US5545923A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device assembly with minimized bond finger connections
Assignee: Adeia Semiconductor Technologies LLC
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Filing: 1995-02-28
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Granted: 1996-08-13
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Expires: 2015-02-28
Abstract
Abstract A semiconductor device assembly having external connections, including power supply connections such as to a power source or ground, is made without resort to bond fingers. Rather, external connections are directly made from a semiconductor die to a conductive layer. The conductive layer is disposed on one surface of a printed wring board and is divided into electrically insulated conductive segments. Each of the conductive segments is connected to an external connection, and includes one or more interconnects that can be directly connected to a semiconductor die. The conductive segments are surrounded by an array of bond fingers which serve to connect the semiconductor die to further external connections, such as signal connections. The present invention is especially advantageous in the fabrication of pin grid array (PGA) and ball grid array (BGA) type integrated circuit packages.
Inventors
- 👤 Ivor Barber
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5449; H10W72/547; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
154 words
A semiconductor device assembly, comprising: (a) a primed wiring board substrate; (b) a planar conductive layer centrally disposed on one surface of said printed wiring board substrate, said planar conductive layer including one or more coplanar conductive segments electrically insulated from one another, each coplanar conductive segment adapted for connection thereto; (c) a plurality of bond fingers substantially surrounding and coplanar with said planar conductive layer, each bond finger adapted for connection thereto; and (d) a semiconductor die disposed above said planar conductive layer, said semiconductor die having bond pads thereon, each coplanar conductive segment of said planar conductive layer having portions substantially the same distance from the semiconductor die bond pads, wherein those portions of each of the coplanar conductive segments being connected directly to a respective bond pad with substantially the same length of connection, and one or more of said plurality of bond fingers being connected to other respective bond pads.
Claim 2
Dependent Claim
154 words
A semiconductor device assembly, comprising: (a) a primed wiring board substrate; (b) a planar conductive layer centrally disposed on one surface of said printed wiring board substrate, said planar conductive layer including one or more coplanar conductive segments electrically insulated from one another, each coplanar conductive segment adapted for connection thereto; (c) a plurality of bond fingers substantially surrounding and coplanar with said planar conductive layer, each bond finger adapted for connection thereto; and (d) a semiconductor die disposed above said planar conductive layer, said semiconductor die having bond pads thereon, each coplanar conductive segment of said planar conductive layer having portions substantially the same distance from the semiconductor die bond pads, wherein those portions of each of the coplanar conductive segments being connected directly to a respective bond pad with substantially the same length of connection, and one or more of said plurality of bond fingers being connected to other respective bond pads.
Claim 3
Dependent Claim
35 words
The semiconductor device assembly as recited in claim 1, wherein at least one of the one or more conductive segments of said planar conductive layer is operable to connect said semiconductor die to a ground.
Claim 4
Dependent Claim
35 words
The semiconductor device assembly as recited in claim 1, wherein at least one of the one more conductive segments of said planar conductive layer is operable to connect said semiconductor die to a power source.
Claim 5
Dependent Claim
17 words
The semiconductor device assembly as recited in claim 1, wherein said conductive layer is comprised of metal.
Claim 6
Dependent Claim
14 words
The semiconductor device assembly as recited in claim 4, wherein the metal is copper.
Claim 7
Dependent Claim
18 words
The semiconductor device assembly as recited in claim 1, further comprising an encapsulant disposed above said semiconductor die.
Claim 8
Dependent Claim
203 words
A semiconductor device assembly, comprising: (a) a printed wiring board substrate having a top and bottom surface; (b) contact pads adapted for connection to external circuits, said contact pads disposed on the bottom surface of said printed wiring board substrate; (c) a planar conductive layer disposed on the top surface of said printed wiring board substrate, said planar conductive layer including one or more coplanar conductive segments electrically insulated from one another; (d) a plurality of vias connecting each coplanar conductive segment of said planar conductive layer to one or more of the contact pads; (e) a plurality of bond fingers substantially surrounding and coplanar with said planar conductive layer, each bond finger connected to one or more of the contact pads; and (f) a semiconductor die disposed above said planar conductive layer, said semiconductor die having bond pads thereon, each coplanar conductive segment of said planar conductive layer having portions substantially the same distance from the semiconductor die bond pads, wherein those portions of each of the coplanar conductive segments being directly connected to a respective bond pad with substantially the same length of connection, one or more of said plurality of bond fingers each being connected to other respective bond pads.
