Air mixer cool plate

Claim 1

A semiconductor module system comprising: fan means for generating an air stream extending in a first direction; a series of semiconductor modules positioned in spaced relation in a selected planar array, said modules being supported adjacent said fan means so that said modules are positioned in said air stream and the plane of said planar array extends substantially parallel to said first direction; a flat plate made from a material having a thermal conductivity ranging from 1 to 500 watts/meter-K, said plate having top and bottom surfaces and a thickness ranging from 0.1 mm to 5 mm, said bottom surface of said plate engaging said modules; a plurality of first and second apertures extending through said plate, at least one of said first apertures being positioned before each module, as measured in said first direction along said top surface of said plate, and at least one of said second apertures being positioned after each module, as measured in said first direction along said top surface of said plate; and a plurality of deflectors attached to said plate extending upwardly from said top surface of said plate about 0.25 mm to 5 mm, one of said plurality of deflectors being positioned immediately after a corresponding respective one of said second apertures, as measured in said first direction along said top surface of said plate.