachined relay, the steps of: providing a substrate of an insulating material, the substrate having an edge, forming at least a first cavity in the substrate, depositing a pair of electrical contacts in the at least first cavity, providing in the substrate second cavities at positions displaced from the first cavity in the substrate, providing a plurality of electrical leads, each individual one of the plurality of electrical leads having an end and each individual one of the plurality of electrical leads extending on the substrate from the pair of the electrical contacts to the edge of the substrate in electrically insulating relationship to electrical leads other than such individual one of the plurality of electrical leads, and providing bonding pads at the ends of the electrical leads.
Claim 11
Dependent Claim
40 words
In the method as set forth in claim 8, including: the substrate having a first surface, the first cavity being formed in the first surface of the substrate, the pair of electrical contacts having surfaces flush with the first surface.
Claim 12
Dependent Claim
62 words
In the method as set forth in claim 9, including the additional steps of: providing electrically conductive material on the first surface of the substrate in electrically isolated relationship with the pair of electrical contacts and the plurality of electrical leads, and disposing an additional bonding pad on the first surface of the substrate in electrical communication with the electrically conductive material.
Claim 13
Dependent Claim
120 words
In the method of forming a micromachined relay as set forth in claim 10, including the additional steps of: the substrate constituting a first substrate, providing a second substrate of a dielectric material, providing a bridging member on the second substrate, providing a cavity, defined by opposite ends, in the second substrate at a position below the bridging member to provide for a pivotal movement of the bridging member about the ends of the cavity as fulcrums, and forming an electrical contact on the bridging member to provide for an engagement between the electrical contact in the bridging member and the electrical contacts on the substrate of the insulating material in accordance with the pivotal movement of the bridging member.
Claim 14
Dependent Claim
62 words
In the method as set forth in claim 11, including the additional steps of: forming bumps on the bridging member between the electrical contact on the bridging member and the opposite ends of the cavity in the second substrate to displace the electrical contact on the bridging member from the electrical contacts in the cavity on the substrate of the insulating material.
Claim 15
Dependent Claim
43 words
In the method as set forth in claim 12, including the additional steps of: bonding the first substrate of the insulating material and the second substrate of the dielectric material at positions beyond the opposite ends of the cavity in the second substrate.
Claim 16
Dependent Claim
67 words
In the method as set forth in claim 13, including the additional steps of: the leads having opposite ends, providing a second cavity in the second substrate of the dielectric material at the opposite ends of the plurality of electrical leads on the first substrate of the insulating material before the first substrate of the insulating material and the second substrate of the dielectric material are bonded.
Claim 17
Independent Claim
107 words
A method of producing an electrical relay, comprising the steps of: providing a first substrate with a surface, providing a second substrate with a surface, disposing contacts on the first surface of the first substrate, providing a contact on the first surface of the second substrate, modifying the second substrate to provide for a pivotal movement of the contact on the second substrate into engagement with the contacts on the first substrate, cleaning the contacts on the surface of the first substrate and the contact on the surface of the second substrate, and bonding the surface of the first substrate to the surface of the second substrate.
Claim 18
Independent Claim
107 words
A method of producing an electrical relay, comprising the steps of: providing a first substrate with a surface, providing a second substrate with a surface, disposing contacts on the first surface of the first substrate, providing a contact on the first surface of the second substrate, modifying the second substrate to provide for a pivotal movement of the contact on the second substrate into engagement with the contacts on the first substrate, cleaning the contacts on the surface of the first substrate and the contact on the surface of the second substrate, and bonding the surface of the first substrate to the surface of the second substrate.
Claim 19
Dependent Claim
37 words
The method as set forth in claim 15, including the additional step of: forming a vacuum between the first and second substrates before bonding the surface of the first substrate and the surface of the second substrate.
Claim 20
Dependent Claim
166 words
The method as set forth in claim 16 wherein pads are provided on the surface of the second substrate to provide for external connections to the pads and wherein the pads communicate electrically with the contacts on the surface of the first substrate and wherein the second substrate is modified by forming a cavity in the second substrate around the contact on the surface of the second substrate to provide for a pivotal movement of the contact on the surface of the second substrate into engagement with the contacts on the surface of the first substrate and wherein the contact on the surface of the second substrate is disposed on a bridging member movable relative to the contacts on the surface of the first substrate to produce the engagement between the contact on the surface of the second substrate and the contacts on the surface of the first substrate and wherein the bridging member is constructed to dissipate any electrical charges accumulated on the bridging member.
Claim 21
Dependent Claim
59 words
The method as set forth in claim 17 wherein the bridging member is formed from an electrically conductive layer and an electrically insulating layer on the electrically conductive layer and wherein holes are provided in the electrically conductive layer and the electrically insulating layer of the bridging member to facilitate the formation of the cavity in the second substrate.
