US5559677A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a device by selectively thermal spraying a metallic conductive material thereon
Assignee: Motorola Solutions Inc
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Filing: 1995-02-14
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Granted: 1996-09-24
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Expires: 2015-02-14
Abstract
Abstract The method disclosed herein begins with a molded housing (13 or 31). In one embodiment (20) the molded housing (13) has a ground shield (14) that is formed by thermally spraying a metallic conductive material onto the housing (13). Electrical connections are then made to link an electronic circuit on a printed circuit board assembly (21) to the ground shield (14). In another embodiment (30), the molded housing (31) has a plurality of elements (such as an indented channel (32), extrusions (33), a slot connector (34), and a notch (35)) that are thermally sprayed in selected areas to form a plurality of connective elements required by the electronic circuit of the printed circuit board assembly.
Inventors
- 👤 Dominic R. Errichiello
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 16:55
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0073; H05K9/0081; H05K9/0084
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
88 words
An electronic device comprising: (a) a printed circuit board assembly having a plurality of electronic components forming an electronic circuit; (b) a three-dimensional molded housing comprised of plastic, the three-dimensional molded housing including: (i) an inner surface disposed about the electronic circuit, wherein at least a part of the inner surface has a ground shield comprised of a metallic conductive material thermally sprayed thereon; and (ii) a plurality of molded elements, wherein selected areas of the plurality of molded elements are thermally sprayed with a metallic conductive material.
Claim 2
Dependent Claim
88 words
An electronic device comprising: (a) a printed circuit board assembly having a plurality of electronic components forming an electronic circuit; (b) a three-dimensional molded housing comprised of plastic, the three-dimensional molded housing including: (i) an inner surface disposed about the electronic circuit, wherein at least a part of the inner surface has a ground shield comprised of a metallic conductive material thermally sprayed thereon; and (ii) a plurality of molded elements, wherein selected areas of the plurality of molded elements are thermally sprayed with a metallic conductive material.
Claim 3
Dependent Claim
15 words
The electronic device of claim 1, wherein the metallic conductive material is comprised of copper.
Claim 4
Dependent Claim
15 words
The electronic device of claim 1, wherein the metallic conductive material is comprised of silver.
Claim 5
Dependent Claim
15 words
The electronic device of claim 1, wherein the metallic conductive material is comprised of gold.
Claim 6
Dependent Claim
16 words
The electronic device of claim 1, wherein the plurality of molded elements includes an indented channel.
Claim 7
Dependent Claim
15 words
The electronic device of claim 1, wherein the plurality of molded elements includes a notch.
Claim 8
Dependent Claim
98 words
An electronic device comprising: (a) a printed circuit board assembly having a plurality of electronic components forming an electronic circuit; (b) a three-dimensional molded housing comprised of plastic, the three-dimensional molded housing including; (i) an inner surface disposed about the electronic circuit, wherein at least a part of the inner surface has a ground shield comprised of a metallic conductive material thermally sprayed thereon; and (ii) a plurality of molded elements, wherein selected areas of the plurality of molded elements are thermally sprayed with a metallic conductive material, wherein the plurality of molded elements includes a slot connector.
Claim 9
Dependent Claim
98 words
An electronic device comprising: (a) a printed circuit board assembly having a plurality of electronic components forming an electronic circuit; (b) a three-dimensional molded housing comprised of plastic, the three-dimensional molded housing including; (i) an inner surface disposed about the electronic circuit, wherein at least a part of the inner surface has a ground shield comprised of a metallic conductive material thermally sprayed thereon; and (ii) a plurality of molded elements, wherein selected areas of the plurality of molded elements are thermally sprayed with a metallic conductive material, wherein the plurality of molded elements includes a slot connector.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-09-24 | 2000-03-25 | 2000-09-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-09-24 | 2004-03-25 | 2004-09-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-09-24 | 2008-03-25 | 2008-09-24 | $7700.00 | Window Closed / Lapsed |