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US5583356A Expired / Lapsed US ⏱️ 0.0 years remaining

Connector arrangement for a semiconductor memory device

Assignee: Samsung Electronics Co Ltd
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Filing: 1993-11-29
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Granted: 1996-12-10
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Expires: 2013-11-29
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Abstract

Abstract In a semiconductor memory device having a novel structure of a wiring layer and a large capacitance capacitor and the manufacturing method therefor, on the transistor formed on the semiconductor substrate, a first conductive layer is formed extending along with the gate electrode of the transistor and connecting with the gate electrode, a storage electrode of a capacitor is formed on the first conductive layer by interposing the insulation film between the first conductive layer and the source region of the transistor, and a second conductive layer is formed in connection with the first conductive layer at a portion between memory cell array and the peripheral circuit region. Storage electrodes can be made thicker without affecting to the step-difference between memory cells and the peripheral circuit region, so that a more reliable semiconductor memory device with a capacitor having a larger capacitance can be realized.

Inventors

  • 👤 Joo-young Yoon
  • 👤 In-ho Nam

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 10:29
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/30; H10B12/31; H10B12/01; H10B12/02; H10B12/09

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 196 words
A connector arrangement for a semiconductor memory device having a memory cell array comprising a plurality of memory cells on a semiconductor substrate and a peripheral circuit region formed on the periphery of said memory cell array, a memory cell adjacent said peripheral circuit region having a transistor comprised of a source region and a drain region disposed in said substrate, and a gate electrode and a capacitor disposed substantially above said transistor comprised of a storage electrode, a dielectric film and a plate electrode, said connector arrangement comprising: a first conductive layer formed above said transistor and connecting with said gate electrode through a first contact hole at a cell array edge; a first insulating film formed on said first conductive layer; a second contact hole formed on a portion of the source region of said transistor; a storage electrode connector connecting with said source region of said transistor via said second contact hole to said storage electrode formed above said first insulating film; and a second conductive layer disposed in said peripheral circuit region and connected to first conductive layer at a portion where said memory cell array is adjacent said peripheral circuit region.
Claim 2
Dependent Claim 196 words
A connector arrangement for a semiconductor memory device having a memory cell array comprising a plurality of memory cells on a semiconductor substrate and a peripheral circuit region formed on the periphery of said memory cell array, a memory cell adjacent said peripheral circuit region having a transistor comprised of a source region and a drain region disposed in said substrate, and a gate electrode and a capacitor disposed substantially above said transistor comprised of a storage electrode, a dielectric film and a plate electrode, said connector arrangement comprising: a first conductive layer formed above said transistor and connecting with said gate electrode through a first contact hole at a cell array edge; a first insulating film formed on said first conductive layer; a second contact hole formed on a portion of the source region of said transistor; a storage electrode connector connecting with said source region of said transistor via said second contact hole to said storage electrode formed above said first insulating film; and a second conductive layer disposed in said peripheral circuit region and connected to first conductive layer at a portion where said memory cell array is adjacent said peripheral circuit region.
Claim 3
Dependent Claim 33 words
A connector arrangement according to claim 1, further comprising a second insulating film disposed between said transistor and said first conductive layer; and a bit-line connected to said drain region of said transistor.
Claim 4
Dependent Claim 18 words
A connector arrangement according to claim 1, wherein said first conductive layer is a word-line-strapping metal wiring layer.
Claim 5
Dependent Claim 24 words
A connector arrangement according to claim 1, wherein said first conductive layer is any one selected from the group consisting of tungsten and titanium.
Claim 6
Dependent Claim 16 words
A connector arrangement according to claim 1, wherein said second conductive layer is an aluminum layer.

References Cited (Backward Citations)

US5386382A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1999-12-10 2000-06-10 2000-12-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2003-12-10 2004-06-10 2004-12-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2007-12-10 2008-06-10 2008-12-10 $7700.00 Window Closed / Lapsed

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