Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
166 words
A position sensitive device, comprising: a semiconductor substrate; an epitaxial layer disposed over said semiconductor substrate; a first plurality of tapered photosensitive regions disposed over said epitaxial layer and extending from a first edge of said device towards the opposite edge of said device; a first current output coupled to said first plurality of photosensitive regions; a second plurality of tapered photosensitive regions disposed over said epitaxial layer and extending from said opposite edge of said device towards said first edge of said device, and being interdigitated with said first plurality of photosensitive regions; a second current output coupled to said second plurality of said photosensitive regions; and a tortuous interface region between said first plurality of photosensitive regions and said second plurality of photosensitive regions, said interface region providing a predetermined spacing between said first and second photosensitive regions; whereby the position of a spot of light incident on said device can be calculated from the currents present at said first and second current outputs.
Claim 2
Dependent Claim
166 words
A position sensitive device, comprising: a semiconductor substrate; an epitaxial layer disposed over said semiconductor substrate; a first plurality of tapered photosensitive regions disposed over said epitaxial layer and extending from a first edge of said device towards the opposite edge of said device; a first current output coupled to said first plurality of photosensitive regions; a second plurality of tapered photosensitive regions disposed over said epitaxial layer and extending from said opposite edge of said device towards said first edge of said device, and being interdigitated with said first plurality of photosensitive regions; a second current output coupled to said second plurality of said photosensitive regions; and a tortuous interface region between said first plurality of photosensitive regions and said second plurality of photosensitive regions, said interface region providing a predetermined spacing between said first and second photosensitive regions; whereby the position of a spot of light incident on said device can be calculated from the currents present at said first and second current outputs.
Claim 3
Dependent Claim
16 words
The device of claim 1, wherein said tortuous interface region is covered with an opaque material.
Claim 4
Dependent Claim
36 words
The device of claim 1, wherein said first and second pluralities of photosensitive regions each comprise a plurality of tapered fingers, each extending across said device, each narrowing from a wide base to a narrow tip.
Claim 5
Dependent Claim
46 words
The device of claim 3, wherein the area of said first and second pluralities of photosensitive regions covered by an incident spot of light is proportional to the distance of said spot of light from said first edge and said opposite edge of said device, respectively.
Claim 6
Dependent Claim
33 words
The device of claim 4, wherein the current output at said first current output is inversely proportional to the distance the incident spot of light is from said first edge of said device.
Claim 7
Dependent Claim
33 words
The device of claim 4, wherein the current output at said second current output is inversely proportional to the distance the incident spot of light is from said opposite edge of said device.
Claim 8
Dependent Claim
37 words
The device of claim 1, wherein said semiconductor substrate and said epitaxial layers comprise material of a first conductivity type, and said first and second pluralities of photosensitive regions comprise material of a second semiconductor conductivity type.
Claim 9
Dependent Claim
208 words
An integrated circuit photosensor device, comprising: a bond pad for receiving a common input; a first current output bond pad; a second current output bond pad; a semiconductor substrate; an epitaxial layer overlying said semiconductor substrate; a first plurality of tapered photosensitive regions overlying said epitaxial layer and having the broad ends of the tapers placed at a first edge of said photosensor device and extending towards the opposite edge, said first plurality of tapered photosensitive regions being coupled together and to said first current output bond pad; and a second plurality of tapered photosensitive regions overlying said epitaxial layer and having the broad ends of the tapers placed at said opposite edge of said photosensor device and extending towards the first edge, said second plurality of tapered photosensitive regions being coupled together and to said second current output bond pad, said second plurality of tapered photosensitive regions and said first plurality of tapered photosensitive regions being interdigitated; whereby the linear position of a spot of light incident on said photosensor integrated circuit from each of said first and opposite edges of said photosensor integrated circuit may be calculated by comparing the current output at said first current output to the current output at said second current output.
Claim 10
Dependent Claim
208 words
An integrated circuit photosensor device, comprising: a bond pad for receiving a common input; a first current output bond pad; a second current output bond pad; a semiconductor substrate; an epitaxial layer overlying said semiconductor substrate; a first plurality of tapered photosensitive regions overlying said epitaxial layer and having the broad ends of the tapers placed at a first edge of said photosensor device and extending towards the opposite edge, said first plurality of tapered photosensitive regions being coupled together and to said first current output bond pad; and a second plurality of tapered photosensitive regions overlying said epitaxial layer and having the broad ends of the tapers placed at said opposite edge of said photosensor device and extending towards the first edge, said second plurality of tapered photosensitive regions being coupled together and to said second current output bond pad, said second plurality of tapered photosensitive regions and said first plurality of tapered photosensitive regions being interdigitated; whereby the linear position of a spot of light incident on said photosensor integrated circuit from each of said first and opposite edges of said photosensor integrated circuit may be calculated by comparing the current output at said first current output to the current output at said second current output.
Claim 11
Dependent Claim
38 words
The integrated circuit of claim 8, and also including an interface region disposed between said first plurality of tapered photosensitive regions and said second plurality of tapered photosensitive regions, wherein said interface region comprises a zigzag shaped region.
Claim 12
Dependent Claim
34 words
The integrated circuit of claim 9, wherein said first current output bond pad, said second current output bond pad, said common bond pad, and said interface region are all covered with an opaque material.
Claim 13
Dependent Claim
40 words
The integrated circuit of claim 10, wherein any exposed regions of said photosensor integrated circuit outside of the first plurality of said tapered photosensitive regions and the second plurality of said tapered photosensitive regions are covered with an opaque material.
Claim 14
Dependent Claim
14 words
The integrated circuit of claim 11, wherein said opaque material is a metal layer.
Claim 15
Dependent Claim
96 words
The integrated circuit of claim 8, and further comprising a scribe line region at the outer edges of said integrated circuit wherein said scribe line region comprises: a photosensitive region a first contacting region disposed within said photosensitive region; a second contacting region coupled to a semiconductor substrate; first and second metal contact regions overlying said first and second contacting regions, respectively; and an opaque conductor coupling said first metal contact region to said second contacting region; whereby current due to electrons caused by light incident on said scribe line region is coupled to said substrate.
Claim 16
Dependent Claim
45 words
A semiconductor wafer having an array of photosensor devices thereon and a matrix of scribe lines separating said devices, wherein said wafer also includes a dummy photodiode in a scribe line area, for the purpose of collecting unwanted carriers generated in the scribe line area.
Claim 17
Dependent Claim
45 words
A semiconductor wafer having an array of photosensor devices thereon and a matrix of scribe lines separating said devices, wherein said wafer also includes a dummy photodiode in a scribe line area, for the purpose of collecting unwanted carriers generated in the scribe line area.