US5516283A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for processing a plurality of circular wafers
Assignee: Toshiba Corp
•
Filing: 1995-01-06
•
Granted: 1996-05-14
•
Expires: 2015-01-06
Abstract
Abstract An apparatus for processing a plurality of circular wafers including a tubular heater, a boat and a plurality of heat transfer bodies. The tubular heater has a heating space inside and radiates heat within the heating space. The boat is loaded inside the heating space of the tubular heater and holds the wafers in parallel. Heat transfer bodies are located between the wafers.
Inventors
- 👤 Martin Schrems
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 20:11
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0434; C; C23; C23C; C23C16/00; C23C16/44; C23C16/46; C30; C30B; C30B25/00; C30B25/02; C30B25/12; H10P72/10; H10P72/12; H10P72/127
Claims Analysis
Total Claims: 61
Claim 1
Independent Claim
70 words
An apparatus for processing a plurality of wafers each having a center region, comprising: a heat chamber; a heater surrounding said heat chamber for radiating heat toward said heat chamber; a wafer supporting means for loading into said heat chamber and for supporting the plurality of wafers; and a heat transfer body for mounting between adjacent one of the wafers for exchanging heat with the center regions of the wafers.
Claim 2
Independent Claim
70 words
An apparatus for processing a plurality of wafers each having a center region, comprising: a heat chamber; a heater surrounding said heat chamber for radiating heat toward said heat chamber; a wafer supporting means for loading into said heat chamber and for supporting the plurality of wafers; and a heat transfer body for mounting between adjacent one of the wafers for exchanging heat with the center regions of the wafers.
Claim 3
Dependent Claim
27 words
The apparatus according to claim 1, wherein said heat transfer body includes means for promoting heat exchange with an outer marginal portion of said plurality of wafers.
Claim 4
Dependent Claim
20 words
The apparatus according to claim 1, wherein said heat transfer body is mounted in spaced relationship to the adjacent wafers.
Claim 5
Dependent Claim
21 words
The apparatus according to claim 1, wherein said heat transfer body is mounted in contact with one of the adjacent wafers.
Claim 6
Independent Claim
63 words
An apparatus for processing a plurality of wafers each having a center region, comprising: a heat chamber; a heater surrounding said heat chamber for radiating heat toward said heat chamber; a plurality of heat transfer bodies arranged in parallel and loaded into said heat chamber, for respectively surpporting the wafers in parallel and for exchanging heat with the center regions of the wafers.
Claim 7
Independent Claim
63 words
An apparatus for processing a plurality of wafers each having a center region, comprising: a heat chamber; a heater surrounding said heat chamber for radiating heat toward said heat chamber; a plurality of heat transfer bodies arranged in parallel and loaded into said heat chamber, for respectively surpporting the wafers in parallel and for exchanging heat with the center regions of the wafers.
Claim 8
Dependent Claim
28 words
The apparatus according to claim 5, wherein each of said heat transfer bodies includes means for exchanging heat with an outer marginal portion of the plurality of wafers.
Claim 9
Dependent Claim
28 words
The apparatus according to claim 5, wherein each of said heat transfer bodies exchange heat with said center region of said wafers predominantly by way of thermal conduction.
Claim 10
Independent Claim
55 words
An apparatus for processing a plurality of circular wafers comprising: a tubular heater having an inner region, for radiating heat toward said inner region; a boat for loading into said inner region and for holding the plurality of wafers in parallel; and a plurality of heat transfer bodies respectively mounted for positioning between the wafers.
Claim 11
Independent Claim
55 words
An apparatus for processing a plurality of circular wafers comprising: a tubular heater having an inner region, for radiating heat toward said inner region; a boat for loading into said inner region and for holding the plurality of wafers in parallel; and a plurality of heat transfer bodies respectively mounted for positioning between the wafers.
Claim 12
Dependent Claim
36 words
The apparatus according to claim 8, wherein each of said heat transfer bodies comprises a tubular body with an outer surface facing said tubular heater and an edge surface facing a proximate one of the wafers.
Claim 13
Dependent Claim
21 words
The apparatus according to claim 9, wherein a diameter of said tubular body is smaller than a diameter of the wafer.
Claim 14
Dependent Claim
24 words
The apparatus according to claim 9, wherein each of said heat transfer bodies further comprises a plurality of fins extending toward said tubular heater.
Claim 15
Dependent Claim
39 words
The apparatus according to claim 9, wherein said boat comprises a plurality of parallel rods with a plurality of notches formed at a predetermined intervals, and further comprising connecting rods for connecting said heat transfer bodies to said rods.
