US5499447A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for manufacturing a printed circuit board having electrodes on end surface of substrate
Assignee: NEC Toppan Circuit Solutions Toyama Inc
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Filing: 1994-12-19
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Granted: 1996-03-19
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Expires: 2014-12-19
Abstract
Abstract The method for manufacturing a printed circuit board having an electrode on an end surface of a substrate has the steps of forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated, filling in the hole with copper paste, forming a circuit pattern such that a copper foil portion remains only in one half of the hole, and etching an exposed region of the substrate. No mechanical process is used in the formation of the end face through-hole so that it is free from the development of burrs in or peeling off of a conductive layer.
Inventors
- 👤 Tomoo Murakami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 00:36
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/403; H05K3/0011; H05K3/0017; H05K3/002; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K3/4038; H05K3/4053; H05K3/4069; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
75 words
A method for manufacturing a printed circuit board having an electrode on an end surface of a substrate, said method comprising the steps of: forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated; filling in said hole with copper paste; forming a circuit pattern such that a copper foil portion remains only in one half of said hole; and etching away an exposed region of said substrate.
Claim 2
Independent Claim
75 words
A method for manufacturing a printed circuit board having an electrode on an end surface of a substrate, said method comprising the steps of: forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated; filling in said hole with copper paste; forming a circuit pattern such that a copper foil portion remains only in one half of said hole; and etching away an exposed region of said substrate.
Claim 3
Dependent Claim
22 words
The method for manufacturing a printed circuit board according to claim 1, in which said laminate board is a multi-layer laminate board.
Claim 4
Dependent Claim
42 words
The method for manufacturing a printed circuit board according to claim 1, in which said laminate board is made of epoxy material and said step of etching is carried out by repetition of dipping in permanganic acid solution and hydrofluoric acid solution.
Claim 5
Dependent Claim
41 words
The method for manufacturing a printed circuit board according to claim 1, in which said laminate board is made of polyimide material and said step of etching is carried out by repetition of dipping in caustic soda and hydrofluoric acid solution.
Claim 6
Independent Claim
92 words
A method for manufacturing a printed circuit board having an electrode on an end surface of a substrate, said method comprising the steps of: forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated; filling in said hole with copper paste; forming a circuit pattern such that a copper foil portion remains only in one half of said hole; etching away an exposed region of said substrate; and copper plating said copper foil portion and said copper paste portion for these portions to be integrated.
Claim 7
Independent Claim
92 words
A method for manufacturing a printed circuit board having an electrode on an end surface of a substrate, said method comprising the steps of: forming a hole at a predetermined position of a laminate board whose two surfaces are copper plated; filling in said hole with copper paste; forming a circuit pattern such that a copper foil portion remains only in one half of said hole; etching away an exposed region of said substrate; and copper plating said copper foil portion and said copper paste portion for these portions to be integrated.
Claim 8
Dependent Claim
22 words
The method for manufacturing a printed circuit board according to claim 5, in which said laminate board is a multi-layer laminate board.
Claim 9
Dependent Claim
42 words
The method for manufacturing a printed circuit board according to claim 5, in which said laminate board is made of epoxy material and said step of etching is carried out by repetition of dipping in permanganic acid solution and hydrofluoric acid solution.
Claim 10
Dependent Claim
41 words
The method for manufacturing a printed circuit board according to claim 5, in which said laminate board is made of polyimide material and said step of etching is carried out by repetition of dipping in caustic soda and hydrofluoric acid solution.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-03-19 | 1999-09-18 | 2000-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-03-19 | 2003-09-18 | 2004-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-03-19 | 2007-09-18 | 2008-03-19 | $7700.00 | Window Closed / Lapsed |