US5516727A
Expired / Lapsed
US
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Method for encapsulating light emitting diodes
Assignee: GlobalFoundries Inc
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Filing: 1995-01-20
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Granted: 1996-05-14
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Expires: 2015-01-20
Abstract
Abstract A method of encapsulating semiconductor light emitting diodes, in particular laser diodes, characterized in that a gap is formed in an encapsulant, which is positioned in front of the light emitting facet of the diode, the gap preventing the encapsulant from adhering to the light emitting facet.
Inventors
- 👤 Ronald F. Broom
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 08:35
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/8506; G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4202; H01; H01S; H01S5/00; H01S5/02; H01S5/022; H01S5/02218; H01S5/02234; H10H20/855; H01S5/0225; H01S5/02251; H01S5/02253; H01S5/023; H01S5/02325; H01S5/02326; H10H20/852; H10H20/853; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
86 words
A method for encapsulating a laser diode provided with a mirror facet, comprising the steps of: a) bonding the laser diode to a mounting base and placing a foil in front of the mirror facet; b) sealing the laser diode with a first encapsulant so that the foil acts as a dam; c) removing the foil after the first encapsulant has hardened; and d) covering the laser diode with a second encapsulant having high viscosity, leaving a narrow gap in direct contact with the mirror facet.
Claim 2
Independent Claim
86 words
A method for encapsulating a laser diode provided with a mirror facet, comprising the steps of: a) bonding the laser diode to a mounting base and placing a foil in front of the mirror facet; b) sealing the laser diode with a first encapsulant so that the foil acts as a dam; c) removing the foil after the first encapsulant has hardened; and d) covering the laser diode with a second encapsulant having high viscosity, leaving a narrow gap in direct contact with the mirror facet.
Claim 3
Dependent Claim
25 words
The method for encapsulating a laser diode as recited in claim 1, wherein step a) includes bonding the laser diode to the mounting base epi-side-up.
Claim 4
Dependent Claim
21 words
The method for encapsulating a laser diode as recited in claim 1, wherein step c) includes removing the foil by etching.
Claim 5
Dependent Claim
21 words
The method for encapsulating a laser diode as recited in claim 1, wherein step c) includes removing the foil by dissolving.
Claim 6
Dependent Claim
22 words
The method for encapsulating a laser diode as recited in claim 1, wherein step c) includes removing the foil by mechanical removal.
Claim 7
Independent Claim
119 words
A method for encapsulating a laser diode provided with a mirror facet and coupled to an optical fiber serving as an output optical port, comprising the steps of: a) bonding the laser diode to a mounting base; b) bonding the optical fiber to an alignment support on the base; c) placing a foil of narrow thickness in front of the laser diode mirror facet and pushing the optical fiber against; d) flowing an encapsulant over the mounted diode and fiber with the foil acting as a dam; and e) removing the foil after hardening of the encapsulant, leaving a gap between the laser mirror facet and the fiber, with the width of the gap defined by the foil thickness.
Claim 8
Independent Claim
119 words
A method for encapsulating a laser diode provided with a mirror facet and coupled to an optical fiber serving as an output optical port, comprising the steps of: a) bonding the laser diode to a mounting base; b) bonding the optical fiber to an alignment support on the base; c) placing a foil of narrow thickness in front of the laser diode mirror facet and pushing the optical fiber against; d) flowing an encapsulant over the mounted diode and fiber with the foil acting as a dam; and e) removing the foil after hardening of the encapsulant, leaving a gap between the laser mirror facet and the fiber, with the width of the gap defined by the foil thickness.
Claim 9
Dependent Claim
25 words
The method of encapsulating a laser diode as recited in claim 6, wherein step b) further comprises attaching the optical fiber to the alignment support.
Claim 10
Independent Claim
130 words
A method of encapsulating a laser diode having a light emitting facet coupled to an optical lens, comprising the steps of: a) bonding the laser diode on a mounting base; b) positioning a thin foil in front of the laser diode covering at least the light emitting portion thereof; c) enclosing the mounted laser diode and positioned thin foil in a sealing cap provided with a window and an opening; d) inserting the lens in the window, thereby forming an enclosed structure and pressing the lens against the thin foil; e) pivoting the enclosed structure by 90° and filling the cap with encapsulant; and f) removing the sealing cap and thin foil after hardening of the encapsulant, leaving a narrow gap between the laser light emitting facet and the lens.
Claim 11
Independent Claim
130 words
A method of encapsulating a laser diode having a light emitting facet coupled to an optical lens, comprising the steps of: a) bonding the laser diode on a mounting base; b) positioning a thin foil in front of the laser diode covering at least the light emitting portion thereof; c) enclosing the mounted laser diode and positioned thin foil in a sealing cap provided with a window and an opening; d) inserting the lens in the window, thereby forming an enclosed structure and pressing the lens against the thin foil; e) pivoting the enclosed structure by 90° and filling the cap with encapsulant; and f) removing the sealing cap and thin foil after hardening of the encapsulant, leaving a narrow gap between the laser light emitting facet and the lens.
Claim 12
Dependent Claim
37 words
The method of encapsulating a laser diode recited in claim 8, further comprising the step of: g) replacing the sealing cap to its original position and selectively filling the cap with encapsulant leaving the narrow gap unfilled.
Claim 13
Dependent Claim
35 words
The method of encapsulating a laser diode recited in claim 8, wherein step f) further comprises pouring a solvent into the sealing cap through the opening to remove the cap and dissolve the thin foil.
Claim 14
Independent Claim
25 words
The method of encapsulating a laser diode as in claims 1, 6 or 8, wherein all stated steps are carried out in a vacuum environment.
Claim 15
Dependent Claim
40 words
The method for encapsulating a semiconductor light emitting diode as recited in claim 1, characterized in that said first and second encapsulants are selected from the group consisting of cyclic alipathic epoxy resin, diglycidyl ester, polyurethan, and polymethyl methacrylate (PMMA).
Claim 16
Dependent Claim
25 words
The method for encapsulating a semiconductor light emitting diode as recited in claim 1, wherein step d) is carried out in an inert gas environment.
Claim 17
Dependent Claim
22 words
The method for encapsulating a semiconductor light emitting diode as recited in claim 1, wherein step d) is carried out in air.
Claim 18
Independent Claim
80 words
A method for encapsulating a laser diode provided with a mirror facet, comprising the steps of: a) bonding the laser diode to a mounting base and placing a foil in front of the mirror facet; b) sealing the laser diode with an encapsulant so that the foil acts as a dam; c) removing the foil after the encapsulant has hardened; and d) covering the laser diode with the encapsulant, leaving a narrow gap in direct contact with the mirror facet.
Claim 19
Independent Claim
80 words
A method for encapsulating a laser diode provided with a mirror facet, comprising the steps of: a) bonding the laser diode to a mounting base and placing a foil in front of the mirror facet; b) sealing the laser diode with an encapsulant so that the foil acts as a dam; c) removing the foil after the encapsulant has hardened; and d) covering the laser diode with the encapsulant, leaving a narrow gap in direct contact with the mirror facet.
Claim 20
Dependent Claim
13 words
The method as recited in claim 15, wherein the encapsulant has high viscosity.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-14 | 1999-11-13 | 2000-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-14 | 2003-11-13 | 2004-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-14 | 2007-11-13 | 2008-05-14 | $7700.00 | Window Closed / Lapsed |