US5586007A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board having improved thermal radiation
Assignee: Fujifilm Business Innovation Corp
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Filing: 1995-10-13
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Granted: 1996-12-17
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Expires: 2015-10-13
Abstract
Abstract A circuit board consisting of an insulating substrate, a die bonding pad for fixedly bonding a semiconductor element onto the insulating substrate, and a wiring layer, in such a manner that the die bonding pad and wire layer are formed on the insulating substrate. A first heat conducting/radiating layer formed on the portion of the surface of the insulating substrate where the wiring layer and the die bonding pad are not formed, in such a manner that the first heat conducting/radiating layer is thermally connected to the die bonding pad. A second heat conducting/radiating layer is formed on the rear surface of the insulating substrate, and a heat bridge through which the die bonding pad or the first heat conducting/radiating layer is connected to the second heat conducting/radiating layer. The circuit board is light and small, and high in heat radiating characteristic, and low in manufacturing cost.
Inventors
- 👤 Masao Funada
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:18
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K1/0207; H05K1/0209; H05K7/00; H05K7/20; H05K7/2039; H05K7/205; H05K7/20536; H05K7/20545; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/00; H05K3/30; H05K3/303; H05K3/40; H05K3/42; H05K3/429; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/681; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07353; H10W72/30; H10W72/331; H10W72/334; H10W72/90; H10W72/931; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
188 words
A circuit board, comprising: an insulating substrate; a die bonding pad for fixedly bonding a semiconductor element onto said insulating substrate; a thermally conductive adhesive layer connecting the semiconductor element to the die bonding pad; a plurality of wire bonding pads on said insulating substrate; a first heat conducting/radiating layer on a top surface of said insulating substrate where said wire bonding pads and said die bonding pad are not located, said first heat conducting/radiating layer being thermally connected to said die bonding pad; a second heat conducting/radiating layer on a rear surface of said insulating substrate; and a heat bridge connecting said die bonding pad or said first heat conducting/radiating layer to said second heat conducting/radiating layer, wherein a first heat transmission path is provided from the semiconductor element through said adhesive layer and said die bonding pad to said first heat conducting/radiating layer, a second heat transmission path is provided from the semiconductor element through said adhesive layer to said first heat conducting/radiating layer, and a third heat tranmission path is provided from the semiconductor element through said heat bridge to said second heat conducting/radiating layer.
Claim 2
Dependent Claim
188 words
A circuit board, comprising: an insulating substrate; a die bonding pad for fixedly bonding a semiconductor element onto said insulating substrate; a thermally conductive adhesive layer connecting the semiconductor element to the die bonding pad; a plurality of wire bonding pads on said insulating substrate; a first heat conducting/radiating layer on a top surface of said insulating substrate where said wire bonding pads and said die bonding pad are not located, said first heat conducting/radiating layer being thermally connected to said die bonding pad; a second heat conducting/radiating layer on a rear surface of said insulating substrate; and a heat bridge connecting said die bonding pad or said first heat conducting/radiating layer to said second heat conducting/radiating layer, wherein a first heat transmission path is provided from the semiconductor element through said adhesive layer and said die bonding pad to said first heat conducting/radiating layer, a second heat transmission path is provided from the semiconductor element through said adhesive layer to said first heat conducting/radiating layer, and a third heat tranmission path is provided from the semiconductor element through said heat bridge to said second heat conducting/radiating layer.
Claim 3
Dependent Claim
200 words
A circuit board, comprising: an insulating substrate; a die bonding pad for fixedly bonding a semiconductor element onto said insulating substrate; a thermally conductive adhesive layer connecting the semiconductor element to the die bonding pad; a plurality of wire bonding pads on said insulating substrate; a first heat conducting/radiating layer on a top surface of said insulating substrate where said wire bonding pads and said die bonding pad are not located, said first heat conducting/radiating layer being thermally connected to said die bonding pad; a second heat conducting/radiating layer on a rear surface of said insulating substrate; a wiring layer formed in said insulating substrate; and a heat bridge connecting said die bonding pad or said first heat conducting/radiating layer to said second heat conducting/radiating layer or said wiring layer, wherein a first heat transmission path is provided from the semiconductor element through said adhesive layer and said die bonding pad to said first heat conducting/radiating layer, a second heat transmission path is provided from the semiconductor element through said adhesive layer to said first heat conducting/radiating layer, and a third heat tranmission path is provided from the semiconductor element through said heat bridge to said second heat conducting/radiating layer.
Claim 4
Dependent Claim
200 words
A circuit board, comprising: an insulating substrate; a die bonding pad for fixedly bonding a semiconductor element onto said insulating substrate; a thermally conductive adhesive layer connecting the semiconductor element to the die bonding pad; a plurality of wire bonding pads on said insulating substrate; a first heat conducting/radiating layer on a top surface of said insulating substrate where said wire bonding pads and said die bonding pad are not located, said first heat conducting/radiating layer being thermally connected to said die bonding pad; a second heat conducting/radiating layer on a rear surface of said insulating substrate; a wiring layer formed in said insulating substrate; and a heat bridge connecting said die bonding pad or said first heat conducting/radiating layer to said second heat conducting/radiating layer or said wiring layer, wherein a first heat transmission path is provided from the semiconductor element through said adhesive layer and said die bonding pad to said first heat conducting/radiating layer, a second heat transmission path is provided from the semiconductor element through said adhesive layer to said first heat conducting/radiating layer, and a third heat tranmission path is provided from the semiconductor element through said heat bridge to said second heat conducting/radiating layer.
Claim 5
Dependent Claim
26 words
A circuit board of claim 2, wherein said die bonding pad, wiring layer, and first and second heat conducting/radiating layers are made of electrically conductive material.
Claim 6
Dependent Claim
13 words
A circuit board of claim 3, wherein said electrically conductive material is copper.
Claim 7
Dependent Claim
18 words
A circuit board of claim 2, wherein said first heat conducting/radiating layer is held at a predetermined potential.
Claim 8
Dependent Claim
13 words
A circuit board of claim 5, wherein said predetermined potential is earth potential.
Claim 9
Dependent Claim
28 words
A circuit board of claim 2, further comprising: a wiring pattern connected to a power source formed on said insulating substrate and to said first heat conducting/radiating layer.
Claim 10
Dependent Claim
28 words
A circuit board of claim 2, further comprising: a wiring pattern on said insulating substrate, said wiring pattern being grounded and connected to said first heat conducting/radiating layer.
Claim 11
Dependent Claim
28 words
A circuit board of claim 8, further comprising: a casing holding said insulating substrate, said casing being connected through said wiring pattern to said first heat conducting/radiating layer.
Claim 12
Dependent Claim
38 words
A circuit board of claim 2, further comprising: a wiring substrate on said insulating substrate and having a wiring pattern grounded or connected to a power source, said wiring pattern being connected to said first heat conducting/radiating layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-17 | 2000-06-17 | 2000-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-17 | 2004-06-17 | 2004-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-17 | 2008-06-17 | 2008-12-17 | $7700.00 | Window Closed / Lapsed |