Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
83 words
A method of fabricating an electron emission apparatus comprising the steps of: forming a conductive mesh structure on an insulating substrate; providing a resistive layer on said insulating substrate; forming an insulating layer over said resistive layer, said insulating layer comprising an aerogel; forming a conductive layer on said insulating layer; forming a plurality of apertures through said conductive layer and through said insulating layer; and forming a microtip emitter on said resistive layer within each of said apertures in said conductive layer.
Claim 2
Independent Claim
83 words
A method of fabricating an electron emission apparatus comprising the steps of: forming a conductive mesh structure on an insulating substrate; providing a resistive layer on said insulating substrate; forming an insulating layer over said resistive layer, said insulating layer comprising an aerogel; forming a conductive layer on said insulating layer; forming a plurality of apertures through said conductive layer and through said insulating layer; and forming a microtip emitter on said resistive layer within each of said apertures in said conductive layer.
Claim 3
Dependent Claim
18 words
The method in accordance with claim 1 wherein the material of said insulating layer comprises a silica-based aerogel.
Claim 4
Dependent Claim
23 words
The method in accordance with claim 1 wherein the material of said insulating layer has a relative dielectric constant of less than 3.0.
Claim 5
Dependent Claim
27 words
The method in accordance with claim 1 wherein said insulating layer comprises a plurality of sub-layers, wherein adjacent ones of said sub-layers differ in their relative densities.
Claim 6
Independent Claim
156 words
A method of fabricating an emitter plate for use in a field emission device, said method comprising the steps of: providing an insulating substrate; depositing a first conductive layer on a surface of said substrate; coating said first conductive layer with photoresist; applying a patterned mask over said photoresist and developing said photoresist to remove selected portions of said first conductive layer; removing any remaining photoresist; depositing a resistive layer on a surface of said substrate; depositing an insulating layer of a porous material over said resistive layer; depositing a second conductive layer over said insulating layer; forming apertures in said second conductive layer and through said insulating layer; and forming cone-shaped microtips within said apertures on said resistive layer; wherein said step of depositing an insulating layer of a porous material over said emitter plate comprises the step of depositing a layer of a silica-based aerogel having a relative dielectric constant of less than 3.0.
Claim 7
Independent Claim
156 words
A method of fabricating an emitter plate for use in a field emission device, said method comprising the steps of: providing an insulating substrate; depositing a first conductive layer on a surface of said substrate; coating said first conductive layer with photoresist; applying a patterned mask over said photoresist and developing said photoresist to remove selected portions of said first conductive layer; removing any remaining photoresist; depositing a resistive layer on a surface of said substrate; depositing an insulating layer of a porous material over said resistive layer; depositing a second conductive layer over said insulating layer; forming apertures in said second conductive layer and through said insulating layer; and forming cone-shaped microtips within said apertures on said resistive layer; wherein said step of depositing an insulating layer of a porous material over said emitter plate comprises the step of depositing a layer of a silica-based aerogel having a relative dielectric constant of less than 3.0.
Claim 8
Dependent Claim
47 words
The method in accordance with claim 5 wherein said step of depositing an insulating layer of a porous material over said emitter plate comprises the step of depositing a plurality of sub-layers of a porous material, wherein adjacent ones of said sub-layers differ in their relative densities.