Claim 16
Dependent Claim
25 words
The apparatus according to claim 9, wherein said boat comprises a rod and a connecting rod for connecting said heat transfer bodies to said rod.
Claim 17
Dependent Claim
24 words
The apparatus according to claim 11, wherein said boat comprises a rod and at least one of said fins being connected to said rods.
Claim 18
Dependent Claim
30 words
The apparatus according to claim 11, wherein said boat comprises a rod and a plurality of ring-shaped trays connected to said rod, said ring-shaped trays supporting said heat transfer bodies.
Claim 19
Dependent Claim
50 words
The apparatus according to claim 8, wherein each of said heat transfer bodies comprises a tubular body with an outer surface facing said tubular heater and an edge surface facing a proximate one of the wafers and a plate connected to said tubular body to face of the proximate wafer.
Claim 20
Dependent Claim
24 words
The apparatus according to claim 8, wherein each of said heat transfer bodies is positioned to be spaced a predetermined distance from the wafers.
Claim 21
Dependent Claim
20 words
The apparatus according to claim 9, wherein each of said heat transfer bodies is attached to one of the wafers
Claim 22
Dependent Claim
22 words
The apparatus according to claim 11, wherein said fins are so connected to said tubular body to be perpendicular to the wafers.
Claim 23
Dependent Claim
17 words
The apparatus according to claim 8, wherein each of said heat transfer body is made of SiC.
Claim 24
Dependent Claim
22 words
The apparatus according to claim 8, wherein each of said heat transfer body is made of quartz covered by a polysilicon film.
Claim 25
Dependent Claim
17 words
The apparatus according to claim 8, wherein each of said heat transfer body is made of silicon.
Claim 26
Dependent Claim
13 words
The apparatus according to claim 11, wherein said fins are made of SiC.
Claim 27
Dependent Claim
18 words
The apparatus according to claim 11, wherein said fins are made of quartz covered by a polysilicon film.
Claim 28
Dependent Claim
13 words
The apparatus according to claim 11, wherein said fins are made of silicon.
Claim 29
Independent Claim
57 words
An apparatus for processing a plurality of wafers each having a center region, comprising: a heat chamber; a heater surrounding said heat chamber for radiating heat toward said heat chamber; a wafer supporting means for loading into said heat chamber, for supporting the plurality of wafers; and a heat transfer body connected to said wafer supporting means.
Claim 30
Independent Claim
57 words
An apparatus for processing a plurality of wafers each having a center region, comprising: a heat chamber; a heater surrounding said heat chamber for radiating heat toward said heat chamber; a wafer supporting means for loading into said heat chamber, for supporting the plurality of wafers; and a heat transfer body connected to said wafer supporting means.
Claim 31
Dependent Claim
27 words
The apparatus according to claim 26, wherein said heat transfer body includes means for promoting heat exchange with an outer marginal portion of said plurality of wafers.
Claim 32
Dependent Claim
20 words
The apparatus according to claim 26, wherein said heat transfer body is mounted in spaced relationship to the adjacent wafers.
Claim 33
Dependent Claim
23 words
The apparatus according to claim 26, wherein each of said heat transfer body is mounted in contact with one of the adjacent wafers.
Claim 34
Dependent Claim
56 words
A wafer boat for carrying a plurality of wafers and for loading into a wafer processing heat chamber surrounded by a heater, comprising; wafer supporting means for supporting the plurality of wafers; and a heat transfer body connected to said wafer supporting means for exchanging heat with center region of one of the plurality of wafers.
Claim 35
Dependent Claim
56 words
A wafer boat for carrying a plurality of wafers and for loading into a wafer processing heat chamber surrounded by a heater, comprising; wafer supporting means for supporting the plurality of wafers; and a heat transfer body connected to said wafer supporting means for exchanging heat with center region of one of the plurality of wafers.
Claim 36
Dependent Claim
31 words
The wafer boat according to claim 30, wherein said heat transfer body is a tubular body and a diameter of said tubular body is smaller than a diameter of the wafer.
Claim 37
Dependent Claim
23 words
The wafer boat according to claim 31, wherein said heat transfer body further comprises a plurality of fins extending toward said tubular heater.
Claim 38
Dependent Claim
23 words
The wafer boat according to claim 31, wherein said heat transfer body is positioned to be spaced a predetermined distance from the wafers.
Claim 39
Dependent Claim
20 words
The wafer boat according to claim 31, wherein said heat transfer body is in contact with one of the wafers
Claim 40
Dependent Claim
16 words
The wafer boat according to claim 31, wherein said heat transfer body is made of SiC.
