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US5614749A Expired / Lapsed US ⏱️ 0.0 years remaining

Silicon carbide trench MOSFET

Assignee: Fuji Electric Co Ltd
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Filing: 1996-01-25
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Granted: 1997-03-25
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Expires: 2016-01-25
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Abstract

Abstract A silicon carbide trench MOSFET is provided that includes a first conductivity type semiconductor substrate made of silicon carbide. A first conductivity type drift layer and a second conductivity type base layer, both made of silicon carbide, are sequentially formed by epitaxial growth on the semiconductor substrate. The first conductivity type drift layer has a lower impurity concentration than the semiconductor substrate. A first conductivity type source region is formed in a part of a surface layer of the second conductivity type base layer. A gate electrode is received through an insulating film, in a first trench extending from a surface of the first conductivity type source region to reach the first conductivity type drift layer. A Shottky electrode disposed on an inner surface of a second trench having a greater depth than the first trench.

Inventors

  • 👤 Katsunori Ueno

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-06 15:57
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/60; H10D30/64; H10D30/66; H10D30/668; H10D12/00; H10D12/01; H10D12/031; H10D30/01; H10D30/021; H10D30/028; H10D30/0291; H10D30/0295; H10D30/0297; H10D62/00; H10D62/80; H10D62/83; H10D62/832; H10D62/8325; H10D64/00; H10D64/20; H10D64/23; H10D64/251; H10D64/252; H10D64/2527; H10D64/256; H10D84/00; H10D84/101; H10D84/141; H10D84/146; H10D64/60; H10D64/64; Y; Y10; Y10S; Y10S438/00; Y10S438/931

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 157 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer and a second conductivity type base layer both comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first conductivity type source region formed in a part of a surface layer of said second conductivity type base layer; a first trench extending from a surface of said first conductivity type source region to reach said first conductivity type drift layer, a gate electrode formed in said first trench; an insulating film located between said gate electrode and said first conductivity type source region, said second conductivity type base layer and said first conductivity type drift layer; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 2
Dependent Claim 157 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer and a second conductivity type base layer both comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first conductivity type source region formed in a part of a surface layer of said second conductivity type base layer; a first trench extending from a surface of said first conductivity type source region to reach said first conductivity type drift layer, a gate electrode formed in said first trench; an insulating film located between said gate electrode and said first conductivity type source region, said second conductivity type base layer and said first conductivity type drift layer; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 3
Dependent Claim 31 words
A silicon carbide trench MOSFET as defined in claim 1, wherein said Shottky electrode is formed of a metal selected from the group consisting of Ti, Au, Pt, and Al-Ti alloy.
Claim 4
Dependent Claim 114 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer, a second conductivity type base layer and a first conductivity type source layer each comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first trench extending from a surface of said first conductivity type source layer to reach said first conductivity type drift layer; a gate electrode formed in said first trench; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 5
Dependent Claim 114 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer, a second conductivity type base layer and a first conductivity type source layer each comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first trench extending from a surface of said first conductivity type source layer to reach said first conductivity type drift layer; a gate electrode formed in said first trench; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 6
Dependent Claim 31 words
A silicon carbide trench MOSFET as defined in claim 3, wherein said Shottky electrode is formed of a metal selected from the group consisting of Ti, Au, Pt, and Al-Ti alloy.

References Cited (Backward Citations)

US5216264A Cited
US5506421A Cited
US5323040A Cited
US5396085A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2000-03-24 2000-09-23 2001-03-25 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2004-03-24 2004-09-23 2005-03-25 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2008-03-24 2008-09-23 2009-03-25 $7700.00 Window Closed / Lapsed

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