US5561592A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid integrated circuit module
Assignee: Fujitsu Ltd
•
Filing: 1994-12-14
•
Granted: 1996-10-01
•
Expires: 2014-12-14
Abstract
Abstract In a hybrid integrated circuit module in which circuit components, including semiconductor devices and chip components, are integrated and which is bonded onto a heat-sinking substrate, a substrate for mounting chip components is made of a low thermal conductivity material and is bonded onto the heat-sinking substrate; a base plate for mounting semiconductor devices is made of a high thermal conductivity material and is bonded onto the heat-sinking substrate; a hollow cover covers a space above the base plate to make an enclosure between the base plate and the cover; a sealing means hermetically seals the enclosure; and a plurality of interconnection leads is formed through the cover to electrically connect a circuit on the base plate and a circuit on the substrate and for testing operating signals in the semiconductor devices.
Inventors
- 👤 Nagahisa Furutani
- 👤 Nobutoshi Fukuden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:08
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W76/00; H10W76/60; H10W90/00; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09381; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/17; H05K2203/176; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/3494; H10W44/226; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/5475; H10W90/701; H10W90/751; H10W90/753; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
182 words
A hybrid integrated circuit module, comprising: circuit components, including semiconductor devices and chip components; a heat-sinking substrate; an integrated circuit substrate, bonded onto the heat-sinking substrate and mounting the chip components; a base plate, having a high thermal conductivity, bonded onto the heat-sinking substrate and mounting the semiconductor devices; a hollow cover covering a space above the base plate to make an enclosure between the base plate and the cover; a sealing means sealing a joint face between the base plate and the cover to hermetically seal the enclosure; a plurality of interconnection leads extending through the cover for electrically connecting a circuit on the base plate and a circuit on the substrate; a pair of interconnection leads extending through the cover for testing operating signals in the semiconductor devices; and bias resistors, including a main bias resistor having a high power-withstanding capability and a trimming bias resistor that is not required to have a high power-withstanding capability, the main bias resistor being accommodated inside the enclosure and the trimming bias resistor being mounted on the integrated circuit substrate outside the enclosure.
Claim 2
Dependent Claim
182 words
A hybrid integrated circuit module, comprising: circuit components, including semiconductor devices and chip components; a heat-sinking substrate; an integrated circuit substrate, bonded onto the heat-sinking substrate and mounting the chip components; a base plate, having a high thermal conductivity, bonded onto the heat-sinking substrate and mounting the semiconductor devices; a hollow cover covering a space above the base plate to make an enclosure between the base plate and the cover; a sealing means sealing a joint face between the base plate and the cover to hermetically seal the enclosure; a plurality of interconnection leads extending through the cover for electrically connecting a circuit on the base plate and a circuit on the substrate; a pair of interconnection leads extending through the cover for testing operating signals in the semiconductor devices; and bias resistors, including a main bias resistor having a high power-withstanding capability and a trimming bias resistor that is not required to have a high power-withstanding capability, the main bias resistor being accommodated inside the enclosure and the trimming bias resistor being mounted on the integrated circuit substrate outside the enclosure.
Claim 3
Dependent Claim
37 words
A hybrid integrated circuit module as set forth in claim 1, wherein: the substrate has an opening at the center thereof and the base plate is positioned in the opening without contacting the edge of the opening.
Claim 4
Dependent Claim
35 words
A hybrid integrated circuit module as set forth in claim 1, wherein: a bias resistor and a grounding capacitor for a semiconductor device are disposed inside the enclosure in close proximity to the semiconductor device.
Claim 5
Dependent Claim
41 words
A hybrid integrated circuit module as set forth in claim 1, wherein: at least one electrode on which a particular chip component is mounted includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
Claim 6
Dependent Claim
20 words
A hybrid integrated circuit module as set forth in claim 2, wherein: a grounding capacitor is disposed inside the enclosure.
Claim 7
Dependent Claim
68 words
A hybrid integrated circuit module as set forth in claim 2, wherein: said bias resistors, consisting of said main bias resistor that is required to have a high power-withstanding capability and said trimming bias resistor that is not required to have a high power-withstanding capability, said main bias resistor being accommodated inside the enclosure and the trimming bias resistor mounted on the integrated circuit substrate outside the enclosure.
Claim 8
Dependent Claim
41 words
A hybrid integrated circuit module as set forth in claim 2, wherein: at least one electrode on which a particular chip component is mounted includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
Claim 9
Dependent Claim
68 words
A hybrid integrated circuit module as set forth in claim 3, wherein: said bias resistors consisting of said main bias resistor that is required to have a high power-withstanding capability and said trimming bias resistor that is not required to have a high power-withstanding capability, said main bias resistor being accommodated inside the enclosure and the trimming bias resistor mounted on the integrated circuit substrate outside the enclosure.
Claim 10
Dependent Claim
41 words
A hybrid integrated circuit module as set forth in claim 3, wherein: at least one electrode on which a particular chip component is mounted includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
Claim 11
Dependent Claim
67 words
A hybrid integrated circuit module as set forth claim 5, wherein: said bias resistors consisting of said main bias resistor that is required to have a high power-withstanding capability and said trimming bias resistor that is not required to have a high power-withstanding capability, said main bias resistor being accommodated inside the enclosure and the trimming bias resistor mounted on the integrated circuit substrate outside the enclosure.
Claim 12
Dependent Claim
41 words
A hybrid integrated circuit module as set forth in claim 5, wherein: at least one electrode on which a particular chip component is mounted includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
Claim 13
Dependent Claim
38 words
A hybrid integrated circuit module as set forth in claim 6, wherein: at least one electrode on which a particular chip includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
Claim 14
Dependent Claim
38 words
A hybrid integrated circuit module as set forth in claim 8, wherein: at least one electrode on which a particular chip includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
Claim 15
Dependent Claim
38 words
A hybrid integrated circuit module as set forth in claim 10, wherein: at least one electrode on which a particular chip includes a projecting electrode portion approaching the other electrode on which the same chip component is mounted.
References Cited (Backward Citations)
DE306890C
Cited
DE478426C
Cited
US3582762A
Cited
US4001711A
Cited
US4297647A
Cited
US5159433A
Cited
US4965526A
Cited
US5223741A
Cited
US5270493A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-10-01 | 2000-04-01 | 2000-10-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-10-01 | 2004-04-01 | 2004-10-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-10-01 | 2008-04-01 | 2008-10-01 | $7700.00 | Window Closed / Lapsed |