Abstract An apparatus mounted on a vehicle frame for cleaning liquids and solids from a sub-surface enclosure. The apparatus comprises a water tank having a drain valve and a feed valve. A water pump is connected to the feed valve that supplies water to a high pressure cleaning device used for loosening waste solids in the sub-surface enclosure. A suction pump connected to a suction hose removes the waste from the sub-surface enclosure and directs it to either of two waste tanks through a valve configuration comprising an inlet valve connected to one waste tank and a second inlet valve connected to the other waste tank. The two inlet valves selectively allow the waste removed from the sub-surface enclosure to enter either the first waste tank, the second waste tank or both. A method for cleaning the sub-surface enclosure is also provided.
Inventors
👤 Stephen W. Ward
👤 Ray E. Harwood
Bibliographic Details
Application Number—
JurisdictionUS
Data Sourcegoogle_patents
Last Synchronized2026-11-04 10:20
CPC Classifications
B; B08; B08B; B08B3/00; B08B3/02; B08B3/026
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
225 words
A method for cleaning liquids and solids from a sub-surface electrical enclosure that may have hazardous materials present, comprising: opening a water feed valve attached to a water tank for supplying water to a water pump to clean the sub-surface electrical enclosure; attaching a high pressure cleaning device to the water pump; starting the water pump; semi-liquefying the solids in the sub-surface electrical enclosure with the high pressure cleaning device to form a slurry; attaching a suction hose to a suction pump to draw the liquids and solids from the sub-surface electrical enclosure; opening a first waste inlet valve in fluid communication with a first waste tank so that liquids and solids can be received in the first waste tank; starting the suction pump; suctioning the liquids and solids from the sub-surface electrical enclosure through the suction hose to the first waste tank; stopping the water pump and the suction pump when the liquids and solids have been removed from the sub-surface electrical enclosure; attaching a clean-out attachment to the suction hose to flush the suction hose, the suction pump, and the first waste inlet valve; connecting the high pressure cleaning device to the clean-out attachment; and running the water pump and the suction pump until the suction hose, the suction pump, and the first waste inlet valve are clean of the liquids and solids.
Claim 2
Independent Claim
225 words
A method for cleaning liquids and solids from a sub-surface electrical enclosure that may have hazardous materials present, comprising: opening a water feed valve attached to a water tank for supplying water to a water pump to clean the sub-surface electrical enclosure; attaching a high pressure cleaning device to the water pump; starting the water pump; semi-liquefying the solids in the sub-surface electrical enclosure with the high pressure cleaning device to form a slurry; attaching a suction hose to a suction pump to draw the liquids and solids from the sub-surface electrical enclosure; opening a first waste inlet valve in fluid communication with a first waste tank so that liquids and solids can be received in the first waste tank; starting the suction pump; suctioning the liquids and solids from the sub-surface electrical enclosure through the suction hose to the first waste tank; stopping the water pump and the suction pump when the liquids and solids have been removed from the sub-surface electrical enclosure; attaching a clean-out attachment to the suction hose to flush the suction hose, the suction pump, and the first waste inlet valve; connecting the high pressure cleaning device to the clean-out attachment; and running the water pump and the suction pump until the suction hose, the suction pump, and the first waste inlet valve are clean of the liquids and solids.
Claim 3
Dependent Claim
76 words
The method of claim 1 further comprising: opening a second waste inlet valve in fluid communication with a second waste tank so that liquids and solids can be received in the second waste tank; closing the first waste inlet valve; suctioning the liquid and solids from the sub-surface electrical enclosure to the second waste liquid tank; and cleaning the second waste inlet valve along with the suction hose and the suction pump through the clean-out attachment.
Claim 4
Dependent Claim
39 words
The method of claim 2, further comprising: closing the second waste inlet valve; opening the first waste inlet valve; and cleaning the first waste inlet valve along with the suction hose and the suction pump through the clean-out attachment.