US5585281A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process and apparatus for forming and testing semiconductor package leads
Assignee: NXP USA Inc
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Filing: 1995-02-03
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Granted: 1996-12-17
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Expires: 2015-02-03
Abstract
Abstract A method of forming leads and providing a final test of a semiconductor package including an electronic circuit therein, the package having unformed leads. A forming and testing station is provided including a support for receiving the package, and dies movably positioned adjacent the support for contacting and forming the leads with test equipment connected to the dies. The semiconductor package is positioned on the support, and the leads of the package are contacted with the dies to connect the test equipment to the leads for testing the electronic circuitry in the package and to form the leads with this contacting step as the final manufacturing step.
Inventors
- 👤 Darrell Truhitte
- 👤 Theodore R. Golubic
- 👤 Maureen Sugai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:51
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/0092; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/048; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
73 words
A method of forming leads and testing circuitry of a semiconductor package, comprising the steps of: providing a semiconductor package including an electronic circuit therein, the package having leads electrically connected to the circuit; and contacting and testing the leads of the package with a contacting member for testing the package through an electrical path of the contacting member, and forming the leads with the contacting step by deformation from the contacting member.
Claim 2
Independent Claim
73 words
A method of forming leads and testing circuitry of a semiconductor package, comprising the steps of: providing a semiconductor package including an electronic circuit therein, the package having leads electrically connected to the circuit; and contacting and testing the leads of the package with a contacting member for testing the package through an electrical path of the contacting member, and forming the leads with the contacting step by deformation from the contacting member.
Claim 3
Dependent Claim
33 words
A method of forming leads and testing circuitry of a semiconductor package as claimed in claim 1 including a step of at least partially testing the electronic circuit prior to the contacting step.
Claim 4
Dependent Claim
61 words
A method of forming leads and testing circuitry of a semiconductor package as claimed in claim 1 including the steps of providing a forming and testing station including a support for receiving the package and dies movably positioned adjacent the support for contacting and forming the leads, positioning the package on the support, and using the station for the contacting step.
Claim 5
Dependent Claim
28 words
A method of forming leads and testing circuitry of a semiconductor package as claimed in claim 3 including the steps of electrically connecting test equipment to the dies.
Claim 6
Dependent Claim
48 words
A method of forming leads and testing circuitry of a semiconductor package as claimed in claim 1 including the steps of final testing of the electronic circuit in the package, and placing the tested package with formed leads in a shipping package after the step of final testing.
Claim 7
Independent Claim
122 words
A method of forming leads and testing circuitry of a semiconductor package, comprising the steps of: providing a semiconductor package including an electronic circuit therein, the package having leads electrically connected to the circuit; providing a forming and testing station including a support for receiving the package and dies movably positioned adjacent the support for contacting and forming the leads; electrically connecting electronic circuit test equipment to the dies; positioning the semiconductor package on the support; and contacting the leads of the package with the dies to connect the test equipment to the leads through an electrical path of the dies for testing the electronic circuit in the package, and forming the leads with the contacting step by deformation from the dies.
Claim 8
Independent Claim
122 words
A method of forming leads and testing circuitry of a semiconductor package, comprising the steps of: providing a semiconductor package including an electronic circuit therein, the package having leads electrically connected to the circuit; providing a forming and testing station including a support for receiving the package and dies movably positioned adjacent the support for contacting and forming the leads; electrically connecting electronic circuit test equipment to the dies; positioning the semiconductor package on the support; and contacting the leads of the package with the dies to connect the test equipment to the leads through an electrical path of the dies for testing the electronic circuit in the package, and forming the leads with the contacting step by deformation from the dies.
Claim 9
Dependent Claim
92 words
A lead forming and circuitry testing station comprising: a support for receiving a semiconductor package thereon, the package including an electronic circuit and leads electrically connected to the circuit; dies movably positioned adjacent the support for movement between a first or loading position and a second position in which the dies form and electrically contact the leads, wherein the dies form the leads by deformation; and test equipment electrically connected to the dies, wherein the dies provide an electrical path from the test equipment to the leads for testing the electronic circuit.
Claim 10
Dependent Claim
92 words
A lead forming and circuitry testing station comprising: a support for receiving a semiconductor package thereon, the package including an electronic circuit and leads electrically connected to the circuit; dies movably positioned adjacent the support for movement between a first or loading position and a second position in which the dies form and electrically contact the leads, wherein the dies form the leads by deformation; and test equipment electrically connected to the dies, wherein the dies provide an electrical path from the test equipment to the leads for testing the electronic circuit.
Claim 11
Dependent Claim
60 words
A lead forming and circuitry testing station as claimed in claim 7 wherein the support includes a central portion for receiving a body of the package and the station further including a step portion positioned adjacent the support so as to engage the dies in the second position and, in conjunction with the dies, form a step in the leads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-17 | 2000-06-17 | 2000-12-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-17 | 2004-06-17 | 2004-12-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-17 | 2008-06-17 | 2008-12-17 | $7700.00 | Window Closed / Lapsed |