US5581874A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a bonding portion
Assignee: Tokyo Electron Ltd
•
Filing: 1995-03-27
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Granted: 1996-12-10
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Expires: 2015-03-27
Abstract
Abstract A process apparatus comprises a process chamber containing a semiconductor wafer, a gas being able to be supplied to and exhausted from the process chamber, a support table for supporting an object to be processed, which is contained in the process chamber, a gas supply system for supplying the gas into the process chamber, and a gas exhaust system for exhausting the gas from the process chamber. An inner wall of the process chamber and the support table are formed of an aluminum-based material, and the surfaces of these are brought into contact with a fluorine-containing gas, thereby coating the surfaces with AlF3.
Inventors
- 👤 Makoto Aoki
- 👤 Mitsuaki Komino
- 👤 Masayuki Kitamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:45
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0418; H10P72/0421; H01; H01J; H01J37/00; H01J37/32; H01J37/32431; H01J37/32798; H01J37/32816; H01J37/32834; H01J37/32844; Y; Y10; Y10T; Y10T279/00; Y10T279/23; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49826; Y10T29/49885
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
76 words
A method of forming a bonding portion, comprising the steps of: forming a projection at a surface bonding portion of a conductive member; forming an insulating layer on at least a surface of the conductive member, which has the projection; removing a part of said insulating layer on the surface of the projection; and bonding a member to be bonded to the surface of the projection, from which the part of the insulating layer is removed.
Claim 2
Independent Claim
76 words
A method of forming a bonding portion, comprising the steps of: forming a projection at a surface bonding portion of a conductive member; forming an insulating layer on at least a surface of the conductive member, which has the projection; removing a part of said insulating layer on the surface of the projection; and bonding a member to be bonded to the surface of the projection, from which the part of the insulating layer is removed.
Claim 3
Dependent Claim
23 words
The method of forming a bonding portion according to claim 1, wherein said conductive member is formed of aluminum or an aluminum alloy.
Claim 4
Dependent Claim
26 words
The method of forming a bonding portion according to claim 1, wherein said insulating layer is formed of Al 2 O 3 or AlF 3 .
Claim 5
Dependent Claim
26 words
The method of forming a bonding portion according to claim 1, wherein the height of said projection is in a range of 30 to 200 μm.
Claim 6
Dependent Claim
27 words
The method of forming a bonding portion according to claim 1, wherein the thickness of said insulating layer is in a range of 31 to 200 μm.
Claim 7
Dependent Claim
28 words
The method of forming a bonding portion according to claim 1, wherein said projection is formed at a substantially central portion of a bonding surface of the member.
Claim 8
Independent Claim
69 words
A method of forming a bonding portion, comprising the steps of: forming a projection on a surface of a conductive member; forming an insulating layer on the surface of the member, the insulating layer having a thickness to cover the projection; and polishing the insulating layer and the projection so that at least the surface of the projection is exposed, and mirror-surface polishing a bonding surface of the member.
Claim 9
Independent Claim
69 words
A method of forming a bonding portion, comprising the steps of: forming a projection on a surface of a conductive member; forming an insulating layer on the surface of the member, the insulating layer having a thickness to cover the projection; and polishing the insulating layer and the projection so that at least the surface of the projection is exposed, and mirror-surface polishing a bonding surface of the member.
Claim 10
Dependent Claim
23 words
The method of forming a bonding portion according to claim 7, wherein said conductive member is formed of aluminum or an aluminum alloy.
Claim 11
Dependent Claim
26 words
The method of forming a bonding portion according to claim 7, wherein said insulating layer is formed of Al 2 O 3 or AlF 3 .
Claim 12
Dependent Claim
26 words
The method of forming a bonding portion according to claim 7, wherein the height of said projection is in a range of 30 to 200 μm.
Claim 13
Dependent Claim
27 words
The method of forming a bonding portion according to claim 7, wherein the thickness of said insulating layer is in a range of 31 to 200 μm.
Claim 14
Dependent Claim
28 words
The method of forming a bonding portion according to claim 7, wherein said projection is formed at a substantially central portion of the bonding surface of the member.
