US5567983A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency
Assignee: Toshiba Corp
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Filing: 1995-06-06
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Granted: 1996-10-22
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Expires: 2015-06-06
Abstract
Abstract A heat sink is attached to a semiconductor element functioning as an exothermic element, which is mounted on a circuit board and has a predetermined allowable power consumption, thereby cooling the semiconductor element. A semiconductor element having a lower allowable power consumption than the semiconductor element having the predetermined power consumption, which is hardly exposed to a cooling air flow cooled via the heat sink, is connected to a heat conductive auxiliary member connected at one end to the heat sink. Thus, the heat radiation efficiency of the semiconductor element having the lower allowable power consumption is enhanced.
Inventors
- 👤 Naohiko Hirano
- 👤 Yasuhiro Yamaji
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 11:03
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
114 words
A semiconductor apparatus comprising: a circuit board; an exothermic element mounted on said circuit board; a package for covering said exothermic element; a first semiconductor element mounted on said exothermic element and exposed to a coolant flow; a heat sink attached to said first semiconductor element to cool said first semiconductor element by the coolant flow, said heat sink including a plurality of cooling fins to receive said coolant flow; a plurality of second semiconductor elements mounted on said package; and a plurality of conductive auxiliary members, each connected at one end to one of said plurality of cooling fins and at the other end to one of said plurality of second semiconductor elements.
Claim 2
Dependent Claim
114 words
A semiconductor apparatus comprising: a circuit board; an exothermic element mounted on said circuit board; a package for covering said exothermic element; a first semiconductor element mounted on said exothermic element and exposed to a coolant flow; a heat sink attached to said first semiconductor element to cool said first semiconductor element by the coolant flow, said heat sink including a plurality of cooling fins to receive said coolant flow; a plurality of second semiconductor elements mounted on said package; and a plurality of conductive auxiliary members, each connected at one end to one of said plurality of cooling fins and at the other end to one of said plurality of second semiconductor elements.
Claim 3
Dependent Claim
18 words
A semiconductor apparatus according to claim 1, wherein said conductive auxiliary member is formed of an organic material.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-22 | 2000-04-22 | 2000-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-22 | 2004-04-22 | 2004-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-22 | 2008-04-22 | 2008-10-22 | $7700.00 | Window Closed / Lapsed |