Apparatus and method for electroplating pin grid array packaging modules

Claim 1

An apparatus for electroplating a pin grid array module equipped with a multiplicity of pins comprising: a rigid backing member, a compressible member positioned next to said rigid backing member, an electrically conductive member positioned between said compressible member and said pins on the pin grid array module when installed in place, and a pressurizing device capable of clamping said rigid backing member, said compressible member, said electrically conductive member and said pin grid array module when installed in place together with pins contacting said conductive member to a pressure sufficiently high such that when an electrical current is applied to said conductive member it flows to substantially all the pins on said pin grid array module.

Claim 2

An apparatus for electroplating a pin grid array module equipped with a multiplicity of pins comprising: a rigid backing member, a compressible member positioned next to said rigid backing member, an electrically conductive member positioned between said compressible member and said pins on the pin grid array module when installed in place, and a pressurizing device capable of clamping said rigid backing member, said compressible member, said electrically conductive member and said pin grid array module when installed in place together with pins contacting said conductive member to a pressure sufficiently high such that when an electrical current is applied to said conductive member it flows to substantially all the pins on said pin grid array module.

Claim 7

An apparatus for electroplating a pin grid array module equipped with a multiplicity of pins comprising: a rigid backing member, a compressible member positioned next to said rigid backing member, an electrically conductive member of a metal foil or a foil coated with conductive metal particles positioned between said compressible member and said pins on the pin grid array module when installed in place, and a pressurizing device capable of clamping said rigid backing member, said compressible member, said electrically conductive member and said pin grid array module when installed in place together with pins contacting said conductive member to a pressure sufficiently high such that when an electrical current is applied to said conductive member it flows to substantially all of the pins on said pin grid array module.

Claim 8

An apparatus for electroplating a pin grid array module equipped with a multiplicity of pins comprising: a rigid backing member, a compressible member positioned next to said rigid backing member, an electrically conductive member of a metal foil or a foil coated with conductive metal particles positioned between said compressible member and said pins on the pin grid array module when installed in place, and a pressurizing device capable of clamping said rigid backing member, said compressible member, said electrically conductive member and said pin grid array module when installed in place together with pins contacting said conductive member to a pressure sufficiently high such that when an electrical current is applied to said conductive member it flows to substantially all of the pins on said pin grid array module.

Claim 12

An apparatus for electroplating a pin grid array module equipped with pins comprising: a rigid backing member, a compressible member having at least one electrically conductive surface, said member being positioned next to said rigid backing member with said at least one electrically conductive surface facing away from said rigid backing member, and a pressurizing device capable of clamping said rigid backing member, said compressible member and said pin grid array module when installed in place together in such a way that the pins on said pin grid array module are facing said at least one electrically conductive surface and at such a pressure that is sufficiently high such that when an electrical current is applied to said at least one conductive surface the current flows to substantially all the pins on said pin grid array module.

Claim 13

An apparatus for electroplating a pin grid array module equipped with pins comprising: a rigid backing member, a compressible member having at least one electrically conductive surface, said member being positioned next to said rigid backing member with said at least one electrically conductive surface facing away from said rigid backing member, and a pressurizing device capable of clamping said rigid backing member, said compressible member and said pin grid array module when installed in place together in such a way that the pins on said pin grid array module are facing said at least one electrically conductive surface and at such a pressure that is sufficiently high such that when an electrical current is applied to said at least one conductive surface the current flows to substantially all the pins on said pin grid array module.

Claim 15

An apparatus for electroplating a pin grid array module equipped with pins comprising: a rigid backing member a compressible sheet having an electrically conductive coating applied on at least one of its two surfaces, said sheet being positioned next to said rigid backing member with said at least one electrically conductive surface facing away from said rigid backing member, and a pressurizing device capable of clamping said rigid backing member, said compressible sheet and said pin grid array module when installed in place together in such a way that the pins on said pin grid array module are facing said at least one electrically conductive surface and at such a pressure that is sufficiently high such that when an electrical current is applied to said at least one conductive surface the current flows substantially all of the pins on said pin grid array module.

