Heat sink and retainer for electronic integrated circuits

Claim 1

In combination, a heat sink and a heat sink retainer clip for use in conjunction with an electronic device, such as a semiconductor, to provide cooling of the device, the device being mounted on a rectangular socket with opposing sidewalls, at least two opposed side walls having lugs protecting laterally outward from the walls, the heat sink comprising a flat plate with a plurality of fins protecting upwardly from the top surface of the plate, a central section of the plate being free of the fins to receive the clip, the retainer clip comprising: a first member including a retaining portion and a biasing portion: (i) said biasing portion received in said central section of the plate and extending substantially across the plate for biasing the heat sink against the device; (ii) said retaining portion having an opening for receiving the lug on the socket side wall and connected to said biasing portion adjacent one end thereof; (iii) said biasing portion, at the end opposite to the retaining portion, being bifurcated to form two arms adjacent the free end; and a second member, rotatably and loosely supported by the free end of said biasing portion, including at least two openings, a lower of said openings for receiving the lug on the opposite side wall of the socket, the upper opening receiving the free ends of the arms on the biasing member.