US5535526A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for surface mounting flip chip carrier modules
Assignee: GlobalFoundries Inc
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Filing: 1995-05-25
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Granted: 1996-07-16
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Expires: 2015-05-25
Abstract
Abstract A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or between the encapsulant and the chip carrier substrate surface. The concentration of free moisture in the encapsulant is maintained below a predetermined safe limit during reflow heating used to mount the modules on a circuit board.
Inventors
- 👤 Lawrence H. White
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 12:28
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10954; H05K2201/10977; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/0415; H05K3/22; H05K3/28; H05K3/284; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/877; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49204; Y10T29/53; Y10T29/5313; Y10T29/53174
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
101 words
Apparatus for manufacturing an interconnect assembly, comprising: an organic, flip-chip carrier substrate; a flip-chip connected directly to the substrate using an array of reflow solder connections, to form a flip-chip carrier with the chip separated from the substrate by a volume around the connections; an organic encapsulant material filling the volume between the substrate and connected flip-chip to protect the solder connections and form a finished carrier; and means for controlling the level of moisture in the encapsulant between the flip-chip and carrier substrate to provide a sufficiently low level for subsequent solder attachment without forming solder bridges between the connections.
Claim 2
Dependent Claim
101 words
Apparatus for manufacturing an interconnect assembly, comprising: an organic, flip-chip carrier substrate; a flip-chip connected directly to the substrate using an array of reflow solder connections, to form a flip-chip carrier with the chip separated from the substrate by a volume around the connections; an organic encapsulant material filling the volume between the substrate and connected flip-chip to protect the solder connections and form a finished carrier; and means for controlling the level of moisture in the encapsulant between the flip-chip and carrier substrate to provide a sufficiently low level for subsequent solder attachment without forming solder bridges between the connections.
Claim 3
Dependent Claim
29 words
The apparatus of claim 1 in which the means for controlling the level of moisture includes means to prevent the diffusion of moisture into the encapsulant in the carrier.
Claim 4
Dependent Claim
34 words
The apparatus of claim 2 in which the means to prevent the diffusion of moisture includes means to store the finished carrier at an temperature elevated above ambient of at least about 40° C.
Claim 5
Dependent Claim
29 words
The apparatus of claim 2 in which the means for controlling the diffusion of moisture include means to store the finished carrier in a sealed approximately air tight bag.
Claim 6
Dependent Claim
35 words
The apparatus of claim 1 in which the means for controlling the level of moisture includes means to heat the finished carrier for baking the finished carrier at a temperature of at least 100° C.
Claim 7
Dependent Claim
31 words
The apparatus of claim 2 in which the means for controlling the diffusion of moisture includes means to assure using finished carriers within one week of their exposure to ambient atmosphere.
Claim 8
Dependent Claim
52 words
The apparatus of claim 4 in which means to store finished carrier in a sealed bag include: a sealed plastic approximately air tight bag enclosing a multiple of finished carriers; and containers of dessicant material exposed to an atmosphere in the plastic bag, enclosed in the plastic bag with the finished carriers.
Claim 9
Dependent Claim
26 words
The apparatus of claim 5 in which the means for baking the finished carrier includes means to heat the finished carrier to at least 125° C.
Claim 10
Dependent Claim
21 words
The apparatus of claim 5 further including timing means to assure that the finished carrier is heated for a sufficient time.
Claim 11
Dependent Claim
21 words
The apparatus of claim 9 further including timing means to assure that the finished carrier is heated at least 12 hours.
Claim 12
Dependent Claim
27 words
The apparatus of claim 5 further including means for determining the time or temperature of baking depending on the humidity level or time of exposure to moisture.
Claim 13
Dependent Claim
20 words
The apparatus of claim 1 in which the organic substrate is a flexible laminate including layers of polyimide and copper.
Claim 14
Dependent Claim
12 words
The apparatus of claim 1 in which the substrate includes reinforcing fibers.
Claim 15
Dependent Claim
18 words
The apparatus of claim 13 in which the fibers are fiberglass and the substrate includes an epoxy filler.
Claim 16
Dependent Claim
11 words
The apparatus of claim 4 in which the bag contains dessicant.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-07-16 | 2000-01-15 | 2000-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-07-16 | 2004-01-15 | 2004-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-07-16 | 2008-01-15 | 2008-07-16 | $7700.00 | Window Closed / Lapsed |