Claim 16

An apparatus for electroplating a pin grid array module equipped with pins comprising: a rigid backing member a compressible sheet having an electrically conductive coating applied on at least one of its two surfaces, said sheet being positioned next to said rigid backing member with said at least one electrically conductive surface facing away from said rigid backing member, and a pressurizing device capable of clamping said rigid backing member, said compressible sheet and said pin grid array module when installed in place together in such a way that the pins on said pin grid array module are facing said at least one electrically conductive surface and at such a pressure that is sufficiently high such that when an electrical current is applied to said at least one conductive surface the current flows substantially all of the pins on said pin grid array module.

Claim 19

A method of electroplating a pin grid array module equipped with pins comprising the steps of: providing a rigid backing member, providing a compressible member having at least one electrically conductive surface and positioning said compressible member next to said rigid backing member with said at least one electrically conductive surface away from said backing member, providing a cavity pin grid array module equipped with a multiplicity of pins, providing a pressurizing device capable of clamping said rigid backing member, said compressible member and said pin grid array module together in such a way that the pins on said pin grid array module are contacting said at least one electrically conductive surface of said compressible member, pressurizing said rigid backing member, said compressible member and said pin grid array module that are positioned together forming an assembly to a sufficiently high pressure such that when an electrical current is applied to said at least one electrically conductive surface the current flows to substantially all the pins on said pin grid array module, and positioning said assembly in a plating bath and flowing an electrical current to said at least one electrically conductive surface on said compressible member.

Claim 20

A method of electroplating a pin grid array module equipped with pins comprising the steps of: providing a rigid backing member, providing a compressible member having at least one electrically conductive surface and positioning said compressible member next to said rigid backing member with said at least one electrically conductive surface away from said backing member, providing a cavity pin grid array module equipped with a multiplicity of pins, providing a pressurizing device capable of clamping said rigid backing member, said compressible member and said pin grid array module together in such a way that the pins on said pin grid array module are contacting said at least one electrically conductive surface of said compressible member, pressurizing said rigid backing member, said compressible member and said pin grid array module that are positioned together forming an assembly to a sufficiently high pressure such that when an electrical current is applied to said at least one electrically conductive surface the current flows to substantially all the pins on said pin grid array module, and positioning said assembly in a plating bath and flowing an electrical current to said at least one electrically conductive surface on said compressible member.

Claim 21

A method of electroplating a pin grid array module equipped with pins comprising the steps of: providing a rigid backing member, providing a compressible member which comprises an elastomeric member and an electrically conductive foil with the latter positioned facing the pins on said pin grid array module when installed in place, providing a cavity pin grid array module equipped with a multiplicity of pins, providing a pressurizing device capable of clamping said rigid backing member, said compressible member and said pin grid array module together in such a way that the pins on said pin grid array module are contacting said at least one electrically conductive surface of said compressible member, pressurizing said rigid backing member, said compressible member and said pin grid array module when installed in place that are positioned together forming an assembly to a sufficiently high pressure such that when an electrical current is applied to said at least one electrically conductive surface the current flows to substantially all the pins on said pin grid array module, and positioning said assembly in a plating bath and flowing an electrical current to said at least one electrically conductive surface on said compressible member.

Claim 22

A method of electroplating a pin grid array module equipped with pins comprising the steps of: providing a rigid backing member, providing a compressible member which comprises an elastomeric member and an electrically conductive foil with the latter positioned facing the pins on said pin grid array module when installed in place, providing a cavity pin grid array module equipped with a multiplicity of pins, providing a pressurizing device capable of clamping said rigid backing member, said compressible member and said pin grid array module together in such a way that the pins on said pin grid array module are contacting said at least one electrically conductive surface of said compressible member, pressurizing said rigid backing member, said compressible member and said pin grid array module when installed in place that are positioned together forming an assembly to a sufficiently high pressure such that when an electrical current is applied to said at least one electrically conductive surface the current flows to substantially all the pins on said pin grid array module, and positioning said assembly in a plating bath and flowing an electrical current to said at least one electrically conductive surface on said compressible member.