Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
157 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer and a second conductivity type base layer both comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first conductivity type source region formed in a part of a surface layer of said second conductivity type base layer; a first trench extending from a surface of said first conductivity type source region to reach said first conductivity type drift layer, a gate electrode formed in said first trench; an insulating film located between said gate electrode and said first conductivity type source region, said second conductivity type base layer and said first conductivity type drift layer; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 2
Dependent Claim
157 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer and a second conductivity type base layer both comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first conductivity type source region formed in a part of a surface layer of said second conductivity type base layer; a first trench extending from a surface of said first conductivity type source region to reach said first conductivity type drift layer, a gate electrode formed in said first trench; an insulating film located between said gate electrode and said first conductivity type source region, said second conductivity type base layer and said first conductivity type drift layer; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 3
Dependent Claim
31 words
A silicon carbide trench MOSFET as defined in claim 1, wherein said Shottky electrode is formed of a metal selected from the group consisting of Ti, Au, Pt, and Al-Ti alloy.
Claim 4
Dependent Claim
114 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer, a second conductivity type base layer and a first conductivity type source layer each comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first trench extending from a surface of said first conductivity type source layer to reach said first conductivity type drift layer; a gate electrode formed in said first trench; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 5
Dependent Claim
114 words
A silicon carbide trench MOSFET comprising: a first conductivity type semiconductor substrate comprising silicon carbide; a first conductivity type drift layer, a second conductivity type base layer and a first conductivity type source layer each comprising silicon carbide and sequentially formed by epitaxial growth on said semiconductor substrate, said first conductivity type drift layer having a lower impurity concentration than the semiconductor substrate; a first trench extending from a surface of said first conductivity type source layer to reach said first conductivity type drift layer; a gate electrode formed in said first trench; and a Shottky electrode disposed on an inner surface of a second trench having a greater depth than said first trench.
Claim 6
Dependent Claim
31 words
A silicon carbide trench MOSFET as defined in claim 3, wherein said Shottky electrode is formed of a metal selected from the group consisting of Ti, Au, Pt, and Al-Ti alloy.