Claim 15
Dependent Claim
28 words
The method of forming a bonding portion according to claim 7, wherein the surface roughness is set at 20 μm or less at Rmax by said mirror-surface polishing.
Claim 16
Independent Claim
91 words
A method of bonding members, thereby to make structural members of a process apparatus electrically conductive, the process apparatus processing an object to be processed in a reduced-pressure atmosphere, the method comprising the steps of: forming a projection on a bonding portion of at least one of the members; forming an insulating layer on bonding surfaces of the members; removing the insulating layer on the surface of the projection; and putting out of the members to be bonded into contact with the surface of the projection exposed in the preceding step.
Claim 17
Independent Claim
91 words
A method of bonding members, thereby to make structural members of a process apparatus electrically conductive, the process apparatus processing an object to be processed in a reduced-pressure atmosphere, the method comprising the steps of: forming a projection on a bonding portion of at least one of the members; forming an insulating layer on bonding surfaces of the members; removing the insulating layer on the surface of the projection; and putting out of the members to be bonded into contact with the surface of the projection exposed in the preceding step.
Claim 18
Dependent Claim
19 words
The method of bonding according to claim 14, wherein said members are formed of aluminum or an aluminum alloy.
Claim 19
Dependent Claim
23 words
The method of bonding according to claim 14, wherein said insulating layer is formed of Al 2 O 3 or AlF 3 .
Claim 20
Dependent Claim
23 words
The method of bonding according to claim 14, wherein the height of said projection is in a range of 30 to 200 μm.
Claim 21
Dependent Claim
24 words
The method of bonding according to claim 14, wherein the thickness of said insulating layer is in a range of 31 to 200 μm.
Claim 22
Dependent Claim
25 words
The method of bonding according to claim 14, wherein said projection is formed at a substantially central portion of the bonding surface of the member.
Claim 23
Independent Claim
106 words
A method of bonding members, thereby to make structural members of a process apparatus electrically conductive, the process apparatus processing an object to be processed in a reduced-pressure atmosphere, the method comprising the steps of: forming a projection on a bonding surface of each of the members; forming an insulating layer on the bonding surface of each of the members, the insulating layer having a thickness to cover said projection; polishing said insulating layer to a surface of the projection, polishing simultaneously the insulating layer and the projection, and mirror-surface finishing the bonding surfaces of the members; and putting the projections of the members in contact.
Claim 24
Independent Claim
106 words
A method of bonding members, thereby to make structural members of a process apparatus electrically conductive, the process apparatus processing an object to be processed in a reduced-pressure atmosphere, the method comprising the steps of: forming a projection on a bonding surface of each of the members; forming an insulating layer on the bonding surface of each of the members, the insulating layer having a thickness to cover said projection; polishing said insulating layer to a surface of the projection, polishing simultaneously the insulating layer and the projection, and mirror-surface finishing the bonding surfaces of the members; and putting the projections of the members in contact.
Claim 25
Dependent Claim
19 words
The method of bonding according to claim 20, wherein said members are formed of aluminum or an aluminum alloy.
Claim 26
Dependent Claim
23 words
The method of bonding according to claim 20, wherein said insulating layer is formed of Al 2 O 3 or AlF 3 .
Claim 27
Dependent Claim
23 words
The method of bonding according to claim 20, wherein the height of said projection is in a range of 30 to 200 μm.
Claim 28
Dependent Claim
24 words
The method of bonding according to claim 20, wherein the thickness of said insulating layer is in a range of 31 to 200 μm.
Claim 29
Dependent Claim
26 words
The method of bonding according to claim 20, wherein said projection is formed at a substantially central portion of the bonding portion-side surface of the member.
Claim 30
Dependent Claim
25 words
The method of bonding according to claim 20, wherein the surface roughness is set at 20 μm or less at Rmax by said mirror-surface polishing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-12-10 | 2000-06-10 | 2000-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-12-10 | 2004-06-10 | 2004-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-12-10 | 2008-06-10 | 2008-12-10 | $7700.00 | Window Closed / Lapsed |