US5525912A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Probing equipment and a probing method
Assignee: Toshiba Corp
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Filing: 1995-03-09
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Granted: 1996-06-11
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Expires: 2015-03-09
Abstract
Abstract A wafer prober comprises a wafer chuck for chucking a wafer and a probe card holding section for holding two or more probe cards. The wafer prober further comprises a test section for simultaneously testing a plurality of chips among chips in one wafer, with use of the two or more probe cards, while respectively making probe sections included in the two or more probe cards be in contact with external terminal sections of the plurality of chips.
Inventors
- 👤 Tomomi Momohara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 17:01
CPC Classifications
G; G01; G01R; G01R1/00; G01R1/02; G01R1/06; G01R1/067; G01R1/06705
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
81 words
A wafer prober comprising: a wafer chucking device for chucking a semi-conductor wafer in which integrated circuit chips are arranged in a matrix; a probe card holding device for holding two or more probe cards; and a test device for simultaneously testing a plurality of chips in one wafer with use of the two or more probe cards, while respectively making probes included in the two or more probe cards be in contact with external terminals of the plurality of chips.
Claim 2
Dependent Claim
81 words
A wafer prober comprising: a wafer chucking device for chucking a semi-conductor wafer in which integrated circuit chips are arranged in a matrix; a probe card holding device for holding two or more probe cards; and a test device for simultaneously testing a plurality of chips in one wafer with use of the two or more probe cards, while respectively making probes included in the two or more probe cards be in contact with external terminals of the plurality of chips.
Claim 3
Dependent Claim
41 words
A wafer prober according to claim 1, wherein the probe card holding device includes two or more installation sections in which the probe cards are installed, and two or more pin groups electrically connected to the terminals of the probe cards.
Claim 4
Dependent Claim
25 words
A wafer prober according to claim 2, wherein the two or more installation sections respectively include insert rings to which the probe cards are attached.
Claim 5
Dependent Claim
29 words
A wafer prober according to claim 3, wherein the insert ring respectively include internal insert rings into which "the probe cards are inserted and said insert rings is rotated.
Claim 6
Dependent Claim
21 words
A wafer prober according to claim 2, wherein the two or more installation sections are independently moved in X- and Y-directions.
Claim 7
Dependent Claim
51 words
A wafer prober according to claim 5, wherein each of the two or more installation sections includes an adjustment device for performing a fine adjustment in the X-direction, an adjustment device for performing a fine adjustment in the Y-direction, and an adjustment device for performing a fine adjustment in a θ-direction.
Claim 8
Dependent Claim
57 words
A wafer prober according to claim 6, wherein the two or more installation sections respectively insert rings into which the probe cards are inserted, said insert rings including internal insert rings which are rotated by the adjustment device for performing the fine adjustment in the θ-direction, and said probe cards being attached to the internal insert rings.
Claim 9
Dependent Claim
87 words
A wafer prober according to claim 2, wherein a relation between the probe cards and the wafer to be tested satisfies an inequality as follows: φ-WAFER≧(φ-CARD1+φ-CARD2)/2+Δ-HOLDER wherein the φ-WAFER is a diameter of the wafer, the φ-CARD1 is a diameter of one of the probe card, the φ-CARD2 is a diameter of another one of the probe card, and Δ-HOLDER is a distance between both of the probe cards, the Δ-HOLDER is a distance as a margin for preventing the installation sections from colliding into each other.
Claim 10
Dependent Claim
21 words
A wafer prober according to claim 8, wherein the diameter of the wafer to be tested is twelve inches or more.
Claim 11
Dependent Claim
27 words
A wafer prober according to claim 9, wherein the diameter of each of the probe cards is four or inches or more and less than eight inches.
Claim 12
Dependent Claim
77 words
A probing method comprising steps of: chucking a semiconductor wafer in which integrated circuit chips are arranged in a matrix, by a wafer chucking device; holding two or more probe cards by a probe card holding device; and respectively making probes included in the two or more probe cards be in contact with external terminals of the chips, and simultaneously testing a plurality of chips in one wafer with use of the two or more probe cards.
Claim 13
Dependent Claim
77 words
A probing method comprising steps of: chucking a semiconductor wafer in which integrated circuit chips are arranged in a matrix, by a wafer chucking device; holding two or more probe cards by a probe card holding device; and respectively making probes included in the two or more probe cards be in contact with external terminals of the chips, and simultaneously testing a plurality of chips in one wafer with use of the two or more probe cards.
References Cited (Backward Citations)
JPS55130137A
Cited
US5254939A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-06-11 | 1999-12-11 | 2000-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-06-11 | 2003-12-11 | 2004-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-06-11 | 2007-12-11 | 2008-06-11 | $7700.00 | Window Closed / Lapsed |