Claim 22
Dependent Claim
144 words
The method as set forth in claim 18 wherein the cavity has opposite ends defining the boundaries of the cavity and wherein the electrically insulating layer is removed from the electrically conductive layer at isolated positions to facilitate the removal of electrostatic charges in the space between the contact on the surface of the second substrate and the contacts on the surface of the first substrate and wherein bumps are disposed on the electrically insulating layer between the contact on the surface of the second substrate and the opposite ends of the cavity to maintain the electrical contact on the surface of the second substrate displaced from the electrical contacts on the surface of the first substrate until the creation of an electrical field between the contacts on the surface of the second substrate and the contacts on the surface of the first substrate.
Claim 23
Dependent Claim
60 words
The method as set forth in claim 15, wherein the second substrate is modified by forming a cavity in the second substrate around the contact on the surface of the second substrate to provide for the pivotal movement of the contact on the surface of the second substrate into engagement with the contacts on the surface of the first substrate.
Claim 24
Dependent Claim
18 words
In a method as set forth in claim 20, the first and second substrates being evacuated of gases.
Claim 25
Dependent Claim
43 words
The method as set forth in claim 15 wherein pads are provided on the surface of the second substrate to provide for external connections to the pads and wherein the pads communicate electrically with the contacts on the surface of the first substrate.
Claim 26
Dependent Claim
77 words
The method as set forth in claim 15 wherein the contact on the surface of the second substrate is disposed on a bridging member movable relative to the contacts on the surface of the first substrate to produce the engagement between the contact on the surface of the second substrate and the contacts on the surface of the first substrate and wherein the bridging member is constructed to dissipate any electrical charges accumulated on the bridging member.
Claim 27
Dependent Claim
105 words
In a method of forming a micromachined relay, the steps of: providing a substrate made from semiconductor material having anisotropic properties, forming bridging means on the substrate with dielectric properties in the bridging means and with properties in the bridging means of withstanding etchant materials, etching a cavity in the substrate at positions below the bridging means, with dimensions dependent upon the anisotropic properties of the substrate, to separate a portion of the length of the bridging means from the cavity, and forming an electrical contact on the bridging means at an intermediate position along the separated portion of the length of the bridging means.
Claim 28
Dependent Claim
105 words
In a method of forming a micromachined relay, the steps of: providing a substrate made from semiconductor material having anisotropic properties, forming bridging means on the substrate with dielectric properties in the bridging means and with properties in the bridging means of withstanding etchant materials, etching a cavity in the substrate at positions below the bridging means, with dimensions dependent upon the anisotropic properties of the substrate, to separate a portion of the length of the bridging means from the cavity, and forming an electrical contact on the bridging means at an intermediate position along the separated portion of the length of the bridging means.
Claim 29
Dependent Claim
52 words
In the method as set forth in claim 24, including the additional step of: the cavity constituting a first cavity, forming a second cavity in the substrate at the same time as the formation of the first cavity in the substrate at a position displaced from the first cavity in the substrate.
Claim 30
Dependent Claim
53 words
In the method as set forth in claim 24, including the additional steps of: initially providing the bridging means with a layer of an electrically conductive material and then with a layer of an electrically conductive material on the layer of the insulating material before the etching of the cavity in the substrate.
Claim 31
Dependent Claim
56 words
In the method as set forth in claim 24, including the additional step of: removing the layer of the insulating material from the layer of the electrically conductive material at isolated positions on the layer of the electrically conductive material to provide for a dissipation of any electrostatic charge on the layer of the insulating material.
Claim 32
Dependent Claim
34 words
In the method as set forth in claim 24, including the additional step of: forming bumps on the bridging means between the electrical contact and the opposite peripheries of the cavity in the substrate.
Claim 33
Dependent Claim
38 words
In the method as set forth in claim 28, including the additional step of: the cavity in the substrate constituting a first cavity, etching a second cavity in the substrate at a position displaced from the first cavity.
Claim 34
Dependent Claim
66 words
In the method as set forth in claim 28, including the additional steps of: the cavity having opposite peripheries defining the boundaries of the cavity, forming bumps on the bridging means between the contact and the opposite peripheries of the cavity in the substrate, the cavity constituting a first cavity, and etching a second cavity in the substrate at a position displaced from the first cavity.
Claim 35
Dependent Claim
93 words
In the method as set forth in claim 30, the additional steps of: initially providing the bridging means with a layer of an electrically conductive material and then with a layer of an insulating material on the layer of the insulating material before the etching of the cavity in the substrate, removing the layer of the insulating material from the layer of the electrically conductive material at isolated positions on the layer of the electrically conductive material to provide for a dissipation of any electrostatic charge on the layer of the insulating material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-04-14 | 2000-10-14 | 2001-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-04-14 | 2004-10-14 | 2005-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-04-14 | 2008-10-14 | 2009-04-15 | $7700.00 | Window Closed / Lapsed |