Claim 9
Dependent Claim
203 words
A semiconductor device assembly, comprising: (a) a printed wiring board substrate having a top and bottom surface; (b) contact pads adapted for connection to external circuits, said contact pads disposed on the bottom surface of said printed wiring board substrate; (c) a planar conductive layer disposed on the top surface of said printed wiring board substrate, said planar conductive layer including one or more coplanar conductive segments electrically insulated from one another; (d) a plurality of vias connecting each coplanar conductive segment of said planar conductive layer to one or more of the contact pads; (e) a plurality of bond fingers substantially surrounding and coplanar with said planar conductive layer, each bond finger connected to one or more of the contact pads; and (f) a semiconductor die disposed above said planar conductive layer, said semiconductor die having bond pads thereon, each coplanar conductive segment of said planar conductive layer having portions substantially the same distance from the semiconductor die bond pads, wherein those portions of each of the coplanar conductive segments being directly connected to a respective bond pad with substantially the same length of connection, one or more of said plurality of bond fingers each being connected to other respective bond pads.
Claim 10
Dependent Claim
20 words
The semiconductor device assembly as recited in claim 7, wherein each conductive segment is interleaved with respect to one another.
Claim 11
Dependent Claim
44 words
The semiconductor device assembly as recited in claim 7, further comprising a plurality of conductive patterns disposed on the bottom surface of said printed wiring board substrate, said plurality of conductive patterns being operable to connect said plurality of vias to respective contact pads.
Claim 12
Dependent Claim
267 words
A semiconductor device assembly, comprising: (a) a printed wiring board substrate having a top and bottom surface; (b) a plurality of contact pads disposed on the bottom surface of said printed wiring board substrate; (c) at least one planar inner conductive segment centrally disposed on the top surface of said printed wiring board substrate, said at least one inner conductive segment connected to one or more of the contact pads that are disposed opposite said at least one inner conductive segment; (d) one or more coplanar outer conductive segments disposed on the top surface of said printed wiring board substrate and substantially surrounding said one or more inner conductive segments, said one or more outer conductive segments connected to one or more of the contact pads disposed opposite said one or more coplanar outer conductive segments; (e) a plurality of bond fingers disposed on the top surface of said printed wiring board substrate and substantially surrounding and coplanar with said one or more outer conductive segments, said plurality of bond fingers connected to one or more of the contact pads; and (f) a semiconductor die disposed above said one or more inner conductive segments, said semiconductor die having bond pads thereon, each coplanar inner and outer conductive segment having portions substantially the same distance from the semiconductor die bond pads, wherein those portions of each of the coplanar conductive segments being directly connected to a respective bond pad with substantially the same length of connection being directly connected to a bond pad, other bond pads each being directly connected to one of said plurality of bond fingers.
Claim 13
Dependent Claim
267 words
A semiconductor device assembly, comprising: (a) a printed wiring board substrate having a top and bottom surface; (b) a plurality of contact pads disposed on the bottom surface of said printed wiring board substrate; (c) at least one planar inner conductive segment centrally disposed on the top surface of said printed wiring board substrate, said at least one inner conductive segment connected to one or more of the contact pads that are disposed opposite said at least one inner conductive segment; (d) one or more coplanar outer conductive segments disposed on the top surface of said printed wiring board substrate and substantially surrounding said one or more inner conductive segments, said one or more outer conductive segments connected to one or more of the contact pads disposed opposite said one or more coplanar outer conductive segments; (e) a plurality of bond fingers disposed on the top surface of said printed wiring board substrate and substantially surrounding and coplanar with said one or more outer conductive segments, said plurality of bond fingers connected to one or more of the contact pads; and (f) a semiconductor die disposed above said one or more inner conductive segments, said semiconductor die having bond pads thereon, each coplanar inner and outer conductive segment having portions substantially the same distance from the semiconductor die bond pads, wherein those portions of each of the coplanar conductive segments being directly connected to a respective bond pad with substantially the same length of connection being directly connected to a bond pad, other bond pads each being directly connected to one of said plurality of bond fingers.
Claim 14
Dependent Claim
30 words
The semiconductor device assembly as recited in claim 10, wherein the at least one inner conductive segment is connected to one or more contact pads that provide a ground connection.
Claim 15
Dependent Claim
20 words
The semiconductor device assembly as recited in claim 10, wherein the one or more outer conductive segments are concentric rings.
Claim 16
Dependent Claim
29 words
The semiconductor device assembly as recited in claim 12, wherein the concentric rings are connected to one or more contact pads that provide one or more power source connections.
Claim 17
Dependent Claim
20 words
The semiconductor device assembly as recited in claim 7, wherein said contact pads are adapted for connection to conductive pins.
Claim 18
Dependent Claim
21 words
The semiconductor device assembly as recited in claim 7, wherein said contact pads are adapted for connection to conductive solder balls.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-13 | 2000-02-12 | 2000-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-13 | 2004-02-12 | 2004-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-13 | 2008-02-12 | 2008-08-13 | $7700.00 | Window Closed / Lapsed |