Claim 41
Dependent Claim
20 words
The wafer boat according to claim 31, wherein said heat transfer body is made of quartz covered with poly silicon.
Claim 42
Dependent Claim
16 words
The wafer boat according to claim 31, wherein said heat transfer body is made of silicon.
Claim 43
Dependent Claim
38 words
A dummy wafer inserted between a plurality of circular wafers and held by a wafer boat comprising: a circular plate having a diameter similar to the circular wafers; and a tubular body connected perpendicularly to said circular plate.
Claim 44
Dependent Claim
38 words
A dummy wafer inserted between a plurality of circular wafers and held by a wafer boat comprising: a circular plate having a diameter similar to the circular wafers; and a tubular body connected perpendicularly to said circular plate.
Claim 45
Dependent Claim
36 words
The dummy wafer according to claim 38, wherein said tubular body has an upper body connected to a front side of said circular plate and a lower body connected to a backside of said circular plate.
Claim 46
Dependent Claim
42 words
The dummy wafer according to claim 39, wherein the diameter of said upper body is larger than the diameter of said lower body and said circular plate has a hole of a diameter the same as the diameter of said lower body.
Claim 47
Dependent Claim
19 words
The dummy wafer according to claim 38, wherein said tubular body and said circular plate are made from SiC.
Claim 48
Dependent Claim
22 words
The dummy wafer according to claim 38, wherein said tubular body and said circular plate are made from quartz covered with polysilicon.
Claim 49
Dependent Claim
19 words
The dummy wafer according to claim 38, wherein said tubular body and said circular plate are made from silicon.
Claim 50
Dependent Claim
23 words
The dummy wafer according to claim 38, wherein said tubular body is made from SiC and said circular plate is made from quartz.
Claim 51
Dependent Claim
29 words
The dummy wafer according to claim 38, wherein said tubular body is made from quartz covered with a layer of polysilicon and said circular plate is made from quartz.
Claim 52
Dependent Claim
23 words
The dummy wafer according to claim 38, wherein said tubular body is made from silicon and said circular plate is made from quartz.
Claim 53
Dependent Claim
23 words
The dummy wafer according to claim 38, wherein said circular plate has an opening for reducing the thermal mass of the dummy wafer.
Claim 54
Independent Claim
66 words
A method for heat processing a plurality of wafers each having a center region comprising the steps of: forming a stack of said plurality of wafers and a plurality of heat transfer bodies, the stack having an axis; radiating heat toward the axis to heat said heat transfer bodies and wafers; and exchanging heat between said heat transfer bodies and said center regions of said wafers;
Claim 55
Independent Claim
66 words
A method for heat processing a plurality of wafers each having a center region comprising the steps of: forming a stack of said plurality of wafers and a plurality of heat transfer bodies, the stack having an axis; radiating heat toward the axis to heat said heat transfer bodies and wafers; and exchanging heat between said heat transfer bodies and said center regions of said wafers;
Claim 56
Independent Claim
58 words
A method for heat processing a plurality of wafers comprising the steps of: stacking a plurality of heat transfer bodies and a plurality of said wafers to make a wafer stack; loading said wafer stack into a heating space of a tubular heater; radiating heat within said heating space; and unloading said wafer stack from said tubular heater.
Claim 57
Independent Claim
58 words
A method for heat processing a plurality of wafers comprising the steps of: stacking a plurality of heat transfer bodies and a plurality of said wafers to make a wafer stack; loading said wafer stack into a heating space of a tubular heater; radiating heat within said heating space; and unloading said wafer stack from said tubular heater.
Claim 58
Dependent Claim
39 words
The method according to claim 49, wherein said plurality of heat transfer bodies and said plurality of said circular wafers are stacked in a manner that certain distances are kept between said circular wafers and said heat transfer bodies.
Claim 59
Dependent Claim
35 words
The method according to claim 49, wherein said plurality of heat transfer bodies and said plurality of said circular wafers are stacked in a manner that said wafers are attached to said heat transfer bodies.
Claim 60
Dependent Claim
39 words
The method according to claim 49, wherein said plurality of heat transfer bodies and said plurality of said circular wafers are stacked in a manner that each of said heat transfer bodies is inserted between every two circular wafers.
Claim 61
Dependent Claim
32 words
The method according to claim 49, wherein said heat transfer bodies and said circular wafers are stacked in a manner that each heat transfer body is inserted between every three circular wafers.
References Cited (Backward Citations)
US5297956A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-05-14 | 1999-11-13 | 2000-05-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-05-14 | 2003-11-13 | 2004-05-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-05-14 | 2007-11-13 | 2008-05-14 | $7700.00 | Window Closed / Lapsed |