Solid-state imaging device having temperature sensor

Claim 1

A solid state imaging device comprising: a package including: a package main body, a light receiving glass plate through which light passes, a buffer member fixed to said light receiving glass plate and said package main body, said buffer member having a thermal expansion coefficient substantially equal to that of said light receiving glass plate; a semiconductor chip arranged in said package and facing said glass plate, said semiconductor chip including: a semiconductor substrate, a first temperature sensor formed in a first region of said semiconductor substrate, for detecting the temperature of said semiconductor chip; an image sensor formed in a second region of said semiconductor substrate, for receiving the light passing through said glass plate to convert the light into video signals; an electronic cooling element disposed in said package and fixed to said package, said electronic cooling element including: a cool portion facing said semiconductor chip, for cooling said semiconductor chip, and a hot portion for generating heat; a heat radiation member for radiating the heat received from said hot portion, being fixed to said package and said hot portion; a second temperature sensor fixed to said heat radiation member, for detecting the temperature of said hot portion; an OP amplifier electrically connected to said first temperature sensor; and a temperature control circuit electrically connected to said OP amplifier and said electronic cooling element, wherein said temperature control circuit controls a current fed to said electronic cooling element.