US5519233A
Expired / Lapsed
US
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Microchip capacitor and thin film resistor as circuit elements in internal impedance matching circuit of microwave transistor
Assignee: NEC Electronics Corp
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Filing: 1994-06-03
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Granted: 1996-05-21
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Expires: 2014-06-03
Abstract
Abstract A microchip capacitor used as a circuit element in internal impedance matching circuits of microwave transistors is disclosed. A thin film resistor is used to make interconnection between two first metallized patterns in a paired electrode structure, and a pair of microstrip lines are used to make interconnection between the two first metallized patterns and the second metallized pattern. The thin film resistor and the microstrip lines form a Wilkinson type synthetic circuit wherein a signal flowing in the thin film resistor and a signal flowing in the microstrip lines cancel each other. An isolation between the first and second metallized patterns is improved.
Inventors
- 👤 Tomoyoshi Fukasawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 10:26
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W44/203; H10W44/206; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
99 words
A microchip capacitor having an electrode structure including a plurality of first metallized patterns and at least one second metallized pattern provided on a dielectric substrate, said first metallized patterns and said second metallized pattern constituting a paired electrode structure with two of said first metallized patterns combined with said one second metallized pattern, said electrode structure comprising: a thin film resistor making interconnection between said two first metallized patterns in said paired electrode structure; and a pair of microstrip lines making interconnection between said two first metallized patterns and said second metallized pattern in said paired electrode structure.
Claim 2
Dependent Claim
99 words
A microchip capacitor having an electrode structure including a plurality of first metallized patterns and at least one second metallized pattern provided on a dielectric substrate, said first metallized patterns and said second metallized pattern constituting a paired electrode structure with two of said first metallized patterns combined with said one second metallized pattern, said electrode structure comprising: a thin film resistor making interconnection between said two first metallized patterns in said paired electrode structure; and a pair of microstrip lines making interconnection between said two first metallized patterns and said second metallized pattern in said paired electrode structure.
Claim 3
Dependent Claim
35 words
The microchip capacitor according to claim 1, which comprises a plurality of bonding wires and in which each of said first metallized patterns is coupled to a field-effect transistor via each of said bonding wires.
Claim 4
Dependent Claim
41 words
The microchip capacitor according to claim 1, in which said microstrip lines and said thin film resistor form a synthetic circuit wherein a signal flowing in said thin film resistor and a signal flowing in said microstrip lines cancel each other.
Claim 5
Dependent Claim
18 words
The microchip capacitor according to claim 3, in which said synthetic circuit is a Wilkinson type synthetic circuit.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-21 | 1999-11-20 | 2000-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-21 | 2003-11-20 | 2004-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-21 | 2007-11-20 | 2008-05-21 | $7700.00 | Window Closed / Lapsed |